Abstract: In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.

Abstract: A semiconductor module includes a semiconductor chip having a switching function, a resin portion that covers the chip, terminals, and a heat dissipation portion. The resin portion includes first and second surfaces, which are opposed to each other and expand generally parallel to an imaginary plane; and a substrate is located on a first surface-side of the resin portion. The terminals project from the resin portion in a direction of the imaginary plane and are soldered onto the substrate. The heat dissipation portion is disposed on a second surface-side of the resin portion to release heat generated in the chip. One of the terminals is connected to the heat dissipation portion such that heat is transmitted from the one of the terminals to the heat dissipation portion.

Abstract: An electronic control unit includes a board, a heat-generating device, a connector, and a heatsink. The board has an insulating layer and a wiring pattern partially exposed outside the insulating layer. The heat-generating device is mounted on the board and electrically connected to the wiring pattern. The connector is located adjacent to the heat-generating device and has a connection terminal connected to the wiring pattern. The heatsink is located opposite to the board across the heat-generating device and in contact with the heat-generating device to dissipate heat of the heat-generating device. The wiring pattern has a land pattern including a mount portion and a connection portion. The heat-generating device is mounted on the mount portion. The connection terminal of the connector is connected to the connection portion.

Abstract: An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

Abstract: In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.

Abstract: An electronic control unit includes a board, a heat-generating device, a connector, and a heatsink. The board has an insulating layer and a wiring pattern partially exposed outside the insulating layer. The heat-generating device is mounted on the board and electrically connected to the wiring pattern. The connector is located adjacent to the heat-generating device and has a connection terminal connected to the wiring pattern. The heatsink is located opposite to the board across the heat-generating device and in contact with the heat-generating device to dissipate heat of the heat-generating device. The wiring pattern has a land pattern including a mount portion and a connection portion. The heat-generating device is mounted on the mount portion. The connection terminal of the connector is connected to the connection portion.

Abstract: A sensor unit includes a printed circuit board, a Hall IC, a terminal member, and a capacitor. The printed circuit board has a conductive pattern. The Hall IC is disposed on the printed circuit board. The Hall IC includes an element part that detects magnetic flux. The element part is arranged in parallel with the printed circuit board and is away from the conductive pattern. The terminal member is disposed on an end portion of the printed circuit board and is configured to be electrically coupled with an external device. The capacitor is disposed on the printed circuit board.

Abstract: An electric control device includes: an accommodation element (10) having an opening and a bottom; a cover element (20) for covering the opening of the accommodation element (10) so that accommodation space (15) is formed between the cover element (20) and the accommodation element (10); a hook (11) integrated with the accommodation element (10) for swaging the cover element (20); and a control element (30) formed in the accommodation space (15), wherein an electric element (32-35) is arranged on a substrate (31) so that the control element (30) is prepared. The substrate (31) includes a notch concavity (311) on a periphery of the substrate (31) so as to face the hook (11).

Abstract: A substrate of an electronic control unit has a control region on which a control component is disposed and a power region on which a power component is disposed. Substrate-fixing portions of a housing project from a bottom portion, and the substrate is fixed to the substrate-fixing portions. A heat radiating portion extends from the bottom portion. Semiconductor modules are fixed to a first outer surface and a second outer surface of the heat radiating portion, the first outer surface being on a side opposite to the power component. The heat radiating portion is located between the semiconductor modules and the power component. Therefore, heat interference between the semiconductor modules and the power component is reduced, and a heat radiation performance improves.

Abstract: An electronic control device includes: an accommodation element; a cover element; a connection element for fixing the cover element to the accommodation element; an extending protrusion extending and protruding to an outside from a contact portion between the cover element and the accommodation element; and a control element formed in the accommodation space. The extending protrusion includes a protrusion portion, which protrudes toward a bottom side or a cover element side and is formed to cover the contact portion. A clearance having predetermined dimensions is formed between the protrusion portion and one of an outer wall of the cover element and an outer wall of the accommodation element, which is near the contact portion.

Abstract: A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the first surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.

Abstract: An electronic control apparatus includes a housing, a lid, a fastener, and a controller. The lid covers the opening of the housing to form a closed space defined by the lid and the housing. The fastener fixes the lid to the housing. The controller is located in the space. An isolation member is provided with an outer surface of one of the lid and the bottom of the housing. The outer surface has a liquid drip area where liquid is expected to drip. The isolation member causes the liquid dripped on the liquid drip area to flow down the outer surface in such a manner that the liquid avoids the fastener.

Abstract: An electronic control unit includes a circuit board, multiple circuit patterns, multiple semiconductor devices, multiple leads, and at least one thermal-conduction limiting portion. Each of the semiconductor devices is installed to the corresponding circuit pattern formed on the circuit board. Each of the leads electrically and mechanically connects each of the semiconductor devices to the corresponding circuit pattern. The thermal-conduction limiting portion, which can limit conduction of heat generated from the semiconductor devices, is placed between corresponding two of the circuit patterns.

Abstract: An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

Abstract: A semiconductor module includes a semiconductor chip having a switching function, a resin portion that covers the chip, terminals, and a heat dissipation portion. The resin portion includes first and second surfaces, which are opposed to each other and expand generally parallel to an imaginary plane; and a substrate is located on a first surface-side of the resin portion. The terminals project from the resin portion in a direction of the imaginary plane and are soldered onto the substrate. The heat dissipation portion is disposed on a second surface-side of the resin portion to release heat generated in the chip. One of the terminals is connected to the heat dissipation portion such that heat is transmitted from the one of the terminals to the heat dissipation portion.

Abstract: In an electronic control unit, a semiconductor device that is installed to a circuit board includes a semiconductor chip, multiple leads and a resin body. The semiconductor chip is electrically connected to the circuit board through the leads and is molded in the resin body. A case receives the semiconductor device. A heat releasing gel contacts the semiconductor device, and conducts heat generated from the semiconductor device to a first cover of the case located on one side of the semiconductor device, which is opposite from the circuit board. A groove portion as a movement limiting means is placed at a location between the circuit board and the first cover. Therefore, movement of the heat releasing gel is limited, and heat can be released to a side of the case through the heat releasing gel with high efficiency.

Abstract: A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the fist surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.

Abstract: An electric control device includes: an accommodation element (10) having an opening and a bottom; a cover element (20) for covering the opening of the accommodation element (10) so that accommodation space (15) is formed between the cover element (20) and the accommodation element (10); a hook (11) integrated with the accommodation element (10) for swaging the cover element (20); and a control element (30) formed in the accommodation space (15), wherein an electric element (32-35) is arranged on a substrate (31) so that the control element (30) is prepared. The substrate (31) includes a notch concavity (311) on a periphery of the substrate (31) so as to face the hook (11).

Abstract: An electronic control device includes: an accommodation element; a cover element; a connection element for fixing the cover element to the accommodation element; an extending protrusion extending and protruding to an outside from a contact portion between the cover element and the accommodation element; and a control element formed in the accommodation space. The extending protrusion includes a protrusion portion, which protrudes toward a bottom side or a cover element side and is formed to cover the contact portion. A clearance having predetermined dimensions is formed between the protrusion portion and one of an outer wall of the cover element and an outer wall of the accommodation element, which is near the contact portion.

Abstract: A sensor unit includes a printed circuit board, a Hall IC, a terminal member, and a capacitor. The printed circuit board has a conductive pattern. The Hall IC is disposed on the printed circuit board. The Hall IC includes an element part that detects magnetic flux. The element part is arranged in parallel with the printed circuit board and is away from the conductive pattern. The terminal member is disposed on an end portion of the printed circuit board and is configured to be electrically coupled with an external device. The capacitor is disposed on the printed circuit board.