Abstract: A holding head including a support portion, a suction nozzle which applies a negative pressure to a back surface of an object and thereby holds the object, the suction nozzle being detachably attached to the support portion, and a back-surface lighting device which lights the back surface of the object held by the suction nozzle and which includes a main portion which is separate from the suction nozzle and is supported by the support portion such that when the suction nozzle is detached from the support portion, the main portion remains supported by the support portion.

Abstract: Method of transferring an electric component from a component supply device to a suction nozzle of a component-holding head, wherein a relative position between a sucking surface of the suction nozzle and an axis of rotation of the component-holding head is obtained, and the component-holding head and the component supply device are moved relative to each other on the basis of the obtained relative position, so as to minimize an error of relative positioning between the sucking surface and a predetermined sucking position of the electric component positioned at the component-supply portion. The head and the component supply device are then moved toward each other, for transferring the electronic components from the component supply device to the suction nozzle. Also disclosed is an electric-component mounting system arranged to practice the method before the electric component is mounted on a circuit substrate.

Abstract: A suction nozzle for applying a suction to an object and thereby holding the object, the suction nozzle including a nozzle portion having an end surface, and a suction passage formed in the nozzle portion and opening in the end surface thereof, the end surface providing a suction surface that applies the suction to the object and thereby holds the object. At least a free end portion of the nozzle portion has a shape whose diameter gradually increases in a direction from the end surface thereof toward a base end thereof opposite to the end surface.

Abstract: A method of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit, including the steps of taking, immediately before each of the electric components is mounted on the circuit substrate, a first image of a first portion of the circuit substrate on which the each electric component is to be mounted and a second portion of the circuit substrate that is adjacent to the first portion, mounting the each electric component on the circuit substrate, taking, immediately after the each electric component is mounted on the circuit substrate, a second image of the mounted electric component and the second portion adjacent to the mounted electric component, and inspecting, by comparing the first and second images with each other, a state in which the each electric component is mounted on the circuit substrate.

Abstract: An apparatus for positioning each of a plurality of electronic component holder heads each for holding an electronic component, at a selected one of a plurality of positions of at least one stop station, including a plurality of rotary members each of which is rotatable about a common axis line and is stoppable at the at least one stop station, the electronic component holder heads being carried by the rotary members, respectively, such that each of the holder heads is movable relative to a corresponding one of the rotary members in a direction parallel to the common axis line, and (a) a circumferential position selecting device which selects, for the stop station, one of a plurality of circumferential positions which are spaced from each other in a direction of rotation of the rotary members about the common axis line, so that at least one of the rotary members is stopped at the selected circumferential position and accordingly the electronic component holder head carried by the one rotary member is position

Abstract: A system for performing an operation for a circuit substrate, including a plurality of main conveyors each of which conveys, positions, and supports a circuit substrate, the plurality of main conveyors being arranged in a direction perpendicular to a circuit-substrate conveying direction in which the each main conveyor conveys the circuit substrate, an operation performing device which performs at least one operation for the circuit substrate positioned and supported by the each main conveyor, at least one of (a) a carry-in conveyor which conveys the circuit substrate to the each main conveyor and loads the circuit substrate thereon, and (b) a carry-out conveyor which loads the circuit substrate off the each main conveyor and conveys the circuit substrate away therefrom, and a conveyor shifting device which selectively shifts the at least one of the carry-in conveyor and the carry-out conveyor to one of a plurality of shift positions at each of which the one conveyor is aligned with a corresponding one of the

Abstract: A method of treating a cover tape of a carrier tape including an accommodating tape having, at a predetermined pocket pitch, a plurality of pockets accommodating a plurality of electric components, respectively, and the cover tape fixed to the accommodating tape to close respective openings of the pockets, the method including the steps of peeling a portion of the cover tape from the accommodating tape, and feeding the peeled portion of the cover tape in a lengthwise direction thereof, cutting off a free end portion of the fed portion of the cover tape, into a cuff-off piece of the cover tape, and sucking the cut-off piece of the cover tape with an ambient air into a suction passage, and thereby carrying away the cut-off piece.

Abstract: A system for mounting circuit components on a circuit substrate, including a circuit-substrate supporting device which supports the circuit substrate, a circuit-component mounting device which mounts, at a circuit-component mounting position, the circuit components on the circuit substrate supported by the circuit-substrate supporting device, and a circuit-substrate carry-out device which receives, from the circuit-substrate supporting device, the circuit substrate with the circuit components being mounted thereon, and carries out the received circuit substrate, the circuit substrate being transferred from the circuit-substrate supporting device to the circuit-substrate carry-out device in a direction substantially perpendicular to a plane of the circuit substrate.

Abstract: An apparatus for mounting an electric component on a circuit substrate, the apparatus including a nozzle-holding member which holds a suction nozzle applying a suction to the electric component and thereby holding the component, a displaceable member which supports the nozzle-holding member and is displaceable in a first direction intersecting an axial direction of the suction nozzle, a displacing device which displaces the displaceable member in the first direction so that the electric component held by the suction nozzle is transferred in the first direction and is positioned at a position above the circuit substrate, a moving device which moves, relative to the displaceable member, the nozzle-holding member downward in a second direction parallel to the axial direction of the suction nozzle so that the electric component held by the nozzle is mounted on the circuit substrate, and a guiding device which is provided between the nozzle-holding member and the displaceable member and guides a downward movement

Abstract: A method of mounting an electric component on a circuit substrate, including the steps of moving one of a suction nozzle and an electric-component supplying device toward the other of the nozzle and the supplying device, so that the nozzle applies a suction to the component supplied by the supplying device and thereby receives the component, moving one of the nozzle and the substrate toward the other of the nozzle and the substrate, so that the nozzle mounts the component on the substrate, taking an image of at least a portion of the component held by the nozzle, as seen in a direction perpendicular to an axial direction of the nozzle, in a state in which the nozzle takes a known position in the axial direction, determining, based on image data representing the taken image, a position of a mounted surface of the electric component that is opposite to a sucked surface of the component sucked by the nozzle, and controlling, based on the determined position, a movement of the nozzle toward one or each of the sup

Abstract: A method of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit, including the steps of taking, immediately before each of the electric components is mounted on the circuit substrate, a first image of a first portion of the circuit substrate on which the each electric component is to be mounted and a second portion of the circuit substrate that is adjacent to the first portion, mounting the each electric component on the circuit substrate, taking, immediately after the each electric component is mounted on the circuit substrate, a second image of the mounted electric component and the second portion adjacent to the mounted electric component, and inspecting, by comparing the first and second images with each other, a state in which the each electric component is mounted on the circuit substrate.

Abstract: A system for mounting circuit components on a circuit substrate, including a circuit-substrate supporting device which supports the circuit substrate, a circuit-component mounting device which mounts, at a circuit-component mounting position, the circuit components on the circuit substrate supported by the circuit-substrate supporting device, and a circuit-substrate carry-out device which carries out the circuit substrate on which the circuit components have been mounted, the circuit-substrate carry-out device comprising a removing device which removes the circuit substrate from the circuit-substrate supporting device, and a parallel-direction carry-out device which receives the circuit substrate from the removing device and carries out the circuit substrate in a parallel direction substantially parallel to a plane of the circuit substrate, the circuit substrate being transferred from the circuit-substrate supporting device to the removing device in a first direction substantially perpendicular to the plane o

Abstract: An electric-component holding head, including a holder member including a nozzle-hold portion which holds a suction nozzle, and having a negative-pressure passage through which a negative pressure is supplied to the suction nozzle so that the suction nozzle holds an electric component by applying the negative pressure thereto, a filter which is provided in the negative-pressure passage and removes foreign matters present in an air passing through the filter, the holder member having an outer surface and a filter-insert hole which has an opening in the outer surface and communicates between the outer surface and the negative-pressure passage so that the filter is inserted from outside the holder member via the filter-insert hole into the negative-pressure passage, and a closure member which closes the opening of the filter-insert hole.

Abstract: A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Abstract: A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Abstract: A circuit-component supplying apparatus including a plurality of feeders each of which stores a plurality of circuit components of a same sort and which supplies the components one by one from a component-supply portion thereof, a movable table which holds the feeders such that the respective component-supply portions of the feeders are arranged along a line and which is movable in a direction parallel to the line, and a table-driving device which moves and stops the movable table to position the component-supply portion of each of the feeders at a predetermined component-supplying position, the feeders including at least one connected feeder which includes a main portion which is held by the movable table and which supports a feeding mechanism which feeds the circuit components one by one to the component-supply portion of the connected feeder, a component-holding portion which holds the circuit components and from which the components are fed to the main portion by the feeding mechanism, and a connecting de

Abstract: A system for mounting circuit components on a circuit substrate, including a circuit-substrate supporting device which supports the circuit substrate, a circuit-component mounting device which mounts, at a circuit-component mounting position, the circuit components on the circuit substrate supported by the circuit-substrate supporting device, and a circuit-substrate carry-out device which carries out the circuit substrate on which the circuit components have been mounted, the circuit-substrate carry-out device comprising a removing device which removes the circuit substrate from the circuit-substrate supporting device, and a parallel-direction carry-out device which receives the circuit substrate from the removing device and carries out the circuit substrate in a parallel direction substantially parallel to a plane of the circuit substrate, the circuit substrate being transferred from the circuit-substrate supporting device to the removing device in a first direction substantially perpendicular to the plane o

Abstract: A method of supplying electric components (“ECs”) with an EC supplying apparatus including an EC-supply table including a displaceable table displaceable in a reference direction, and EC-supply units provided on the displaceable table such that respective EC-supply portions of the units are arranged along a line parallel to the reference direction, each of the EC-supply units including a driven member and a carrier-tape feeding device which feeds, based on the driven member being driven, a carrier tape carrying the ECS at a EC-carry pitch, at a tape-feed pitch equal to a quotient obtained by dividing the EC-carry pitch by an integral number, so that the ECs are positioned, one by one, at the EC-supply portion of each unit, a table displacing device which displaces the displaceable table and positions the EC-supply portion of each EC-supply unit, at an EC-supply position, a drive member which is provided near the EC-supply position, and a drive device which drives the drive member which in turn dri

Abstract: A circuit-component supplying apparatus including a plurality of feeders each of which stores a plurality of circuit components of a same sort and which supplies the components one by one from a component-supply portion thereof, a movable table which holds the feeders such that the respective component-supply portions of the feeders are arranged along a line and which is movable in a direction parallel to the line, and a table-driving device which moves and stops the movable table to position the component-supply portion of each of the feeders at a predetermined component-supplying position, the feeders including at least one connected feeder which includes a main portion which is held by the movable table and which supports a feeding mechanism which feeds the circuit components one by one to the component-supply portion of the connected feeder, a component-holding portion which holds the circuit components and from which the components are fed to the main portion by the feeding mechanism, and a connecting de

Abstract: A method of supplying electric components (“ECs”) with an EC supplying apparatus including an EC-supply table including a displaceable table displaceable in a reference direction, and EC-supply units provided on the displaceable table such that respective EC-supply portions of the units are arranged along a line parallel to the reference direction, each of the EC-supply units including a driven member and a carrier-tape feeding device which feeds, based on the driven member being driven, a carrier tape carrying the ECs at a EC-carry pitch, at a tape-feed pitch equal to a quotient obtained by dividing the EC-carry pitch by an integral number, so that the ECs are positioned, one by one, at the EC-supply portion of each unit, a table displacing device which displaces the displaceable table and positions the EC-supply portion of each EC-supply unit, at an EC-supply position, a drive member which is provided near the EC-supply position, and a drive device which drives the drive member which in turn dri