Patents by Inventor Shinsei MIZUTA
Shinsei MIZUTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10535813Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.Type: GrantFiled: October 25, 2018Date of Patent: January 14, 2020Assignee: ROHM CO., LTD.Inventors: Shinsei Mizuta, Satohiro Kigoshi, Takaaki Masaki
-
Patent number: 10522743Abstract: The present invention provides a Hall element module for achieving miniaturization. A Hall element module includes a Hall element having an element surface and an element back surface, a terminal portion electrically connected to the Hall element and separated from the Hall element as viewed in a z direction, and a resin package covering at least one portion of each of the Hall element and the terminal. The resin package has a rectangular shape with four sides along the x direction and the y direction as viewed in the z direction. The terminal portion includes a terminal back surface facing the z direction and exposed from the resin package. An end edge of the terminal back surface includes a terminal back surface inclined portion opposed to the Hall element and inclined with respect to the x direction and the y direction as viewed in the z direction.Type: GrantFiled: October 5, 2018Date of Patent: December 31, 2019Assignee: ROHM CO., LTD.Inventors: Satohiro Kigoshi, Shinsei Mizuta
-
Patent number: 10312285Abstract: An LED illuminator includes an LED chip and an opaque resin member. The LED chip includes a support substrate, a semiconductor layer disposed on the obverse surface of the support substrate, an electrode formed on the reverse surface of the support substrate. The obverse surface of the support substrate has a peripheral edge portion exposed from the semiconductor layer. The opaque resin member covers at least apart of the side surface of the support substrate while exposing the peripheral edge portion of the obverse surface of the support substrate.Type: GrantFiled: September 26, 2016Date of Patent: June 4, 2019Assignee: ROHM CO., LTD.Inventor: Shinsei Mizuta
-
Publication number: 20190067560Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.Type: ApplicationFiled: October 25, 2018Publication date: February 28, 2019Inventors: Shinsei MIZUTA, Satohiro KIGOSHI, Takaaki MASAKI
-
Publication number: 20190044057Abstract: The present invention provides a Hall element module for achieving miniaturization. A Hall element module includes a Hall element having an element surface and an element back surface, a terminal portion electrically connected to the Hall element and separated from the Hall element as viewed in a z direction, and a resin package covering at least one portion of each of the Hall element and the terminal. The resin package has a rectangular shape with four sides along the x direction and the y direction as viewed in the z direction. The terminal portion includes a terminal back surface facing the z direction and exposed from the resin package. An end edge of the terminal back surface includes a terminal back surface inclined portion opposed to the Hall element and inclined with respect to the x direction and the y direction as viewed in the z direction.Type: ApplicationFiled: October 5, 2018Publication date: February 7, 2019Inventors: SATOHIRO KIGOSHI, SHINSEI MIZUTA
-
Patent number: 10153424Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.Type: GrantFiled: August 8, 2017Date of Patent: December 11, 2018Assignee: ROHM CO., LTD.Inventors: Shinsei Mizuta, Satohiro Kigoshi, Takaaki Masaki
-
Patent number: 10128434Abstract: The present invention provides a Hall element module for achieving miniaturization. A Hall element module includes a Hall element having an element surface and an element back surface, a terminal portion electrically connected to the Hall element and separated from the Hall element as viewed in a z direction, and a resin package covering at least one portion of each of the Hall element and the terminal. The resin package has a rectangular shape with four sides along the x direction and the y direction as viewed in the z direction. The terminal portion includes a terminal back surface facing the z direction and exposed from the resin package. An end edge of the terminal back surface includes a terminal back surface inclined portion opposed to the Hall element and inclined with respect to the x direction and the y direction as viewed in the z direction.Type: GrantFiled: December 6, 2017Date of Patent: November 13, 2018Assignee: ROHM CO., LTD.Inventors: Satohiro Kigoshi, Shinsei Mizuta
-
Publication number: 20180166624Abstract: The present invention provides a Hall element module for achieving miniaturization. A Hall element module includes a Hall element having an element surface and an element back surface, a terminal portion electrically connected to the Hall element and separated from the Hall element as viewed in a z direction, and a resin package covering at least one portion of each of the Hall element and the terminal. The resin package has a rectangular shape with four sides along the x direction and the y direction as viewed in the z direction. The terminal portion includes a terminal back surface facing the z direction and exposed from the resin package. An end edge of the terminal back surface includes a terminal back surface inclined portion opposed to the Hall element and inclined with respect to the x direction and the y direction as viewed in the z direction.Type: ApplicationFiled: December 6, 2017Publication date: June 14, 2018Inventors: Satohiro Kigoshi, Shinsei Mizuta
-
Publication number: 20180053891Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.Type: ApplicationFiled: August 8, 2017Publication date: February 22, 2018Inventors: Shinsei MIZUTA, Satohiro KIGOSHI, Takaaki MASAKI
-
Publication number: 20170092690Abstract: An LED illuminator includes an LED chip and an opaque resin member. The LED chip includes a support substrate, a semiconductor layer disposed on the obverse surface of the support substrate, an electrode formed on the reverse surface of the support substrate. The obverse surface of the support substrate has a peripheral edge portion exposed from the semiconductor layer. The opaque resin member covers at least apart of the side surface of the support substrate while exposing the peripheral edge portion of the obverse surface of the support substrate.Type: ApplicationFiled: September 26, 2016Publication date: March 30, 2017Inventor: Shinsei MIZUTA