Patents by Inventor Shinsuke Kishi

Shinsuke Kishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080118697
    Abstract: A stamper for making a read-only optical disk includes an irregular pattern for forming embossed pits based on recording information and an irregular pattern for forming dummy irregularities. The irregular pattern for the embossed pits is arranged in a region corresponding to an information area for recording information in the read-only optical disk. The irregular pattern for the dummy irregularities is arranged in a region corresponding to an area between the information area and the outer periphery of the disk.
    Type: Application
    Filed: May 14, 2007
    Publication date: May 22, 2008
    Applicant: SONY CORPORATION
    Inventors: Hideki Takahashi, Masatake Yagi, Kiyoshi Takii, Shinji Minegishi, Shinsuke Kishi
  • Patent number: 7318232
    Abstract: A large capacity recording medium is formed by bonding at least two disc-shaped recording plates to provide a structure adapted to absorb any manufacturing errors in the direction of the height of the recording medium.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: January 8, 2008
    Assignees: Sony Corporation, Sony Disc & Digital Solutions Inc.
    Inventors: Shin Masuhara, Shinsuke Kishi
  • Patent number: 7303718
    Abstract: A space 12 is formed at a tip portion of a nozzle 1 so as to decrease a thermal transfer of the nozzle 1. Alternatively, a center portion of one of a semi-spherically protruded surface of the tip portion of the nozzle 1 and a semi-spherically recessed surface of a sprue bush protrudes so that the radius of curvature of one semi-spherical surface is the same as the radius of curvature of the other semi-spherical surface. As a result, since the nozzle 1 and the sprue bush 2 are surface-contacted, heat of the tip portion of the nozzle 1 absorbed to the sprue bush 2 is increased. Thus, the temperature of the tip portion of the nozzle 1 can be lowered easily. After the resin material injected into the molding cavity 11 is cooled, when the sprue portion is removed from the fixed die, a tip portion of a rod-shaped protrusion portion of the sprue can be properly cut.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: December 4, 2007
    Assignee: Sony Disc & Digital Solutions Inc.
    Inventors: Shinsuke Kishi, Osamu Matsuura
  • Patent number: 7101171
    Abstract: A resin ring 51 is press-fitted into a grove portion formed in an inner periphery surface of an interlocking ring 4. The resin ring 51 is made of a hard resin such as Teflon. The resin ring 51 as a low frictional lubricative member is interposed between the interlock ring 4 and an outer periphery ring 3. In addition, a cavity 6 as a closed space is formed between a stamper 1b as a molding surface of a fixed side mirror 1 and a mirror side molding surface 2b of a moving side mirror 2. While the moving side mirror 2 is being press-contracted to the fixed side mirror 1, when a resin material is filled into the cavity 6, the outer periphery ring 3 is slidably held in a groove of the moving side mirror 2 with predetermined clearances. In the interlock ring 4, a plurality of openings 4a which relieve gas produced by the disc resin material filled into the cavity 6 are formed.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: September 5, 2006
    Assignee: Sony Disc & Digital Solutions Inc.
    Inventors: Osamu Matsuura, Kazuhiro Miura, Hideaki Yoshimura, Shinsuke Kishi
  • Publication number: 20050226137
    Abstract: A large capacity recording medium is formed by bonding at least two disc-shaped recording plates to provide a structure adapted to absorb any manufacturing errors in the direction of the height of the recording medium.
    Type: Application
    Filed: February 24, 2005
    Publication date: October 13, 2005
    Applicants: SONY CORPORATION, SONY DISC TECHNOLOGY INC.
    Inventors: Shin Masuhara, Shinsuke Kishi
  • Patent number: 6866500
    Abstract: A clamping apparatus includes a fixed die plate (21) fixed to a frame (26), four tie rods (23), (24) extending in the horizontal direction and respectively fixed to the fixed die plate (21) in parallel to each other, a moving die plate (22) supported to the four tie rods (23), (24) so that the moving die plate (22) can slide freely and a clamping mechanism for moving the moving die plate (22) forward and backward along the four tie rods (23), (24). This clamping apparatus comprises a guide mechanism (25) for downwardly or upwardly supporting the moving die plate (22) and which allows the moving die plate (22) to move in the opposite direction of gravitation.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: March 15, 2005
    Assignee: Sony Corporation
    Inventors: Shinsuke Kishi, Kazuhiro Miura, Osamu Matsuura
  • Patent number: 6841103
    Abstract: The present invention is directed to an injection molding apparatus and method capable of preventing the occurrence of over-packing. The apparatus includes a pair of dies for forming a plurality of cavities therebetween; die closing devices for closing the pair of dies under a prescribed pressure; an injection device for injecting a molten resin into respective cavities under a prescribed pressure; and, a control device for controlling the die closing devices and the injection device. Further, the apparatus comprises a plurality of pressure sensors for detecting respective pressures in respective cavities and a control device that controls the injection device and/or the die closing devices to reduce the rate of injection of the molten resin and/or the force of closing the dies and, otherwise, stops the injection and/or the die closing operation when the pressure difference between cavities is found to be greater than a prescribed value on the basis of sensed values from the respective pressure sensors.
    Type: Grant
    Filed: February 8, 2001
    Date of Patent: January 11, 2005
    Assignee: Sony Disc Technology Inc.
    Inventors: Shinsuke Kishi, Hideaki Yoshimura
  • Publication number: 20040183231
    Abstract: A space 12 is formed at a tip portion of a nozzle 1 so as to decrease a thermal transfer of the nozzle 1. Alternatively, a center portion of one of a semi-spherically protruded surface of the tip portion of the nozzle 1 and a semi-spherically recessed surface of a sprue bush protrudes so that the radius of curvature of one semi-spherical surface is the same as the radius of curvature of the other semi-spherical surface. As a result, since the nozzle 1 and the sprue bush 2 are surface-contacted, heat of the tip portion of the nozzle 1 absorbed to the sprue bush 2 is increased. Thus, the temperature of the tip portion of the nozzle 1 can be easily lowered. After resin material injected into the molding cavity 11 is cooled, when the sprue is removed, a tip portion of a rod-shaped protrusion portion of the sprue can be properly cut.
    Type: Application
    Filed: January 30, 2004
    Publication date: September 23, 2004
    Inventors: Shinsuke Kishi, Osamu Matsuura
  • Publication number: 20030147990
    Abstract: A resin ring 51 is press-fitted into a grove portion formed in an inner periphery surface of an interlocking ring 4. The resin ring 51 is made of a hard resin such as Teflon. The resin ring 51 as a low frictional lubricative member is interposed between the interlock ring 4 and an outer periphery ring 3. In addition, a cavity 6 as a closed space is formed between a stamper 1b as a molding surface of a fixed side mirror 1 and a mirror side molding surface 2b of a moving side mirror 2. While the moving side mirror 2 is being press-contracted to the fixed side mirror 1, when a resin material is filled into the cavity 6, the outer periphery ring 3 is slidably held in a groove of the moving side mirror 2 with predetermined clearances. In the interlock ring 4, a plurality of openings 4a which relieve gas produced by the disc resin material filled into the cavity 6 are formed.
    Type: Application
    Filed: December 20, 2002
    Publication date: August 7, 2003
    Inventors: Osamu Matsuura, Kazuhiro Miura, Hideaki Yoshimura, Shinsuke Kishi
  • Patent number: 6576317
    Abstract: An optical disc capable of preventing damages on a printing plate and an injection compression molding die capable of producing such optical disc substrate without raising the accuracy of the die are provided. An optical disc substrate according to one embodiment of the present invention has a ring-formed projected portion on the outer periphery of the printable plane slightly recessed inwardly from the outer edge of the disc. Such optical disc substrate can be produced using a molding die in which a readout-side mirror has a ring-formed groove on the inner surface thereof in the vicinity of a sliding portion between such readout-side mirror and a cavity ring.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: June 10, 2003
    Assignee: Sony Corporation
    Inventors: Hideaki Yoshimura, Shinsuke Kishi
  • Publication number: 20030082260
    Abstract: A clamping apparatus includes a fixed die plate (21) fixed to a frame (26) , four tie rods (23), (24) extending in the horizontal direction and respectiely fixed to the fixed die plate (21) in parallel to each other, a moving die plate (22) supported to the four tie rods (23), (24) so that the moving die plate (22) can slide freely and a clamping mechanism for moving the moving die plate (22) forward and backward along the four tie rods (23), (24) . This clamping apparatus comprises a guide mechanism (25) for downwardly or upwardly supporting the moving die plate (22) and which allows the moving die plate (22) to move in the opposite direction of gravitation.
    Type: Application
    Filed: October 10, 2002
    Publication date: May 1, 2003
    Inventors: Shinsuke Kishi, Kazuhiro Miura, Osamu Matsuura
  • Publication number: 20010019183
    Abstract: There is provided an infection molding apparatus capable of preventing an occurrence of over-packing which is comprised of: a pair of dies for forming a plurality of cavities therebetween; die closing devices for closing the pair of dies under a prescribed pressure; an injection device for Injecting a molten resin into respective cavities under a prescribed pressure; and a control device for controlling the die closing devices and the Injection device, and further the apparatus comprises a plurality of pressure sensors for detecting respective pressures in respective cavities, wherein the control device controls the injection device and/or the die closing devices to reduce a rate of injection of the molten resin and/or a force of closing of the dies, otherwise to stop the injection and/or the die closing operation when a pressure difference between cavities is found to be greater than a prescribed value on the basis of sensed values from the respective pressure sensors.
    Type: Application
    Filed: February 8, 2001
    Publication date: September 6, 2001
    Inventors: Shinsuke Kishi, Hideaki Yoshimura
  • Publication number: 20010019535
    Abstract: An optical disc capable of preventing damages on a printing plate and an injection compression molding die capable of producing such optical disc substrate without raising the accuracy of the die are provided. An optical disc substrate according to one embodiment of the present invention has a ring-formed projected portion on the outer periphery of the printable plane slightly recessed inwardly from the outer edge of the disc. Such optical disc substrate can be produced using a molding die in which a readout-side mirror has a ring-formed groove on the inner surface thereof in the vicinity of a sliding portion between such readout-side mirror and a cavity ring.
    Type: Application
    Filed: February 1, 2001
    Publication date: September 6, 2001
    Inventors: Hideaki Yoshimura, Shinsuke Kishi
  • Patent number: 5875954
    Abstract: A bonded pipe produced by using the liquid phase diffusion process in which the pipe ends of pipes to be bonded are butted with an insert material lower in melting point than the pipe material against each other, wherein the thickness is increased in such a manner that the outside diameter of the butted portion is expanded and the inside diameter thereof is reduced. A method for bonding pipes in which pipe ends of the pipes are butted through an insert material lower in melting point than the pipe material against each other, and the butted portion is heated to and held at a holding temperature higher than the melting point of the insert material, whereby the insert material is diffused in liquid phase into the pipe material, characterized in that at the time point when the outer pipe face temperature of the above-mentioned butted portion reaches a value which is not less than the A.sub.
    Type: Grant
    Filed: August 6, 1996
    Date of Patent: March 2, 1999
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Shinsuke Kishi, Tsukasa Maenosono, Michio Sato
  • Patent number: 5852329
    Abstract: An optical disc molding device has a pair of molds for injection molding a disc substrate within cavities, and a stamper supported within at least one cavity, for molding a data recording surface in such a manner that the inside diameter side of the stamper supporting surface of the cavity protrudes inwardly in the disc thickness direction from the data recording surface. The flatness of a laminated reference plane has thus been deteriorated by burrs occurring on a disc substrate.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: December 22, 1998
    Assignee: Sony Corporation
    Inventors: Nobuyuki Arakawa, Toshiyuki Kashiwagi, Asao Kurosu, Yuji Akiyama, Shinsuke Kishi
  • Patent number: 5238393
    Abstract: A multi-cavity injection molding apparatus capable of simultaneously molding a plurality of optical disk substrates with a simple construction. The injection molding apparatus is constituted of a mold unit having a plurality of cavities and an injection unit for supplying a molten resin to the mold unit. The injection unit is provided with a plurality of nozzles for injecting the molten resin into the cavities, respectively.
    Type: Grant
    Filed: December 27, 1991
    Date of Patent: August 24, 1993
    Assignee: Sony Corporation
    Inventor: Shinsuke Kishi