Abstract: To prevent point illumination and fix a light-guiding body. The present invention includes: a fixation portion having a first holding portion and a second holding portion; engagement portions that restrict frontward movement of the one end portion in the front-back direction; an elastic portion that generates elastic force upward in the up-down direction, and abuts on the one end portion to maintain engagement of the engagement portions; contact portions that bring the first holding portion and the one end portion into contact with each other on both sides in the left-right direction; an abutment portion that abuts on the one end portion to restrict backward movement of the one end portion in the front-back direction; and a restriction portion that abuts on the elastic portion to restrict downward movement of the elastic portion in the up-down direction.

Abstract: To prevent point illumination and fix a light-guiding body. The present invention includes: a fixation portion having a first holding portion and a second holding portion; engagement portions that restrict frontward movement of the one end portion in the front-back direction; an elastic portion that generates elastic force upward in the up-down direction, and abuts on the one end portion to maintain engagement of the engagement portions; contact portions that bring the first holding portion and the one end portion into contact with each other on both sides in the left-right direction; an abutment portion that abuts on the one end portion to restrict backward movement of the one end portion in the front-back direction; and a restriction portion that abuts on the elastic portion to restrict downward movement of the elastic portion in the up-down direction.

Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.

Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.

Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.

Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.

Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.

Abstract: The present invention is to provide an electroconductive adhesive composition which contains a thermoplastic resin and has high heat dissipation properties and which is inhibited from suffering the bleeding-out phenomenon in which a nonpolar solvent undesirably bleeds out after die bonding. The present invention relates to an electroconductive adhesive composition including (A) electroconductive particles, (B) a thermoplastic resin, (C) a nonpolar solvent, and (D) a water-insoluble fluorochemical surfactant.

Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.

Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.

Abstract: A connector includes a housing unit which accommodates terminals which are crimped onto respective ends of a plurality of electric wires. The housing unit includes housings of a number corresponding to a number of the terminals, each of the housings configured to accommodate each of the terminals. At least one of the housings is formed by a material which has a dielectric constant at which impedance between each of the terminals is a desired impedance.

Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the component (A), (B), (C), and (D) is within a specific range.

Abstract: A connector includes a housing unit which accommodates terminals which are crimped onto respective ends of a plurality of electric wires. The housing unit includes housings of a number corresponding to a number of the terminals, each of the housings configured to accommodate each of the terminals. At least one of the housings is formed by a material which has a dielectric constant at which impedance between each of the terminals is a desired impedance.

Abstract: An electronic device connector includes a connector housing that is combined with a case of an electronic device and a terminal fitting that is held by the connector housing. When the connector housing is combined with the case, the terminal fitting is electrically connected to a contact portion of the electronic device. The terminal fitting includes an internal conductor, an external conductor disposed around the internal conductor, and a dielectric disposed between the internal conductor and the external conductor which are concentrically disposed. The internal conductor and the external conductor are integrally provided with spring portions capable of being elastically deformed in contact with the contact portion of the electronic device.

Abstract: An electronic device connector includes a connector housing that is combined with a case of an electronic device and a terminal fitting that is held by the connector housing. When the connector housing is combined with the case, the terminal fitting is electrically connected to a contact portion of the electronic device. The terminal fitting includes an internal conductor, an external conductor disposed around the internal conductor, and a dielectric disposed between the internal conductor and the external conductor which are concentrically disposed. The internal conductor and the external conductor are integrally provided with spring portions capable of being elastically deformed in contact with the contact portion of the electronic device.

Abstract: To provide a small watercraft capable of suppressing vibration and noise of a vessel body, a jet pump is mounted to a hull via a thrust plate. A dynamic damper is disposed as an adjunct at a plate mounting portion that attaches the thrust plate to the hull. More specifically, the thrust plate is first mounted to the hull. Then, with a flange portion of the jet pump pressed up against a rear surface of the thrust plate, a second bolt is screwed in toward the thrust plate from an outward side of the hull. The jet pump is thereby attached to the rear surface of the thrust plate.

Abstract: An exhaust device includes an exhaust pipe connected at its upstream end to a cylinder head of the engine and an exhaust muffler connected to the downstream end of the exhaust pipe for suppressing the generation of noise from a heat insulating cover that covers a part of the exhaust pipe. A heat insulating cover covers a portion of the exhaust pipe near the engine and a stay is fixed to the heat insulating cover. The stay includes a supporting plate portion curved so as to partially surround the outer circumference of the exhaust pipe. A first vibration isolating member is provided that is sandwiched between the outer circumference of the exhaust pipe and the supporting plate portion, a band member is tightened to mount the supporting plate portion to the exhaust pipe, and a second vibration isolating member is sandwiched between the supporting plate portion and the band member.

Abstract: To provide a small watercraft capable of suppressing vibration and noise of a vessel body, a jet pump is mounted to a hull via a thrust plate. A dynamic damper is disposed as an adjunct at a plate mounting portion that attaches the thrust plate to the hull. More specifically, the thrust plate is first mounted to the hull. Then, with a flange portion of the jet pump pressed up against a rear surface of the thrust plate, a second bolt is screwed in toward the thrust plate from an outward side of the hull. The jet pump is thereby attached to the rear surface of the thrust plate.

Abstract: An exhaust device includes an exhaust pipe connected at its upstream end to a cylinder head of the engine and an exhaust muffler connected to the downstream end of the exhaust pipe for suppressing the generation of noise from a heat insulating cover that covers a part of the exhaust pipe. A heat insulating cover covers a portion of the exhaust pipe near the engine and a stay is fixed to the heat insulating cover. The stay includes a supporting plate portion curved so as to partially surround the outer circumference of the exhaust pipe. A first vibration isolating member is provided that is sandwiched between the outer circumference of the exhaust pipe and the supporting plate portion, a band member is tightened to mount the supporting plate portion to the exhaust pipe, and a second vibration isolating member is sandwiched between the supporting plate portion and the band member.

Abstract: A zero insertion force integrated circuit socket for receiving an integrated circuit package includes a housing, a cover, and a lever. The housing has an array of contacts arranged in a matrix. The cover is slideably attached to the housing. The lever has a crankshaft extending substantially perpendicular to an actuation shaft. The lever is rotatable between a horizontal position and a vertical position to slide the cover over an upper surface of the housing. The cover has first and second locking arms. The second locking arm has an outer arm section that extends substantially parallel to the first locking arm. The lever is received between the first locking arm and the outer arm section to lock the lever in the vertical position.