Abstract: Provided is a polycarbonate-polyorganosiloxane copolymer, including: a polyorganosiloxane block (A-1) including a specific structural unit; and a polycarbonate block (A-2) formed of a specific repeating unit, wherein the polycarbonate-polyorganosiloxane copolymer satisfies the following condition (A) or (B): condition (A): a hexane extraction amount of the polycarbonate-polyorganosiloxane copolymer is 150 ppm or less; and condition (B): average weights of polyorganosiloxane blocks in polycarbonate-polyorganosiloxane copolymers obtained by separating the polycarbonate-polyorganosiloxane copolymer with a gel permeation chromatograph satisfy a specific expression.

Abstract: Provided is a polycarbonate-polyorganosiloxane copolymer, which is produced by using a diol monomer (a1) and a polyorganosiloxane (a2) satisfying the following condition, including: a polyorganosiloxane block (A-1) including a specific repeating unit; and a polycarbonate block (A-2) formed of a specific repeating unit: a mixture, which is obtained by bringing the diol monomer (a1), the polyorganosiloxane (a2), a carbonic acid diester, and a basic catalyst present at the same amount ratio as that at a time of production of the polycarbonate-polyorganosiloxane copolymer into contact with each other at from 100° C. to 250° C. for from 0.5 hour to 5 hours, has a haze value of 30 or less measured under conditions of 23° C. and an optical path length of 10 mm in conformity with ISO 14782:1999.

Abstract: Provided is a polycarbonate-polyorganosiloxane copolymer, including a polyorganosiloxane block (A-1) including a specific structural unit and a polycarbonate block (A-2) formed of a specific repeating unit.

Abstract: Provided is a method of producing a polycarbonate-based resin composition, including mixing an aliphatic polycarbonate-based resin (A) containing a specific repeating unit (A-1), and at least one kind of aromatic thermoplastic resin (S) selected from the group consisting of an aromatic polycarbonate-based resin (B) containing a polycarbonate block formed of a specific repeating unit, an aromatic polyester-based resin (C) having a specific structural unit, and a polyarylate resin (D) having a specific structural unit in the presence of a transesterification catalyst at a temperature at which the resin components melt.

Abstract: The method for producing a resin composition of the present invention includes a step of obtaining a lignin-containing solution that contains a solubilized lignin prepared through a treatment of separating lignin in a lignin-containing solution and a solvent, and a step of adding a resin to the lignin-containing solution to thereby obtain a lignin/resin-containing solution. Also, the method for producing a resin composition of the present invention includes a step of mixing the lignin/resin-containing solution with at least one solvent selected from water and a hydrocarbon having a dipole moment of 0.25 d or less. The lignin-containing resin molded article of the present invention uses the resin composition obtained according to the production method of the present invention.

Abstract: Provided is a method of producing a polycarbonate-based resin composition, including mixing an aliphatic polycarbonate-based resin (A) containing a specific repeating unit (A-1), and at least one kind of aromatic thermoplastic resin (S) selected from the group consisting of an aromatic polycarbonate-based resin (B) containing a polycarbonate block formed of a specific repeating unit, an aromatic polyester-based resin (C) having a specific structural unit, and a polyarylate resin (D) having a specific structural unit in the presence of a transesterification catalyst at a temperature at which the resin components melt.

Abstract: A polycarbonate-based resin composition including: an aliphatic polycarbonate-based resin (A) containing a specific repeating unit; and a glass filler (B) having specific composition and having a total content of Li2O, Na2O, K2O, and Cs2O of 5 mass % or less, wherein the refractive index of the aliphatic polycarbonate-based resin (A) for light having a wavelength of 589.3 nm is 1.480 or more and 1.520 or less, wherein the refractive index of the glass filler (B) for light having a wavelength of 589.3 nm is 1.485 or more and 1.520 or less, and wherein a difference in refractive index between the aliphatic polycarbonate-based resin (A) and the glass filler (B) is 0.003 or less for light having a wavelength of 486.1 nm, is 0.001 or less for light having a wavelength of 589.3 nm, and is 0.001 or less for light having a wavelength of 656.3 nm.

Abstract: The method for producing a resin composition of the present invention includes a step of obtaining a lignin-containing solution that contains a solubilized lignin prepared through a treatment of separating lignin in a lignin-containing solution and a solvent, and a step of adding a resin to the lignin-containing solution to thereby obtain a lignin/resin-containing solution. Also, the method for producing a resin composition of the present invention includes a step of mixing the lignin/resin-containing solution with at least one solvent selected from water and a hydrocarbon having a dipole moment of 0.25 d or less. The lignin-containing resin molded article of the present invention uses the resin composition obtained according to the production method of the present invention.

Abstract: Provided is a method of producing a purified lignin, including: treating a plant biomass in a first solvent mixture formed of water and a first organic solvent under specific conditions; subjecting a solid fraction insoluble in a first solution mixture and the first solution mixture to solid-liquid separation after the treatment; mixing the first solution mixture from which the insoluble solid fraction has been separated, and a second organic solvent excluding the first organic solvent and having a dipole moment of 0.25 d or less to provide a second solution mixture; and subjecting a solid fraction insoluble in the second solution mixture to solid-liquid separation to extract the purified lignin in a liquid phase of the second solution mixture.

Abstract: A thermoplastic resin composition of the invention contains a cellulose-containing solid material obtained after heat treatment of a botanical biomass as a raw material in a mixed solvent of water and at least one alcohol selected from aliphatic alcohols having 4 to 8 carbon atoms, and a thermoplastic resin. Accordingly, a thermoplastic resin composition can be provided, which, as compared with a case of incorporating conventional cellulose nanofibers or lignocellulose nanofibers in a resin composition, simplifies the production step, improves miscibility with a thermoplastic resin and improves thermal stability.

Abstract: A thermosetting resin composition according to the present invention contains: purified lignin obtained by treating a herbaceous biomass as a raw material under the following conditions in a first solvent that is a mixed solvent of water and at least one type of alcohol selected from aliphatic alcohols having 4 to 8 carbon atoms, subsequently removing the alcohol from the alcohol phase that is separated at the temperature at which the first solvent separates into two phases to give lignin, adding a second solvent that is an organic solvent alone or a mixed solvent of the organic solvent and water to the resultant lignin, and removing the second solvent from the solution in which the lignin is dissolved in the second solvent; and a lignin-reactive compound that has a functional group capable of reacting with the purified lignin. Condition A: the concentration of the raw material to be charged into the mixed solvent is 1% by mass or more and 50% by mass or less. Condition B: the treatment temperature is 100° C.

Abstract: A conductive composition including: a solvent; a ?-conjugated conductive polymer having a chlorine content of 0.6 wt % or less; and a compound represented by the following formula (1); wherein the ?-conjugated conductive polymer is dissolved and the weight ratio of the compound represented by the formula (1) to the ?-conjugated conductive polymer (compound represented by the formula (1)/?-conjugated conductive polymer) is 0.01 to 22.0.

Abstract: A conductive composition including: a solvent; a ?-conjugated conductive polymer having a chlorine content of 0.6 wt % or less; and a compound represented by the following formula (1); wherein the ?-conjugated conductive polymer is dissolved and the weight ratio of the compound represented by the formula (1) to the ?-conjugated conductive polymer (compound represented by the formula (1)/?-conjugated conductive polymer) is 0.01 to 22.0.

Abstract: Provided is a cured resin of an adamantane derivative having a specific structure, which has excellent optical properties such as transparency and (long-term) light stability, long-term heat resistance, dielectric constant, and mechanical properties, and which can be utilized suitably in the field of electronic and optical materials.

Abstract: Provided is a syndiotactic polystyrenic resin composition, of which the resin moiety comprises any of (A) a syndiotactic styrenic polymer (B) a rubber-like elastomer having affinity for the component (A), (E) a polymer having compatibility with or affinity for the component (A) and having a polar group, (F) a thermoplastic resin except (A), and (G) a polyolefin having MI of at most 25, and which contains from 10 to 350 parts by weight, relative to 100 parts by weight of the resin moiety, of (C) a fibrous filler, and from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120. Moldings of the composition have good impact resistance and warp little, still having good heat resistance and other good properties intrinsic to styrenic resins.

Abstract: A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound.

Abstract: A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound.

Abstract: A flame retarded polystyrenic resin composition comprising: (A) 100 parts by weight of a resin which comprises (a-1) 1 to 100% by weight of a styrenic polymer having the syndiotactic configuration, (a-2) 0 to 10% by weight of a polymer having compatibility or affinity with component (a-1) and having a polar group, and (a-3) 0 to 99% by weight of a thermoplastic resin and/or a rubbery elastomer other than components (a-1) and (a-2), (B) 2 to 100 parts by weight of a brominated diphenyl compound, (C) 0.5 to 50 parts by weight of at least one compound selected from antimony oxides, sodium antimonate, iron oxides, and zinc oxide, the ratio by weight of component (B) to component (C) being in the range of 1 to 10; a flame retarded polystyrenic resin composition comprising (D) an inorganic filler in addition to the above components; and a molded article of a polystyrenic resin prepared by using the compositions as a material.

Abstract: There are provided a prepreg for a printed circuit board which comprises a glass cloth impregnated with a flame retardative resin composition comprising a (A) resin composed of a (a) styrenic polymer having syndiotactic configuration, a (b) polymer having compatibility with or affinity for the component (a) and further containing polar group, and a (c) thermoplastic resin other than the components (a) and (b) and/or a rubbery elastomer; a (B) halogenated polystyrene in which the amount of halogen atoms contained in halogen compounds generated under specific conditions is at most 1000 ppm by weight; a (C) flame retardant aid; an (D) organic filler or inorganic filler; and the above glass cloth, and also a substrate for printed circuit which comprises the prepreg or a laminate comprising a plurality of the prepregs laminated on each other, at least one side of the prepreg or laminate being laminated with a metallic layer.

Abstract: A polyarylene sulfide resin composition comprising (A) a polyarylene sulfide resin, (B) silica, (C) (cl) a terpolymeric elastomer made from ethylene, an .alpha., .beta.-unsaturated carboxylate, and maleic acid anhydride and/or (c2) a graft composite elastomer which is a vinyl monomer grafted composite elastomer of polyorganosiloxane and alkyl (meth)acrylate, and (D) a mercaptosilane coupling agent, at a specific proportion. The composition exhibits superior mechanical strength and high fluidity and can be used effectively for sealing ICs and various electronic parts.