Patents by Inventor Shinpei IRIE

Shinpei IRIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminate, method of peeling laminate, and method of manufacturing flexible device
    Patent number: 10008670
    Abstract: A method of peeling a laminate according to the disclosure includes: forming a first adhesive layer on a first substrate, the first adhesive layer having adhesive force that satisfies the following Expression (1) and one or both of the following Expressions (2) and (3); firmly attaching a second substrate onto the first adhesive layer; forming a first functional layer on the second substrate; and peeling off the first substrate from the second substrate.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: June 26, 2018
    Assignee: JOLED, Inc.
    Inventors: Kenichi Izumi, Keisuke Shimokawa, Shin Akasaka, Hiroyuki Abe, Shinpei Irie, Takatoshi Saito
  • LAMINATE, METHOD OF PEELING LAMINATE, AND METHOD OF MANUFACTURING FLEXIBLE DEVICE
    Publication number: 20170012202
    Abstract: A method of peeling a laminate according to the disclosure includes: forming a first adhesive layer on a first substrate, the first adhesive layer having adhesive force that satisfies the following Expression (1) and one or both of the following Expressions (2) and (3); firmly attaching a second substrate onto the first adhesive layer; forming a first functional layer on the second substrate; and peeling off the first substrate from the second substrate.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 12, 2017
    Applicant: JOLED INC.
    Inventors: Kenichi IZUMI, Keisuke SHIMOKAWA, Shin AKASAKA, Hiroyuki ABE, Shinpei IRIE, Takatoshi SAITO