Abstract: Certain embodiments provide a method for manufacturing a solid-state imaging device including: forming a sensor chip fixed to a supporting substrate by a first adhesive; peeling off the sensor chip from the supporting substrate by softening the first adhesive; and fixing the peeled off sensor chip onto a curved surface of a mounting body to allow the sensor chip to be curved along the curved surface.

Abstract: A surface light-emitting unit installed on a floor or wall of a structure is able to emit light from its surface for unique illumination effects. A surface light-emitting unit includes a transparent glass plate that can transmit light; a light-conducting plate installed below the glass plate; a light-emitting means having multiple light-emitting diodes of different colors and installed on the side face of the light-conducting plate; a light-diffusing/reflecting member installed below the light-conducting plate that diffuses and reflects the light; an emission-color selection means for selecting the light-emitting diode to be illuminated or blinked; a casing for providing the transparent glass plate at the top opening; a casing for installing above components; and a connection part that can be connected to other surface light-emitting unit installed adjacently.

Abstract: Problems to Be Solved

Abstract: A filler for filling in defects or hollow portions of bones to coalesce with the bone tissues is provided which comprises powders of a calcium phosphate compound having the apatite crystalline structure of each crystallite size of 400 .ANG. or larger and of each crystal grain size of 3 .mu.m or smaller, said calcium phosphate compound being represented by the following general formula of Ca.sub.m (PO.sub.4).sub.n OH (1.33.ltoreq.m/n.ltoreq.1.95), and said powders being fluidized or plasticized.

Abstract: A filler for filling in defects or hollow portions of bones to coalesce with the bone tissues is provided which comprises powders of a calcium phosphate compound having the apatite crystalline structure of each crystal grain size of from 50 .orgate. to 10 microns and represented by the following general formula of Ca.sub.m (PO.sub.4).sub.n OH (1.33.ltoreq.m/n.ltoreq.1.95); and said powders being adapted for filling in a fluidized or plasticized state. A method of treating a bone with the filler is also provided wherein at least a portion of said filler is filled in to reach the bone-marrow cavity of said bone.

Abstract: A method of manufacturing a semiconductor device, which comprises the steps of depositing an electric insulation layer on the surface of a semiconductor substrate in which a deeper base region and a shallower base region are diffused; forming in the electric insulation layer an opening for diffusing an emitter region in the deeper base region; coating the shallower base region with a covering layer in which oxygen and an oxygen compound are diffused at a smaller constant than in the electric insulation layer; carrying out heat treatment in an oxidizing atmosphere to diffuse an emitter region in the deeper base region and also to deposit an oxide layer on these portions of the main surface of the substrate which are not coated with the covering layer; and diffusing an emitter region in the shallower base region, and whereby the current-amplifying properties of the respective transistors whose base and emitter regions are diffused with different depths can be easily controlled with high precision.

Abstract: Disclosed herein is a protection circuit for a power amplifier. The protection circuit comprises a current detecting section for detecting a level of a load current of the power amplifier, a voltage detecting section for detecting a level of a load voltage across a load, an AND-gate circuit responsive to outputs of the current detecting section and the voltage detecting section for detecting a short-circuit of the load, and a control section responsive to an output of the AND-gate circuit for disconnecting the load from the amplifier.

Abstract: Disclosed is an automatic noise reduction system of FM stereo receiver wherein the input level and carrier frequency deviation of an FM stereo transmission signal received by an antenna are detected and, when at least either one of the input level and carrier frequency deviation decreases, the separation between first and second audio outputs of a stereo demodulator for demodulating the FM stereo transmission signal is decreased and simultaneously high frequency components on the first and second audio outputs are attenuated.