Abstract: An electromagnetic drive device includes a through-hole, through which a rod is received, and the rod includes an outer wall surface that is slidable relative to the through-hole. A clearance, which is measured from the outer wall surface of the rod placed in a maximum projected position to an inner wall surface of the through-hole, is smaller than a clearance, which is measured from the outer wall surface of the rod placed in a maximum retracted position to the inner wall surface. Therefore, a retracting-time clearance becomes relatively large, and thereby a frictional force between the rod and a support tubular portion can be reduced. Furthermore, a projecting-time clearance becomes relatively small, and thereby the amount of swing of a distal end of the rod in a radial direction can be reduced.

Abstract: An electromagnetic drive device includes a through-hole, through which a rod is received, and the rod includes an outer wall surface that is slidable relative to the through-hole. A clearance, which is measured from the outer wall surface of the rod placed in a maximum projected position to an inner wall surface of the through-hole, is smaller than a clearance, which is measured from the outer wall surface of the rod placed in a maximum retracted position to the inner wall surface. Therefore, a retracting-time clearance becomes relatively large, and thereby a frictional force between the rod and a support tubular portion can be reduced. Furthermore, a projecting-time clearance becomes relatively small, and thereby the amount of swing of a distal end of the rod in a radial direction can be reduced.

Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.

Abstract: An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic component unit is covered with primer made of a material such as resin to increase an adhesive force of the molding resin to the electronic component unit. A glass transition temperature of both of the molding resin and the primer is set to a temperature higher than 200° C. to keep the adhesive force unchanged at least up to the ambient temperature of 200° C. and to secure a reliability of the electronic package. A metallic lead wire connected to the electronic component may be encapsulated together with the electronic component unit. An entire surface of the electronic component unit may be covered with the primer to further improve the adhesive force.

Abstract: An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic component unit is covered with primer made of a material such as resin to increase an adhesive force of the molding resin to the electronic component unit. A glass transition temperature of both of the molding resin and the primer is set to a temperature higher than 200° C. to keep the adhesive force unchanged at least up to the ambient temperature of 200° C. and to secure a reliability of the electronic package. A metallic lead wire connected to the electronic component may be encapsulated together with the electronic component unit. An entire surface of the electronic component unit may be covered with the primer to further improve the adhesive force.