Patents by Inventor Shinobu Watanabe

Shinobu Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200361110
    Abstract: A glass panel unit manufacturing method includes a punching step and a pillar mounting step. In the punching step, a punch punches at least one of a plurality of portions from a base material of a sheet to form at least one pillar. Each of the plurality of portions is surrounded by a corresponding one of a plurality of loop-shaped grooves in the base material. In the pillar mounting step, the at least one pillar is mounted on a surface of a first substrate including a glass pane.
    Type: Application
    Filed: August 5, 2020
    Publication date: November 19, 2020
    Inventors: Takeshi SHIMIZU, Hiroyuki ABE, Masataka NONAKA, Kazuya HASEGAWA, Eiichi URIU, Haruhiko ISHIKAWA, Tasuku ISHIBASHI, Hiroshi TAKAHASHI, Shinobu WATANABE
  • Patent number: 10766160
    Abstract: A glass panel unit manufacturing method includes a punching step and a pillar mounting step. In the punching step, a punch punches at least one of a plurality of portions from a base material of a sheet to form at least one pillar. Each of the plurality of portions is surrounded by a corresponding one of a plurality of loop-shaped grooves in the base material. In the pillar mounting step, the at least one pillar is mounted on a surface of a first substrate including a glass pane.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: September 8, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takeshi Shimizu, Hiroyuki Abe, Masataka Nonaka, Kazuya Hasegawa, Eiichi Uriu, Haruhiko Ishikawa, Tasuku Ishibashi, Hiroshi Takahashi, Shinobu Watanabe
  • Publication number: 20190270215
    Abstract: A glass panel unit manufacturing method includes a punching step and a pillar mounting step. In the punching step, a punch punches at least one of a plurality of portions from a base material of a sheet to form at least one pillar. Each of the plurality of portions is surrounded by a corresponding one of a plurality of loop-shaped grooves in the base material. In the pillar mounting step, the at least one pillar is mounted on a surface of a first substrate including a glass pane.
    Type: Application
    Filed: November 10, 2017
    Publication date: September 5, 2019
    Inventors: Takeshi SHIMIZU, Hiroyuki ABE, Masataka NONAKA, Kazuya HASEGAWA, Eiichi URIU, Haruhiko ISHIKAWA, Tasuku ISHIBASHI, Hiroshi TAKAHASHI, Shinobu WATANABE
  • Patent number: 10356339
    Abstract: A frame memory and a computing processing unit are provided within an image pickup device having a first semiconductor substrate and a second semiconductor substrate mutually stacked and electrically directly connected, and digital image data having undergone resize processing are output from the image pickup device.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: July 16, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Makoto Ise, Shinobu Watanabe
  • Publication number: 20180103214
    Abstract: A frame memory and a computing processing unit are provided within an image pickup device having a first semiconductor substrate and a second semiconductor substrate mutually stacked and electrically directly connected, and digital image data having undergone resize processing are output from the image pickup device.
    Type: Application
    Filed: May 24, 2016
    Publication date: April 12, 2018
    Inventors: Makoto Ise, Shinobu Watanabe
  • Patent number: 9942454
    Abstract: An image capturing apparatus includes an image sensor in which a plurality of pixels are arrayed two-dimensionally, a driving unit that bends the image sensor, and a control unit that controls the driving unit to bend the image sensor at a predetermined curvature. The control unit controls the driving unit so that stress acting on the image sensor in the case where an image capture operation is not carried out is lower than stress acting on the image sensor in the case where an image capture operation is carried out.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: April 10, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventor: Shinobu Watanabe
  • Patent number: 9609223
    Abstract: An image pickup element generates an AF evaluation value to be used for image-pickup in accordance with an image signal corresponding to a voltage signal obtained from a first pixel group among a plurality of pixels. The image pickup element further outputs an image signal corresponding to a voltage signal obtained from a second pixel group among the plurality of pixels as a live-view display signal for image display. In accordance with the AF evaluation value, a control unit controls a mechanical optical unit having a focus lens and performs live-view display on an image display unit in accordance with the live-view display signal.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: March 28, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Naoto Ogushi, Shinobu Watanabe
  • Patent number: 9571742
    Abstract: Evaluation values relating to image capture are detected from at least two out of a plurality of images having different exposure amounts, which are used to generate a composite image. From a plurality of detected evaluation values relating to image capture, an evaluation value relating to image capture used to control an operation of an image capture apparatus is selected under a predetermined operation, thereby improving the detection accuracy of evaluation values relating to image capture in an HDR moving image capture operation.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: February 14, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventor: Shinobu Watanabe
  • Publication number: 20160212315
    Abstract: An image capturing apparatus includes an image sensor in which a plurality of pixels are arrayed two-dimensionally, a driving unit that bends the image sensor, and a control unit that controls the driving unit to bend the image sensor at a predetermined curvature. The control unit controls the driving unit so that stress acting on the image sensor in the case where an image capture operation is not carried out is lower than stress acting on the image sensor in the case where an image capture operation is carried out.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 21, 2016
    Inventor: Shinobu Watanabe
  • Patent number: 9241109
    Abstract: An image capturing apparatus sequentially obtains images obtained by image capturing of a subject and detects the angle of view of each obtained image at the time of image capturing. The apparatus sequentially selects a plurality of images, of the obtained images, which are used to generate one frame. The apparatus combines the selected images to generate a moving image including an obtained composite image as a frame. If the selected images differ in angle of view at the time of image capturing, the apparatus changes all the selected images into images having the same angle of view and the same number of pixels by adjusting angles of view of selected images which differ in angle of view from one reference image of the selected images, and combines the images.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: January 19, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shinobu Watanabe
  • Publication number: 20140253792
    Abstract: Evaluation values relating to image capture are detected from at least two out of a plurality of images having different exposure amounts, which are used to generate a composite image. From a plurality of detected evaluation values relating to image capture, an evaluation value relating to image capture used to control an operation of an image capture apparatus is selected under a predetermined operation, thereby improving the detection accuracy of evaluation values relating to image capture in an HDR moving image capture operation.
    Type: Application
    Filed: February 20, 2014
    Publication date: September 11, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Shinobu Watanabe
  • Publication number: 20140184866
    Abstract: An image pickup element generates an AF evaluation value to be used for image-pickup in accordance with an image signal corresponding to a voltage signal obtained from a first pixel group among a plurality of pixels. The image pickup element further outputs an image signal corresponding to a voltage signal obtained from a second pixel group among the plurality of pixels as a live-view display signal for image display. In accordance with the AF evaluation value, a control unit controls a mechanical optical unit having a focus lens and performs live-view display on an image display unit in accordance with the live-view display signal.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Naoto Ogushi, Shinobu Watanabe
  • Patent number: 8634003
    Abstract: An image sensing apparatus comprises an image sensor configured to convert an optical image of a subject into image signals by photoelectric conversion. The image sensing apparatus acquires information for estimating a magnitude of a dark current in the image sensor, and, on the basis of the acquired information, selects any one of vertical linear noise correction processing, black subtraction processing, and normal readout processing in which neither the vertical linear noise correction processing or the black subtraction processing is carried out. Then, the image sensing apparatus carries out the vertical linear noise correction processing to correct a vertical linear noise in an image if the vertical linear noise correction processing is selected, or the black subtraction processing to correct a vertical linear noise and a fixed pattern noise in an image if the black subtraction processing is selected.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: January 21, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventor: Shinobu Watanabe
  • Publication number: 20130286254
    Abstract: An image capturing apparatus sequentially obtains images obtained by image capturing of a subject and detects the angle of view of each obtained image at the time of image capturing. The apparatus sequentially selects a plurality of images, of the obtained images, which are used to generate one frame. The apparatus combines the selected images to generate a moving image including an obtained composite image as a frame. If the selected images differ in angle of view at the time of image capturing, the apparatus changes all the selected images into images having the same angle of view and the same number of pixels by adjusting angles of view of selected images which differ in angle of view from one reference image of the selected images, and combines the images.
    Type: Application
    Filed: April 16, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Shinobu Watanabe
  • Publication number: 20110215824
    Abstract: The voltage application probe and the voltage measurement probe are connected to the voltage application pad and the voltage measurement pad of the semiconductor device. The voltage application pad and the voltage measurement pad are connected by the conductor, measuring the voltage applied to the voltage application pad through the voltage measurement probe. The voltage compensation circuit in the voltage development device operates to make the voltage applied to the voltage application pad equal to the set voltage for the voltage development device. Even when the resistance between the voltage application probe and the voltage application pad increases, the accurate setting voltage is applied to the voltage application pad.
    Type: Application
    Filed: May 12, 2011
    Publication date: September 8, 2011
    Inventor: Shinobu WATANABE
  • Patent number: 7960987
    Abstract: The voltage application probe and the voltage measurement probe are connected to the voltage application pad and the voltage measurement pad of the semiconductor device. The voltage application pad and the voltage measurement pad are connected by the conductor, measuring the voltage applied to the voltage application pad through the voltage measurement probe. The voltage compensation circuit in the voltage development device operates to make the voltage applied to the voltage application pad equal to the set voltage for the voltage development device. Even when the resistance between the voltage application probe and the voltage application pad increases, the accurate setting voltage is applied to the voltage application pad.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: June 14, 2011
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Shinobu Watanabe
  • Publication number: 20110115952
    Abstract: An image sensing apparatus comprises an image sensor configured to convert an optical image of a subject into image signals by photoelectric conversion. The image sensing apparatus acquires information for estimating a magnitude of a dark current in the image sensor, and, on the basis of the acquired information, selects any one of vertical linear noise correction processing, black subtraction processing, and normal readout processing in which neither the vertical linear noise correction processing or the black subtraction processing is carried out. Then, the image sensing apparatus carries out the vertical linear noise correction processing to correct a vertical linear noise in an image if the vertical linear noise correction processing is selected, or the black subtraction processing to correct a vertical linear noise and a fixed pattern noise in an image if the black subtraction processing is selected.
    Type: Application
    Filed: November 3, 2010
    Publication date: May 19, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Shinobu Watanabe
  • Publication number: 20090322363
    Abstract: The voltage application probe and the voltage measurement probe are connected to the voltage application pad and the voltage measurement pad of the semiconductor device. The voltage application pad and the voltage measurement pad are connected by the conductor, measuring the voltage applied to the voltage application pad through the voltage measurement probe. The voltage compensation circuit in the voltage development device operates to make the voltage applied to the voltage application pad equal to the set voltage for the voltage development device. Even when the resistance between the voltage application probe and the voltage application pad increases, the accurate setting voltage is applied to the voltage application pad.
    Type: Application
    Filed: July 15, 2009
    Publication date: December 31, 2009
    Inventor: Shinobu WATANABE
  • Patent number: 7579851
    Abstract: The voltage application probe (54) and the voltage measurement probe (56) are connected to the voltage application pad (74) and the voltage measurement pad (76) of the semiconductor device (70). The voltage application pad (74) and the voltage measurement pad (76) are connected by the conductor (78), measuring the voltage applied to the voltage application pad (74) through the voltage measurement probe (56). The voltage compensation circuit (14) in the voltage development device (10) operates to make the voltage applied to the voltage application pad (74) equal to the set voltage for the voltage development device (10). Even when the resistance between the voltage application probe (54) and the voltage application pad (74) increases, the accurate setting voltage is applied to the voltage application pad (74).
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: August 25, 2009
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Shinobu Watanabe
  • Publication number: 20080084226
    Abstract: The voltage application probe (54) and the voltage measurement probe (56) are connected to the voltage application pad (74) and the voltage measurement pad (76) of the semiconductor device (70). The voltage application pad (74) and the voltage measurement pad (76) are connected by the conductor (78), measuring the voltage applied to the voltage application pad (74) through the voltage measurement probe (56). The voltage compensation circuit (14) in the voltage development device (10) operates to make the voltage applied to the voltage application pad (74) equal to the set voltage for the voltage development device (10). Even when the resistance between the voltage application probe (54) and the voltage application pad (74) increases, the accurate setting voltage is applied to the voltage application pad (74).
    Type: Application
    Filed: November 1, 2007
    Publication date: April 10, 2008
    Inventor: Shinobu Watanabe