Patents by Inventor Shinsa Hamada

Shinsa Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7863374
    Abstract: Self-curable water-based solid adhesives of this invention include the following components (A), (B), (C), and (D): (A) an anionic-group-containing polymer terminally having an alkoxysilyl group, the polymer being a reaction product of a compound (A1) containing no anionic group and having plural isocyanate-reactive groups, a compound (A2) having an anionic group and plural isocyanate-reactive groups, a polyisocyanate compound (A3), and an alkoxysilane compound (A4) containing an isocyanate-reactive group; (B) a basic compound; (C) water; and (D) a gelling agent. The self-curable water-based solid adhesives of the present invention can be applied with good workability, have good fitting after attachment, have good adhesion to plastics, metals and glass and exhibit excellent heat resistance and water resistance after curing. They are highly safe to humans and the environment. They also have excellent shape retention and slidability and can be easily applied.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: January 4, 2011
    Assignee: Konishi Co., Ltd.
    Inventors: Syunsuke Shibahara, Kuniharu Harada, Shinsa Hamada, Kenji Ueji, Kenji Idemoto
  • Publication number: 20080119607
    Abstract: Self-curable water-based solid adhesives of this invention include the following components (A), (B), (C), and (D): (A) an anionic-group-containing polymer terminally having an alkoxysilyl group, the polymer being a reaction product of a compound (A1) containing no anionic group and having plural isocyanate-reactive groups, a compound (A2) having an anionic group and plural isocyanate-reactive groups, a polyisocyanate compound (A3), and an alkoxysilane compound (A4) containing an isocyanate-reactive group; (B) a basic compound; (C) water; and (D) a gelling agent. The self-curable water-based solid adhesives of the present invention can be applied with good workability, have good fitting after attachment, have good adhesion to plastics, metals and glass and exhibit excellent heat resistance and water resistance after curing. They are highly safe to humans and the environment. They also have excellent shape retention and slidability and can be easily applied.
    Type: Application
    Filed: May 16, 2006
    Publication date: May 22, 2008
    Inventors: Syunsuke Shibahara, Kuniharu Harada, Shinsa Hamada, Kenji Ueji, Kenji Idemoto
  • Patent number: 7084203
    Abstract: Self-curable water-based solid adhesives of this invention include the following components (A), (B), (C), and (D): (A) an anionic-group-containing polymer terminally having an alkoxysilyl group, the polymer being a reaction product of a compound (A1) containing no anionic group and having plural isocyanate-reactive groups, a compound (A2) having an anionic group and plural isocyanate-reactive groups, a polyisocyanate compound (A3), and an alkoxysilane compound (A4) containing an isocyanate-reactive group; (B) a basic compound; (C) water; and (D) a gelling agent. The self-curable water-based solid adhesives of the present invention can be applied with good workability, have good fitting after attachment, have good adhesion to plastics, metals and glass and exhibit excellent heat resistance and water resistance after curing. They are highly safe to humans and the environment. They also have excellent shape retention and slidability and can be easily applied.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: August 1, 2006
    Assignee: Konishi Co., Ltd.
    Inventors: Syunsuke Shibahara, Kuniharu Harada, Shinsa Hamada, Kenji Ueji, Kenji Idemoto
  • Publication number: 20040132864
    Abstract: Self-curable water-based solid adhesives of this invention include the following components (A), (B), (C), and (D):
    Type: Application
    Filed: October 6, 2003
    Publication date: July 8, 2004
    Inventors: Syunsuke Shibahara, Kuniharu Harada, Shinsa Hamada, Kenji Ueji, Kenji Idemoto