Abstract: A semiconductor device includes a semiconductor element having a circuit surface on which a projection electrode is formed, a seal resin which seals the circuit surface of the semiconductor element while exposing at least an end part of the projection electrode, a connect surface that is to face a board when the semiconductor device is implemented on the board, a back surface which is opposite to the connect surface, a side surface arranged between the connect surface and the back surface, and an organic material layer formed on the side surface.

Abstract: A semiconductor device having high-density external connection electrodes is provided. The principal object of the present invention is to ensure accurate detection of the locations of detection marks for positioning the mounting terminals at a time of mounting the semiconductor device to a printed circuit board. The semiconductor device includes a semiconductor chip, a resin package for encapsulating the semiconductor chip, stud bumps formed on the packaging surface of the resin package, and wires which are connected to the semiconductor chip at one end and are connected to the stud bumps at the other end. The semiconductor device further includes detection mark wires which are exposed through the packaging surface of the resin package at one end. The exposed portions of the detection mark wires are used as detection marks.