Patents by Inventor Shinsuke Inui

Shinsuke Inui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • World band radio frequency front end module, system and method of power sensing thereof
    Patent number: 10643962
    Abstract: The present disclosure relates to a World Band Radio Frequency Power Amplifier and a World Band Radio Frequency Front End Module. The World Band Power Amplifier can contain at least one broadband power amplifier connected to a switch which can direct an RF input signal to a plurality of transmission paths, each transmission path configured for a different frequency. A power amplifier module has a forward power (FP) sensor and a reflective power (RP) sensor. A Voltage Standing Wave Ratio (VSWR) Processing Control Circuit (VPCC) is configured to tune the matching antenna for optimal radio frequency operation and protect the power amplifier in conjunction with the power amplifier protection controller. The World Band RFFE Module is more integrated version of the World Band Power Amplifier that can contain broadband RF PA(s), switches, logic controls, filters, duplexers and other active and passive components.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: May 5, 2020
    Assignee: Micro Mobio Corporation
    Inventors: Ikuroh Ichitsubo, Shinsuke Inui, Guan-Wu Wang, Weiping Wang, Zlatko Filipovic, Kanya Kubota
  • World band frequency front end module, system and method thereof
    Patent number: 10027287
    Abstract: The present disclosure relates to a World Band Radio Frequency Power Amplifier and a World Band Radio Frequency Front End Module. The World Band Power Amplifier can contain at least one broadband power amplifier connected to a switch which can direct an RF input signal to a plurality of transmission paths, each transmission path configured for a different frequency. The World Band RFFE Module is more integrated version of the World Band Power Amplifier that can contain broadband RF PA(s), switches, logic controls, filters, duplexers and other active and passive components. The module may also include a thermal protection system capable of effecting operation of the broadband power amplifier.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: July 17, 2018
    Assignee: MICRO MOBIO CORPORATION
    Inventors: Ikuroh Ichitsubo, Shinsuke Inui, Guan-Wu Wang, Weiping Wang, Zlatko Filipovic
  • World band radio frequency front end module, system and method thereof
    Patent number: 9515615
    Abstract: The present disclosure relates to a World Band Radio Frequency Power Amplifier and a World Band Radio Frequency Front End Module. The World Band Power Amplifier can contain at least one broadband power amplifier connected to a switch which can direct an RF input signal to a plurality of transmission paths, each transmission path configured for a different frequency. The World Band RFFE Module is more integrated version of the World Band Power Amplifier that can contain broadband RF PA(s), switches, logic controls, filters, duplexers and other active and passive components.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: December 6, 2016
    Assignee: MICRO MOBIO CORPORATION
    Inventors: Ikuroh Ichitsubo, Shinsuke Inui, Guan-Wu Wang, Weiping Wang, Zlatko Filipovic
  • World band radio frequency front end module, system and method thereof
    Patent number: 9178555
    Abstract: The present disclosure relates to a World Band Radio Frequency Power Amplifier and a World Band Radio Frequency Front End Module. The World Band Power Amplifier can contain at least one broadband power amplifier connected to a switch which can direct an RF input signal to a plurality of transmission paths, each transmission path configured for a different frequency. The World Band RFFE Module is more integrated version of the World Band Power Amplifier that can contain broadband RF PA(s), switches, logic controls, filters, duplexers and other active and passive components.
    Type: Grant
    Filed: June 16, 2013
    Date of Patent: November 3, 2015
    Assignee: Micro Mobio Corporation
    Inventors: Ikuroh Ichitsubo, Shinsuke Inui, Guan-Wu Wang, Weiping Wang, Zlatko Aurelio Filipovic
  • World Band Radio Frequency Front End Module, System And Method Thereof
    Publication number: 20140235184
    Abstract: The present disclosure relates to a World Band Radio Frequency Power Amplifier and a World Band Radio Frequency Front End Module. The World Band Power Amplifier can contain at least one broadband power amplifier connected to a switch which can direct an RF input signal to a plurality of transmission paths, each transmission path configured for a different frequency. The World Band RFFE Module is more integrated version of the World Band Power Amplifier that can contain broadband RF PA(s), switches, logic controls, filters, duplexers and other active and passive components.
    Type: Application
    Filed: June 16, 2013
    Publication date: August 21, 2014
    Applicant: Micro Mobio Corporation
    Inventors: Ikuroh Ichitsubo, Shinsuke Inui, Guan-Wu Wang, Weiping Wang, ZLatko Aurelio Filipovic
  • Multi-port multi-band RF switch
    Patent number: 7254371
    Abstract: Systems and methods are disclosed for sharing a network with two switching devices forming a single pole double throw (SPDT) switch. Two SPDT switches can also be used in a double pole double throw (DPDT) configuration that shares a network, thus reducing component count and die size.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: August 7, 2007
    Assignee: Micro-Mobio, Inc.
    Inventors: Shinsuke Inui, Ikuroh Ichitsubo
  • Multi-port multi-band RF switch
    Publication number: 20060035614
    Abstract: Systems and methods are disclosed for sharing a network with two switching devices forming a single pole double throw (SPDT) switch. Two SPDT switches can also be used in a double pole double throw (DPDT) configuration that shares a network, thus reducing component count and die size.
    Type: Application
    Filed: August 16, 2004
    Publication date: February 16, 2006
    Inventors: Shinsuke Inui, Ikuroh Ichitsubo