Patents by Inventor Shinsaku Sawa
Shinsaku Sawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8769803Abstract: Provided is a method of manufacturing a loudspeaker including assembling a magnetic circuit and a frame. In the step of assembling the magnetic circuit and the frame, parallelism between a plate and a damper attachment portion of the frame is ensured by bringing an upper portion of the plate and the damper attachment portion of the frame into contact with a jig. In addition, perpendicularity between a magnetic gap and the damper attachment portion of the frame is ensured by bringing an outer circumferential side portion of the plate of the magnetic gap and an inner circumferential side portion of the yoke into contact with the jig. The magnetic circuit and the frame are assembled in such a state. With such a manufacturing method, it is possible to achieve a superior loudspeaker capable of reducing a gap defect while being downsized and having increased maximum input power.Type: GrantFiled: March 30, 2011Date of Patent: July 8, 2014Assignee: Panasonic CorporationInventors: Toshiyuki Koike, Shinsaku Sawa, Tadashi Akiyama
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Publication number: 20120317792Abstract: Provided is a method of manufacturing a loudspeaker including assembling a magnetic circuit and a frame. In the step of assembling the magnetic circuit and the frame, parallelism between a plate and a damper attachment portion of the frame is ensured by bringing an upper portion of the plate and the damper attachment portion of the frame into contact with a jig. In addition, perpendicularity between a magnetic gap and the damper attachment portion of the frame is ensured by bringing an outer circumferential side portion of the plate of the magnetic gap and an inner circumferential side portion of the yoke into contact with the jig. The magnetic circuit and the frame are assembled in such a state. With such a manufacturing method, it is possible to achieve a superior loudspeaker capable of reducing a gap defect while being downsized and having increased maximum input power.Type: ApplicationFiled: March 30, 2011Publication date: December 20, 2012Applicant: PANASONIC CORPORATIONInventors: Toshiyuki Koike, Shinsaku Sawa, Tadashi Akiyama
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Patent number: 7315628Abstract: The present invention provides a diaphragm for a loudspeaker which suppresses divided resonance and shows a stable sound-pressure-frequency characteristic, and a loudspeaker using the diaphragm. The diaphragm includes three or more thick parts (11c) of odd numbers formed radially from a center part to an outer periphery, and semi thick part (11d) formed between the thick parts so as to become thinner gradually from the outer periphery to the center part. Web shaped thin part (11e) is formed at an inner part of the semi thick part.Type: GrantFiled: October 14, 2004Date of Patent: January 1, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ryo Kuribayashi, Shinsaku Sawa
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Patent number: 7079665Abstract: A loudspeaker has a magnetic circuit, a plastic frame to be coupled with the magnetic circuit, a voice coil disposed in a magnetic gap of the magnetic circuit, and a diaphragm connected with the voice coil. The frame and the magnetic circuit are coupled together by an elastic fastener provided on the frame. The frame and yoke are coupled together by fitting a plurality of elastic fasteners provided on a circle on a bottom surface of the frame with a yoke of the magnetic circuit. The elastic fastener can also be a clip section provided on a circle on the bottom surface of the frame. The frame and magnetic circuit are coupled together by the clip section and an extension provided along an outer circumference of the magnetic circuit.Type: GrantFiled: September 12, 2001Date of Patent: July 18, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Katsuya Shimomura, Shinsaku Sawa, Shuji Ido, Shigeru Nishida
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Publication number: 20060062421Abstract: The present invention provides a diaphragm for a loudspeaker which suppresses divided resonance and shows a stable sound-pressure-frequency characteristic, and a loudspeaker using the diaphragm. The diaphragm includes three or more thick parts (11c) of odd numbers formed radially from a center part to an outer periphery, and semi thick part (11d) formed between the thick parts so as to become thinner gradually from the outer periphery to the center part. Web shaped thin part (11e) is formed at an inner part of the semi thick part.Type: ApplicationFiled: October 14, 2004Publication date: March 23, 2006Applicant: Matsushita Electric Industrial Co., ltd.Inventors: Ryo Kuribayashi, Shinsaku Sawa
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Patent number: 6987860Abstract: A speaker mounting structure is provided in which a speaker frame (11) is fixed to a mounting panel (P) by engaging latching hooks (24L, 24R) and a latching clip (26) provided on the speaker frame (11) with mounting holes (22, 23L, 23R) formed in the inner panel (P) of an automobile door. The latching hooks (24L, 24R) and the latching clip (26) are disposed inside the outer peripheral edges of annular seal members (16, 17) that are bonded to a mounting surface (11a) of the speaker frame (11) and are in intimate contact with the inner panel (P). As a result, even when water infiltrates to the speaker (C) side from an opening (21) or the mounting holes (22, 23L, 23R) of the inner panel (P), the seal members (16, 17) can block the water and prevent it from flowing to the passenger compartment side. It is thereby possible to reliably avoid ingress of water.Type: GrantFiled: April 16, 2001Date of Patent: January 17, 2006Assignees: Honda Giken Kogyo Kabushiki Kaisha, Matsushita Electric Industrial Co., Ltd., Tohoku Pioneer CorporationInventors: Takayuki Kurihara, Hiroyuki Tanno, Shinsaku Sawa, Katsuya Shimomura
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Publication number: 20040105567Abstract: A speaker mounting structure is provided in which a speaker frame (11) is fixed to a mounting panel (P) by engaging latching hooks (24L, 24R) and a latching clip (26) provided on the speaker frame (11) with mounting holes (22, 23L, 23R) formed in the inner panel (P) of an automobile door. The latching hooks (24L, 24R) and the latching clip (26) are disposed inside the outer peripheral edges of annular seal members (16, 17) that are bonded to a mounting surface (11a) of the speaker frame (11) and are in intimate contact with the inner panel (P). As a result, even when water infiltrates to the speaker (C) side from an opening (21) or the mounting holes (22, 23L, 23R) of the inner panel (P), the seal members (16, 17) can block the water and prevent it from flowing to the passenger compartment side. It is thereby possible to reliably avoid ingress of water.Type: ApplicationFiled: November 18, 2003Publication date: June 3, 2004Inventors: Takayuki Kurihara, Hiroyuki Tanno, Shinsaku Sawa, Katsuya Shimomura
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Publication number: 20020044671Abstract: A loudspeaker comprising: a magnetic circuit; a plastic frame to be coupled with the magnetic circuit; a voice coil disposed in a magnetic gap of the magnetic circuit; and a diaphragm connected with the voice coil. The frame and the magnetic circuit are coupled together by an elastic fastener provided on the frame. In one exemplary embodiment of the present invention, frame and yoke are coupled together by fitting a plurality of elastic fasteners provided on a circle on the bottom surface of the frame with a yoke of the magnetic circuit. In another exemplary embodiment, the elastic fastener is a clip section provided on a circle on the bottom surface of said frame. The frame and magnetic circuit are coupled together by the clip section and an extension provided along the outer circumference of the magnetic circuit. Despite a downsized magnetic circuit, the frame and the yoke can be coupled easily together in a loudspeaker in accordance with the present invention.Type: ApplicationFiled: September 12, 2001Publication date: April 18, 2002Inventors: Katsuya Shimomura, Shinsaku Sawa, Shuji Ido, Shigeru Nishida
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Patent number: D519496Type: GrantFiled: March 16, 2005Date of Patent: April 25, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Amada, Shinsaku Sawa
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Patent number: D523417Type: GrantFiled: March 16, 2005Date of Patent: June 20, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Amada, Shinsaku Sawa
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Patent number: D523844Type: GrantFiled: March 15, 2005Date of Patent: June 27, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Amada, Shinsaku Sawa
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Patent number: D524289Type: GrantFiled: March 15, 2005Date of Patent: July 4, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Amada, Shinsaku Sawa
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Patent number: D524290Type: GrantFiled: March 15, 2005Date of Patent: July 4, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Amada, Shinsaku Sawa
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Patent number: D524300Type: GrantFiled: March 16, 2005Date of Patent: July 4, 2006Assignee: Matsushita Electric Industrial, Co., Ltd.Inventors: Hiroyuki Amada, Shinsaku Sawa
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Patent number: D526311Type: GrantFiled: March 16, 2005Date of Patent: August 8, 2006Assignee: Matsushita Electric Industrial Co., LtdInventors: Hiroyuki Amada, Shinsaku Sawa
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Patent number: D526312Type: GrantFiled: March 17, 2005Date of Patent: August 8, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ryo Kuribayashi, Hiroyuki Amada, Shinsaku Sawa
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Patent number: D529898Type: GrantFiled: March 17, 2005Date of Patent: October 10, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ryo Kuribayashi, Hiroyuki Amada, Shinsaku Sawa
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Patent number: D529899Type: GrantFiled: March 16, 2005Date of Patent: October 10, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Amada, Shinsaku Sawa