Abstract: There is provided a method of managing an imprint apparatus that comprises a processor configured to execute an imprint process for forming a layer of an imprint material on a substrate by using a mold, a chamber configured to accommodate the processor, and a chemical filter configured to remove a chemical impurity contained in a gas flowing inside the chamber. The method comprises retaining a test substrate inside the chamber during execution of the imprint process, forming a layer of an imprint material on the test substrate by executing the imprint process on the test substrate by the processor after the retaining, inspecting the layer formed on the test substrate in the forming, and determining whether or not to replace the chemical filter based on an inspection result obtained in the inspecting.

Abstract: There is provided a method of managing an imprint apparatus that comprises a processor configured to execute an imprint process for forming a layer of an imprint material on a substrate by using a mold, a chamber configured to accommodate the processor, and a chemical filter configured to remove a chemical impurity contained in a gas flowing inside the chamber. The method comprises retaining a test substrate inside the chamber during execution of the imprint process, forming a layer of an imprint material on the test substrate by executing the imprint process on the test substrate by the processor after the retaining, inspecting the layer formed on the test substrate in the forming, and determining whether or not to replace the chemical filter based on an inspection result obtained in the inspecting.

Abstract: An exposure apparatus which includes a plurality of units to be temperature-regulated, and transfers a pattern of a reticle onto a substrate while activating the plurality of units is disclosed. The exposure apparatus comprising a plurality of flow passages which run parallel to each other and through which a fluid to temperature-regulate the plurality of units flows, a bypass line which runs parallel to the plurality of flow passages so as to bypass the plurality of flow passages, and a flow rate controller configured to control a flow rate of fluid flowing through the bypass line, so that a total flow rate of the fluid flowing through the plurality of flow passages and the bypass line becomes a target flow rate.

Abstract: An exposure apparatus includes an alignment station where an alignment measurement process is executed, an exposure station where an exposure process is executed, and two stages which can be swapped between the alignment station and the exposure station. A first blowing unit blows temperature-adjusted gas toward the alignment station, and a second blowing unit blows temperature-adjusted gas toward the exposure station. The directions in which the first blowing unit and the second blowing unit blow the gases are substantially perpendicular to a direction along which the alignment station and the exposure station are arranged.

Abstract: An exposure apparatus includes an alignment station where an alignment measurement process is executed, an exposure station where an exposure process is executed, and two stages which can be swapped between the alignment station and the exposure station. A first blowing unit blows temperature-adjusted gas toward the alignment station, and a second blowing unit blows temperature-adjusted gas toward the exposure station. The directions in which the first blowing unit and the second blowing unit blow the gases are substantially perpendicular to a direction along which the alignment station and the exposure station are arranged.

Abstract: An exposure apparatus includes an alignment station where an alignment measurement process is executed, an exposure station where an exposure process is executed, and two stages, which can be swapped between the alignment station and the exposure station. A first blowing unit blows temperature-adjusted gas toward the alignment station, a second blowing unit blows temperature-adjusted gas toward the exposure station, and an air curtain unit forms an air curtain between the alignment station and the exposure station. The air curtain unit includes a third blowing unit which is arranged between the alignment station and the exposure station and blows gas so as to form an air curtain to partition the alignment station and the exposure station, and a third temperature adjusting unit supplies temperature-adjusted gas to the third blowing unit.

Abstract: An exposure apparatus which includes a plurality of units to be temperature-regulated, and transfers a pattern of a reticle onto a substrate while activating the plurality of units is disclosed. The exposure apparatus comprising a plurality of flow passages which run parallel to each other and through which a fluid to temperature-regulate the plurality of units flows, a bypass line which runs parallel to the plurality of flow passages so as to bypass the plurality of flow passages, and a flow rate controller configured to control a flow rate of fluid flowing through the bypass line, so that a total flow rate of the fluid flowing through the plurality of flow passages and the bypass line becomes a target flow rate.

Abstract: An exposure apparatus having a projection optical system and configured to expose a substrate to light via a pattern of a mask and the projection optical system. The apparatus includes a chamber to hermetically contain at least part of the projection optical system, and a circulating system to send an inert gas to the chamber. A controller controls a temperature regulator on the basis of a target temperature in the chamber and a detection result of a temperature sensor. The controller changes the target temperature so that a timewise temperature gradient of the inert gas falls within an acceptable range. The acceptable range is determined so that a timewise change in pressure in the chamber caused by a timewise change in temperature of the inert gas is within an acceptable range.

Abstract: An apparatus for exposing a wafer with light. The apparatus includes a chamber for enclosing at least a portion of a path of the light, a circulation system having a fan unit, an inactive gas supplying path from the fan unit to the chamber, and an inactive gas return unit from the chamber to the fan unit, in which the circulation system is arranged to circulate an inactive gas through the chamber, and a control unit for controlling the fan unit. The control unit changes a revolution speed of the fan unit so that the gas pressure inside the chamber is held within a tolerance. A pressure loss at the return path is smaller than a positive pressure being set with respect to a gas pressure inside the chamber.

Abstract: An exposure apparatus is disclosed, which includes an alignment station where an alignment measurement process is executed, an exposure station where an exposure process is executed, and two stages which can be swapped between the alignment station and the exposure station. The exposure apparatus includes a first blowing unit which blows temperature-adjusted gas toward the alignment station, and a second blowing unit which blows temperature-adjusted gas toward the exposure station. The directions in which the first blowing unit and the second blowing unit blow the gases are substantially perpendicular to the direction along which the alignment station and the exposure station are arranged.

Abstract: Disclosed is an apparatus for exposing a wafer with light, which includes a chamber for enclosing at least a portion of a path of the light, and a circulation system having a fan unit, an inactive gas supplying path from the fan unit to the chambers and an inactive gas return unit from the chamber to the fan unit, the circulation system being arranged to circulate an inactive gas through the chamber, wherein a pressure loss at the return path is smaller than a positive pressure being set with respect to a gas pressure inside the chamber.

Abstract: An exposure apparatus for projecting a pattern of an original onto a substrate includes a chamber comprising at least a part of an optical element, and a circulating system for circulating a gas which is temperature-controlled through the chamber. The circulating system includes a unit for effecting at least one of heating and cooling of the gas, and a control system for changing an operation state of the unit so as to limit a timewise changing rate of a temperature in the chamber.