Abstract: A manufacturing method for an electronic component that includes a providing a base member on a first main surface of a first board, sandwiching the base member and a joining member paste between the first main surface of the first board and a transfer main surface of a transfer board, forming a joining member joined with the base member while the joining member paste is sandwiched by the first board and the transfer board, and peeling off the transfer board from the joining member joined with the base member.

Abstract: A method of manufacturing a piezoelectric resonator unit that includes mounting a piezoelectric resonator on a base member, the piezoelectric resonator including a piezoelectric element and a pair of excitation electrodes facing each other with the piezoelectric element interposed therebetween, each of the pair of excitation electrodes including an underlying layer containing chromium and a surface layer on the underlying layer; forming chromium oxide on the surface layer of each of the pair of excitation electrodes by oxidizing chromium diffused from the underlying layer such that an amount of the chromium oxide is larger on the surface layer of the excitation electrode on a base member side than on the surface layer of the excitation electrode on a lid member side among the pair of excitation electrodes; and joining a lid member to the base member such that the piezoelectric resonator is between the base member and the lid member.

Abstract: An electronic component that includes a first board having a bow-shaped first main surface and a joining member disposed on the first main surface of the first board and having a top edge configured to be joined with a second board, wherein the top edge of the joining member is disposed in a plane.

Abstract: A manufacturing method for an electronic component that includes a providing a base member on a first main surface of a first board, sandwiching the base member and a joining member paste between the first main surface of the first board and a transfer main surface of a transfer board, forming a joining member joined with the base member while the joining member paste is sandwiched by the first board and the transfer board, and peeling off the transfer board from the joining member joined with the base member.

Abstract: A crystal unit is provided with a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along the outer circumferential edge of the upper surface and which is provided on the lower surface of the substrate by joining joining terminals provided along the outer circumferential edge of the lower surface of the substrate and its joining pads, a crystal element which is mounted on electrode pads which are provided on the upper surface of the substrate in a region surrounded by the frame, a thermosensitive element which is mounted on connection pads which are provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: A crystal unit is provided with a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along the outer circumferential edge of the upper surface and which is provided on the lower surface of the substrate by joining terminals provided along the outer circumferential edge of the lower surface of the substrate and its joining pads, a crystal element which is mounted on electrode pads which are provided on the upper surface of the substrate in a region surrounded by the frame, a thermosensitivel element which is mounted on connection pads which are provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.