Patents by Inventor Shinsuke NABEYA

Shinsuke NABEYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11189554
    Abstract: A semiconductor device according to the embodiments includes: a first substrate having a plurality of first through-holes; a plurality of first electrodes provided on the first substrate to be adjacent to the respective first through-holes; a plurality of second electrodes provided on the first substrate to be adjacent to the respective first through-holes and to face the respective first electrodes; and a second substrate provided to face the first substrate, the second substrate having a plurality of second through-holes facing the respective first through-holes, at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: November 30, 2021
    Assignee: NuFlare Technology, Inc.
    Inventors: Shiro Okada, Mie Matsuo, Hiroshi Yamashita, Shinsuke Nabeya, Kenichi Kataoka
  • Semiconductor device
    Patent number: 10607908
    Abstract: A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening larger than the region, the substrate containing a resin or a ceramic; a spacer provided between the semiconductor chip and the substrate, the spacer having a second opening larger than the region; a first bond provided between the semiconductor chip and the spacer; and a second bond provided between the spacer and the substrate.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: March 31, 2020
    Assignee: NuFlare Technology, Inc.
    Inventors: Kazuhiro Chiba, Yoshikuni Goshima, Shinsuke Nabeya, Shiro Okada, Kentaro Mori
  • SEMICONDUCTOR DEVICE
    Publication number: 20200091056
    Abstract: A semiconductor device according to the embodiments includes: a first substrate having a plurality of first through-holes; a plurality of first electrodes provided on the first substrate to be adjacent to the respective first through-holes; a plurality of second electrodes provided on the first substrate to be adjacent to the respective first through-holes and to face the respective first electrodes; and a second substrate provided to face the first substrate, the second substrate having a plurality of second through-holes facing the respective first through-holes, at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes.
    Type: Application
    Filed: August 22, 2019
    Publication date: March 19, 2020
    Applicant: NuFlare Technology, Inc.
    Inventors: Shiro Okada, Mie Matsuo, Hiroshi Yamashita, Shinsuke Nabeya, Kenichi Kataoka
  • SEMICONDUCTOR DEVICE
    Publication number: 20180374768
    Abstract: A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening larger than the region, the substrate containing a resin or a ceramic; a spacer provided between the semiconductor chip and the substrate, the spacer having a second opening larger than the region; a first bond provided between the semiconductor chip and the spacer; and a second bond provided between the spacer and the substrate.
    Type: Application
    Filed: June 15, 2018
    Publication date: December 27, 2018
    Applicant: NuFlare Technology, Inc.
    Inventors: Kazuhiro CHIBA, Yoshikuni GOSHIMA, Shinsuke NABEYA, Shiro OKADA, Kentaro MORI