Abstract: An object of the present disclosure is to be able to further reduce the size of a substrate structure including a plurality of elements. The substrate structure includes: a base substrate that includes a first conductive plate and a second conductive plate; a first element connected to the first conductive plate and the second conductive plate; and a second element connected to the first conductive plate and the second conductive plate. The first conductive plate and the second conductive plate are disposed on the same plane on the base substrate in a state of being electrically insulated from each other, the first element is mounted on a first main surface of the base substrate, and the second element is mounted on a second main surface that is on the opposite side to the first main surface relative to the base substrate.

Abstract: An object of the present disclosure is to be able to further reduce the size of a substrate structure including a plurality of elements. The substrate structure includes: a base substrate that includes a first conductive plate and a second conductive plate; a first element connected to the first conductive plate and the second conductive plate; and a second element connected to the first conductive plate and the second conductive plate. The first conductive plate and the second conductive plate are disposed on the same plane on the base substrate in a state of being electrically insulated from each other, the first element is mounted on a first main surface of the base substrate, and the second element is mounted on a second main surface that is on the opposite side to the first main surface relative to the base substrate.

Abstract: A power circuit includes bus bars that are connected to terminals of an FET and are provided flush with each other, and a first insulation region arranged between the bus bars. The power circuit includes a bus bar to which the FET is fixed, a conductive sheet that is connected to another bus bar via a first connection portion and electrically connects source terminals of the FET to the other bus bar, and a second connection portion that is provided in the conductive sheet and electrically connects the source terminals to the other bus bar.

Abstract: Provided is a circuit board structure including a first circuit board having bus bars and a second circuit board arranged spaced apart from the first circuit board, multiple FET being arranged on the bus bars, and terminals of the multiple FETs being connected to the bus bars. The circuit board structure includes a conducting wire group sheet that covers a portion of the bus bar and is provided with multiple conducting wires that allow electricity to flow between gate terminals of the FETs and the second circuit board. The semiconductor element FETs, which are arranged side by side, are provided such that the gates terminals are arranged in the same direction with respect to the direction in which the semiconductor element FETs are arranged side by side.

Abstract: A power circuit includes multiple bus bars that are connected to multiple terminals of an FET, are provided flush with each other, and are each insulated from each other. The power circuit includes one bus bar that is connected to drain terminals of the FET, a solder fixing portion of the FET that is arranged on the bus bar, and another bus bar that is connected to source terminals of the FET via a conductive connection sheet.

Abstract: A power circuit is provided with two bus bars in a single plane connected to terminals of a plurality of FETs and includes an insulating region interposed between the bus bars, the power circuit including: a first conductive piece to which one group of the plurality of FETs is fixed; a second conductive piece to which another group of the plurality of FETs is fixed, wherein the plurality of FETs are alternately fixed to the first conductive piece and the second conductive piece.

Abstract: A power circuit includes bus bars that are connected to terminals of an FET and are provided flush with each other, and a first insulation region arranged between the bus bars. The power circuit includes a bus bar to which the FET is fixed, a conductive sheet that is connected to another bus bar via a first connection portion and electrically connects source terminals of the FET to the other bus bar, and a second connection portion that is provided in the conductive sheet and electrically connects the source terminals to the other bus bar.

Abstract: Provided is a circuit board structure including a first circuit board having bus bars and a second circuit board arranged spaced apart from the first circuit board, multiple FET being arranged on the bus bars, and terminals of the multiple FETs being connected to the bus bars. The circuit board structure includes a conducting wire group sheet that covers a portion of the bus bar and is provided with multiple conducting wires that allow electricity to flow between gate terminals of the FETs and the second circuit board. The semiconductor element FETs, which are arranged side by side, are provided such that the gates terminals are arranged in the same direction with respect to the direction in which the semiconductor element FETs are arranged side by side.

Abstract: A circuit device includes a circuit board and a conductive plate that are laminated via an insulating layer, and a circuit component. A conductive path is formed on the insulating layer using a conductive adhesive, and a portion of the conductive path is interposed between the insulating layer and the back side of the circuit board. A first terminal of the circuit component is electrically connected to the conductive path, and a second terminal is electrically connected to the conductive plate through a missing portion formed in the insulating layer. The conductive pattern extends to the back side of the circuit board, and the extended conductive pattern and the conductive path are adhered to each other where the respective surfaces overlap each other.

Abstract: An electrical junction box includes a casing configured to be mounted in a vehicle, a start relay (a start electrical component) A housed in the casing and to which a current is supplied at least at a start of the vehicle, an operational electrical component (an operational relay, a connector, and a fuse connector) housed in the casing and to which a current is supplied at least during an operation of the vehicle, and a surrounding heat shield wall (a heat shield wall) disposed between the start relay and at least one of the operational relay, the connector, and the fuse connector that are the operational electrical components. The start relay includes a relay case (an electrical component case) and a terminal portion. The terminal portion is housed in the relay case and has a fixed contact and a movable contact.

Abstract: An electrical junction box includes a casing and a relay housed in the casing. The relay is located at an outer end in the casing. The relay includes an electrical component case and a terminal. The terminal is attached through the electrical component case and includes a fixed contact and a movable contact located in the electrical component case.

Abstract: An electrical junction box includes a casing configured to be mounted in a vehicle, a start relay (a start electrical component) A housed in the casing and to which a current is supplied at least at a start of the vehicle, an operational electrical component (an operational relay, a connector, and a fuse connector) housed in the casing and to which a current is supplied at least during an operation of the vehicle, and a surrounding heat shield wall (a heat shield wall) disposed between the start relay and at least one of the operational relay, the connector, and the fuse connector that are the operational electrical components. The start relay includes a relay case (an electrical component case) and a terminal portion. The terminal portion is housed in the relay case and has a fixed contact and a movable contact.

Abstract: A circuit structure includes a circuit board having a conduction path and a through-hole continuing to the conduction path, a wire routing member that has a wire holding convex portion holding a wire configured to form a pre-determined conduction path and that is disposed to face the circuit board, a relaying wire whose one end is inserted into the through-hole in the circuit board to thereby connect the conductor path on the wire routing plate to that on the circuit board, and a positioning portion that is provided on the wire routing plate to thereby position a tip of the relaying wire.

Abstract: A circuit structure includes a circuit board having a conduction path and a through-hole continuing to the conduction path, a wire routing member that has a wire holding convex portion holding a wire configured to form a pre-determined conduction path and that is disposed to face the circuit board, a relaying wire whose one end is inserted into the through-hole in the circuit board to thereby connect the conductor path on the wire routing plate to that on the circuit board, and a positioning portion that is provided on the wire routing plate to thereby position a tip of the relaying wire.

Abstract: A plastic-clad optical fiber having a cladding material formed from a cured material of a resin composition containing a urethane di(meth)acrylate represented by the general formula: ##STR1## and a diluent can efficiently introduce light from a light source without sacrificing a band.