Abstract: The present disclosure provides a method for manufacturing a metallized film, the metallized film including: a dielectric film; a vapor-deposited metal electrode formed on a surface of the dielectric film. The vapor-deposited metal electrode includes a plurality of parts which have mutually different resistance values. The method includes a step of letting oil adhere to a region in the surface of the dielectric film on which the vapor-deposited metal electrode is to be formed and then bringing a vapor of metal into contact with the surface of the dielectric film. A quantity per unit area of the oil adhering to a part of the region on which a part of the vapor-deposited metal electrode having a relatively low resistance value is to be formed is smaller than a quantity per unit area of the oil adhering to another part of the region on which another part of the vapor-deposited metal electrode having a relatively high resistance value is to be formed.

Abstract: The present disclosure provides a method for manufacturing a metallized film, the metallized film including: a dielectric film; a vapor-deposited metal electrode formed on a surface of the dielectric film. The vapor-deposited metal electrode includes a plurality of parts which have mutually different resistance values. The method includes a step of letting oil adhere to a region in the surface of the dielectric film on which the vapor-deposited metal electrode is to be formed and then bringing a vapor of metal into contact with the surface of the dielectric film. A quantity per unit area of the oil adhering to a part of the region on which a part of the vapor-deposited metal electrode having a relatively low resistance value is to be formed is smaller than a quantity per unit area of the oil adhering to another part of the region on which another part of the vapor-deposited metal electrode having a relatively high resistance value is to be formed.

Abstract: A capacitor (1) using a flexible substrate (2) includes a hole portion (6a) formed in a dielectric (6) to connect an upper electrode (7) to an external leader electrode (4). At least part of the hole portion (6a) extends from its lower end to upper end at an inclination between 0.1 and 20° with respect to a top surface of the external leader electrode (4). Then, an upper end corner of an inclined wall surface of the upper electrode (7), which inclines along the hole portion (6a) of the dielectric (6), has a downward inclination between 0.1 and 20°. A lower end corner of the inclined wall surface of the upper electrode (7), which inclines along the hole portion of the dielectric (6), has an upward inclination between 0.1 and 20°. As a result, stress concentration on the corners of the upper electrode (7) is drastically reduced to prevent the upper electrode (7) from cracking.

Abstract: A capacitor (1) using a flexible substrate (2) includes a hole portion (6a) formed in a dielectric (6) to connect an upper electrode (7) to an external leader electrode (4). At least part of the hole portion (6a) extends from its lower end to upper end at an inclination between 0.1 and 20° with respect to a top surface of the external leader electrode (4). Then, an upper end corner of an inclined wall surface of the upper electrode (7), which inclines along the hole portion (6a) of the dielectric (6), has a downward inclination between 0.1 and 20°. A lower end corner of the inclined wall surface of the upper electrode (7), which inclines along the hole portion of the dielectric (6), has an upward inclination between 0.1 and 20°. As a result, stress concentration on the corners of the upper electrode (7) is drastically reduced to prevent the upper electrode (7) from cracking.

Abstract: A film capacitor which has a plurality of electrodes; at least one layer of dielectric member made of organic material and interposed between each pair of neighboring electrodes; impreganated members made of organic material and disposed in a gap between the electrode and the dielectric layer or between the dielectric layers; and end electrodes applied respectively to opposite electrode drawout end faces and connected alternately with the electrodes. The dielectric layers and the impregnated members alternate with each other and have respective end faces. The end portions of the dielectric layers and impregnated members are indented to provide respective indented end face.