Patents by Inventor Shinta MOROKOSHI

Shinta MOROKOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition, cured film, substrate with cured film, and electronic component
    Patent number: 10988616
    Abstract: The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: April 27, 2021
    Assignee: JNC CORPORATION
    Inventors: Tomotsugu Furuta, Shinta Morokoshi, Ayako Kikuchi
  • Thermosetting resin composition, cured film, substrate with cured film, and electronic component
    Patent number: 10793717
    Abstract: Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: October 6, 2020
    Assignee: JNC CORPORATION
    Inventors: Atsushi Murotani, Takayuki Hirota, Katsuyuki Sugihara, Yoshihiro Deyama, Shinta Morokoshi, Setsuo Itami, Toshiyuki Takahashi
  • PHOTOCURABLE INKJET INK
    Publication number: 20200048480
    Abstract: An object of the invention is to provide a photocurable inkjet ink useful for producing microlenses and electronic components, and having low volatility. The photocurable inkjet ink of the invention contains polyfunctional (meth)acrylate (A), monofunctional (meth)acrylate (B) having nonvolatility of 75% or more and viscosity (25° C.) of 1 to 70 mPa·s in evaluation method 1, and photopolymerization initiator (C); and having viscosity (at 25° C.) of 1 to 100 mPa·s.
    Type: Application
    Filed: April 25, 2018
    Publication date: February 13, 2020
    Applicant: JNC CORPORATION
    Inventors: Kohsuke YOSHITOMI, Shinta MOROKOSHI, Toshiyuki TAKAHASHI, Hisao OIKAWA
  • THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE WITH CURED FILM, AND ELECTRONIC COMPONENT
    Publication number: 20180009983
    Abstract: Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.
    Type: Application
    Filed: January 20, 2016
    Publication date: January 11, 2018
    Inventors: Atsushi MUROTANI, Takayuki HIROTA, Katsuyuki SUGIHARA, Yoshihiro DEYAMA, Shinta MOROKOSHI, Setsuo ITAMI, Toshiyuki TAKAHASHI
  • THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE WITH CURED FILM, AND ELECTRONIC COMPONENT
    Publication number: 20160160045
    Abstract: The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).
    Type: Application
    Filed: July 25, 2014
    Publication date: June 9, 2016
    Applicant: JNC CORPORATION
    Inventors: Tomotsugu FURUTA, Shinta MOROKOSHI, Ayako KIKUCHI