Patents by Inventor Shinsuke Miyachi

Shinsuke Miyachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die with aligning mechanism, and manufacturing device and method for enameled wire
    Patent number: 10603832
    Abstract: A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: March 31, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Yasuhiro Funayama, Junji Ishihara, Shinsuke Miyachi, Takayoshi Nishimura
  • DIE WITH ALIGNING MECHANISM, AND MANUFACTURING DEVICE AND METHOD FOR ENAMELED WIRE
    Publication number: 20180345560
    Abstract: A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.
    Type: Application
    Filed: February 9, 2018
    Publication date: December 6, 2018
    Applicant: HITACHI METALS, LTD.
    Inventors: Yasuhiro Funayama, Junji Ishihara, Shinsuke Miyachi, Takayoshi Nishimura