Abstract: A semiconductor relay module includes: first and second semiconductor relays; and first to third input terminals and first and second output terminals that are exposed from a housing. The first semiconductor relay includes a first optocoupler and a first switch, and the second semiconductor relay includes a second optocoupler and a second switch. The first switch and the second switch are connected by an output connecting line, the third input terminal is connected to an input connecting line, and the input connecting line and the output connecting line are covered by the housing.

Abstract: A semiconductor relay includes two MOSFETs; a light emitting element; a light-receiving drive element for switching on and off the two MOSFETs; two output and two input conductor plates electrically connected to the two MOSFETs and the light emitting element, respectively; and an encapsulating resin encapsulating the two MOSFETs, the light emitting element, the light-receiving drive element, the two output and the two input conductor plates. The two output and two input conductor plates includes terminal portions which protrude outside the encapsulating resin and are mounted on a common printed circuit board. Further, the two output conductor plates includes mount portions on which the two MOSFETs are mounted or on which drain electrodes of the two MOSFETs are connected, and the mount portions are encapsulated by the encapsulating resin in such an orientation that a thickness direction of the mount portions intersects that of the printed circuit board.

Abstract: A semiconductor relay of the invention includes first and second signal terminals, a substrate, a first switch circuit and a control circuit. The substrate includes signal patterns for forming a signal line between the first and second signal terminals. The first switch circuit has a semiconductor switch used to make or break the connection between the first and second signal terminals. The control circuit has a control IC for controlling the first switch circuit. The control IC is mounted on a land of the substrate. The land has a size corresponding to the control IC. A part or all of the land is included in a part of the signal patterns.

Abstract: A semiconductor relay includes two MOSFETs; a light emitting element; a light-receiving drive element for switching on and off the two MOSFETs; two output and two input conductor plates electrically connected to the two MOSFETs and the light emitting element, respectively; and an encapsulating resin encapsulating the two MOSFETs, the light emitting element, the light-receiving drive element, the two output and the two input conductor plates. The two output and two input conductor plates includes terminal portions which protrude outside the encapsulating resin and are mounted on a common printed circuit board. Further, the two output conductor plates includes mount portions on which the two MOSFETs are mounted or on which drain electrodes of the two MOSFETs are connected, and the mount portions are encapsulated by the encapsulating resin in such an orientation that a thickness direction of the mount portions intersects that of the printed circuit board.

Abstract: A semiconductor relay of the invention includes first and second signal terminals, a substrate, a first switch circuit and a control circuit. The substrate includes signal patterns for forming a signal line between the first and second signal terminals. The first switch circuit has a semiconductor switch used to make or break the connection between the first and second signal terminals. The control circuit has a control IC for controlling the first switch circuit. The control IC is mounted on a land of the substrate. The land has a size corresponding to the control IC. A part or all of the land is included in a part of the signal patterns.