Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Abstract: Disclosed herein is an information processing apparatus including: a computation block configured, so as to make an error of a VBV occupation amount of a VBV occupation amount target picture next to base data that is variable-length encoded data to be replaced by replacing data greater than an actual value, to compute the VBV occupation amount of the VBV occupation amount target picture from a VBV delay of the VBV occupation amount target picture; and an encoding block configured to variable-length encode the replacing data on the basis of the VBV occupation amount of the VBV occupation amount target picture computed by the computation block.

Abstract: In an editing apparatus; overwriting data used for insertion editing on base data, which is segmented into each picture including data having a predetermined unit of data amount X, and includes variable-length encoded real data, is variable-length encoded; each picture is sequentially obtained as a target picture, and regarding the target picture, if an amount of the overwriting data is equal to X, the overwriting data is handled as insertion data as it is, otherwise, insertion data is created by adding stuffing data to the overwriting data so that the amount of the overwriting data can be equal to X; a filler having the same amount as a filler of the base data is added to the insertion data having the same total amount as the real data; and the resultant insertion data is added onto the base data.

Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Abstract: Disclosed herein is an information processing apparatus including: a computation block configured, so as to make an error of a VBV occupation amount of a VBV occupation amount target picture next to base data that is variable-length encoded data to be replaced by replacing data greater than an actual value, to compute the VBV occupation amount of the VBV occupation amount target picture from a VBV delay of the VBV occupation amount target picture; and an encoding block configured to variable-length encode the replacing data on the basis of the VBV occupation amount of the VBV occupation amount target picture computed by the computation block.

Abstract: In an editing apparatus; overwriting data used for insertion editing on base data, which is segmented into each picture including data having a predetermined unit of data amount X, and includes variable-length encoded real data, is variable-length encoded; each picture is sequentially obtained as a target picture, and regarding the target picture, if an amount of the overwriting data is equal to X, the overwriting data is handled as insertion data as it is, otherwise, insertion data is created by adding stuffing data to the overwriting data so that the amount of the overwriting data can be equal to X; a filler having the same amount as a filler of the base data is added to the insertion data having the same total amount as the real data; and the resultant insertion data is added onto the base data.

Abstract: A coding apparatus and method is disclosed by which quantization index data can be determined without referring to a virtual buffer capacity initialized in response to a scene change. ME residual information is acquired first, and it is discriminated whether or not the ME residual information is higher than a threshold value. If it is discriminated that the ME residual information is higher than the threshold value, then the initial buffer capacity of a virtual buffer is updated. On the other hand, if it is discriminated that the ME residual information is equal to or lower than the threshold value, then it is discriminated whether or not the picture being currently processed is a picture next to a scene change or is a next picture of the same type as that of a picture with which a scene change has occurred. If it is discriminated that the picture being processed is a picture next to a scene change or a next picture of the same type, then the initial buffer capacity is calculated and updated.

Abstract: A coding apparatus and method is disclosed by which quantization index data can be determined without referring to a virtual buffer capacity initialized in response to a scene change. ME residual information is acquired first, and it is discriminated whether or not the ME residual information is higher than a threshold value. If it is discriminated that the ME residual information is higher than the threshold value, then the initial buffer capacity of a virtual buffer is updated. On the other hand, if it is discriminated that the ME residual information is equal to or lower than the threshold value, then it is discriminated whether or not the picture being currently processed is a picture next to a scene change or is a next picture of the same type as that of a picture with which a scene change has occurred. If it is discriminated that the picture being processed is a picture next to a scene change or a next picture of the same type, then the initial buffer capacity is calculated and updated.