Abstract: A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

Abstract: A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern.

Abstract: A method of manufacturing a bonded body of a semiconductor substrate and a semiconductor device to be mounted on the semiconductor substrate are provided. The method includes: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in a vicinity of a surface of the bonding film to thereby obtain the bonded body.

Abstract: A method of manufacturing a bonded body of a semiconductor substrate and a semiconductor device to be mounted on the semiconductor substrate are provided. The method includes: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in a vicinity of a surface of the bonding film to thereby obtain the bonded body.

Abstract: A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

Abstract: A method of manufacturing a liquid crystal device provided with a liquid crystal layer held between a pair of substrates opposed to each other, and an oriented film disposed between at least one of the substrates and the liquid crystal layer, includes: (a) providing an inorganic oriented film to the one of the substrates; (b) forming a first organic film with a first silane-coupling agent, the first organic film randomly covering a surface of the inorganic oriented film with a predetermined coverage factor smaller than 1; and (c) forming, after step (b), a second organic film with a second silane-coupling agent having a carbon number different from a carbon number of the first silane-coupling agent, the second organic film covering the surface exposed from the first organic film, thereby forming the oriented film composed mainly of the first organic film, the second organic film, and the inorganic film.

Abstract: A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

Abstract: A method of manufacturing part of a microelectromechanical system (MEMS) and such part manufactured by the method are provided. The method comprises preparing first and second base members; imparting liquid repellency for a liquid material to at least part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member with the aid of the liquid repellency of the liquid repellent region; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first and second base members together through the bonding film due to a bonding property developed in the vicinity of a surface of the bonding film by applying energy thereto to obtain the bonded body.

Abstract: A method of manufacturing a bonded body is provided. The method comprising: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member with the aid of the liquid repellency of the liquid repellent region; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in the vicinity of a surface of the bonding film by applying energy thereto to thereby obtain the bonded body.

Abstract: A method of manufacturing a liquid crystal device provided with a liquid crystal layer held between a pair of substrates opposed to each other, and an oriented film disposed between at least one of the substrates and the liquid crystal layer, includes: (a) providing an inorganic oriented film to the one of the substrates; (b) forming a first organic film with a first silane-coupling agent, the first organic film randomly covering a surface of the inorganic oriented film with a predetermined coverage factor smaller than 1; and (c) forming, after step (b), a second organic film with a second silane-coupling agent having a carbon number different from a carbon number of the first silane-coupling agent, the second organic film covering the surface exposed from the first organic film, thereby forming the oriented film composed mainly of the first organic film, the second organic film, and the inorganic film.

Abstract: A coating method is provided for forming a liquid-repellent coat on a predetermined partial region of an inner surface of each through-hole of a nozzle plate. The nozzle plate is provided in an ink-jet head of an ink-jet printer. The coating method comprises the steps of: forming a coat preform on a region including the partial region of the inner surface; supplying a mask material having ultraviolet ray absorbability into the coated through-hole; irradiating ultraviolet rays onto the base material to partially decompose and remove the coat preform on the inner surface; and removing the mask material in the through-hole to obtain the nozzle plate partially coated with the liquid-repellent coat. The coat preform removal is conducted through the use of attenuation of the ultraviolet rays by means of the mask material or through the combined use of the ultraviolet ray attenuation and the presence/absence of the mask material.

Abstract: A method of manufacturing a bonded body by which two base members can be partially and firmly bonded together with high dimensional accuracy and can be efficiently bonded together at a low temperature, and a bonded body manufactured using such a method are provided. According to the manufacturing method, a first base member and a second base member are bonded together through a bonding film formed using a liquid material containing a silicone material composed of silicone compounds.

Abstract: A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern.

Abstract: A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

Abstract: A method for producing a nozzle plate comprises a liquid-repellant coat removal step for conducting a plasma treatment to each chip from a same side as a liquid droplet ejecting surface under an atmospheric pressure, while supplying a gaseous mask material for protection of the liquid-repellant coat through nozzle holes from an opposite side of the liquid droplet ejecting surface in such a manner that the gaseous mask material is leaked out over the liquid droplet ejecting surface around the nozzle holes, to thereby remove the liquid-repellant coat exposed outside the mask material; and a bonding step for bonding each chip to the nozzle plate body at the area from which the liquid-repellant coat is removed by the liquid-repellant coat removal step.

Abstract: A solvent removal apparatus and method is provided that can dry a coat on a workpiece in a uniform thickness. The solvent removal apparatus includes a support base for supporting a substrate provided with a liquid phase film-forming coat containing a film material and a solvent, a gas introduction mechanism for introducing a solvent removal gas toward a center part of the substrate, and a flow restrictor for restricting flow of the solvent removal gas in such a manner that the gas can flow radially outward from the center part of the substrate toward a peripheral edge part thereof. The solvent is removed from the coat while restricting the flow of the gas with the flow restrictor.

Abstract: A method for evaluating lyophobicity of an inner wall of a fine tube having a lyophobic film formed on the inner wall includes a step of setting up a fine tube having a lyophobic film extending from an end of the inner wall of the fine tube to a predetermined position of the inner wall, in a liquid placed in a unit in such a manner that the lyophobic film is positioned uppermost and also includes a step of measuring the position of the liquid surface of the liquid that has risen in the fine tube and then stopped and then determining the position of the lower end of the lyophobic film.

Abstract: The present invention provides a member comprising a substrate, an undercoat film formed on a surface of the substrate, and a liquid-repellent film of metal alkoxide formed on a surface of the undercoat film. Also disclosed are nozzle head, liquid-jet head and liquid-jet device employing the above-described member.

Abstract: A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.

Abstract: An object is to provide a mask formation method, which can curtail a manufacturing cost. A method of forming a film of predetermined pattern on the front surface of a member to-be-processed is so constructed as to carry out the step (S178) of improving the adherence of a pattern material solution to the member to-be-processed, the step (S180) of filling up a pattern forming recess provided in a mask on the surface of the member to-be-processed with a pattern material solution, the step (S186) of improving the film quality of the pattern film to-be-formed by processing the pattern material solution, the step (S188) of removing the pattern material solution having adhered on the mask, the step (S190) of drying the pattern material solution, and the step (S196) of subjecting the pattern film to annealing processing.