Patents by Inventor Shinsuke Hirakawa

Shinsuke Hirakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060105243
    Abstract: A current collector effective for reductions in weight and thickness. The current collector produced by forming a conductive layer having a surface electric resistance not higher than 1.3 ?/cm on the surface of a resin film and then forming an electrolytic plating layer having a thickness of at least 0.3 ?m per one side, characterized in that the surface electric resistance is not higher than 40 m ?/cm after electrolytic plating and following expression is satisfied; Y1+Y2+Y3?0.8×((X1+X2+X3)×Y3/X3) where, X1: thickness of resin film (?m), X2: thickness of conductive layer (?m), X3: thickness of plating layer (?m), Y1: weight of resin film (mg/cm2), Y2: weight of conductive layer (mg/cm2), and Y3: weight of plating layer (mg/cm2).
    Type: Application
    Filed: August 29, 2002
    Publication date: May 18, 2006
    Applicant: Toyo Kohan Co. Ltd.
    Inventors: Takaaki Okamura, Shinsuke Hirakawa, Hiroshi Doi, Kenichi Takagi