Patents by Inventor Shinsuke Takeyama

Shinsuke Takeyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAMINATED BODY FOR MANUFACTURING RESIN MOLD, LAMINATED BODY, RESIN MOLD AND METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM
    Publication number: 20110064871
    Abstract: A laminated body which forms a resin mold by compression molding using a master mold, the laminated body having: a pair of mutually facing base materials, a layer of a liquid or gel-like curable resin material sandwiched between the pair of base materials, and one or more flow suppression bodies, which are composed of a cured product of the curable resin material and are sandwiched between the pair of base materials, wherein the layer of the curable resin material is sealed by the pair of base materials and the flow suppression bodies. Also, a method for manufacturing a resin mold using the laminated body.
    Type: Application
    Filed: May 22, 2009
    Publication date: March 17, 2011
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiroshi Uchida, Tomokazu Umezawa, Masato Fukushima, Shinsuke Takeyama, Takanori Sakuragi