Abstract: In an ultraviolet light emitting device, a fluororesin layer includes an element covering portion that covers a second surface of an ultraviolet light emitting element, and a substrate covering portion that covers a mounting surface of a substrate. The substrate covering portion includes a flat portion having a flat surface. A distance from a point in the element covering portion farthest from the second surface of the ultraviolet light emitting element to the second surface of the ultraviolet light emitting element is 1.3 times or more and 5 times or less a distance from the flat surface of the flat portion of the substrate covering portion to the mounting surface of the substrate.

Abstract: An ultraviolet light emitting device includes a substrate, an ultraviolet light emitting element, a bonding layer, a fluororesin film, and a fluorocarbon compound. The substrate includes a mounting surface. The ultraviolet light emitting element includes a first surface, a second surface, and a side surface. The bonding layer bonds the electrode on the first surface of the ultraviolet light emitting element and a part of the mounting surface of the substrate. The fluororesin film is a flexible material configured to transmit ultraviolet light. The substrate and the fluororesin film are disposed in a state where the ultraviolet light emitting element is sandwiched therebetween. The fluorocarbon compound is a liquid at normal temperature and pressure. The fluorocarbon compound fills a gap between the side surface of the ultraviolet light emitting element and the fluororesin film in a state of being in contact with the side surface and the fluororesin film.

Abstract: The bonding layer bonds the electrode on the first surface of the ultraviolet light emitting element and a part of the mounting surface of the substrate. The adhesive layer adheres the substrate to the light transmitting member. The substrate and the light transmitting member are disposed in a state where the ultraviolet light emitting element is sandwiched therebetween. The fluorocarbon compound is a liquid at normal temperature and pressure. The fluorocarbon compound fills a gap between the second surface of the ultraviolet light emitting element and the light transmitting member in a state of being in contact with the second surface and the light transmitting member. The fluorocarbon compound is in contact with the side surface of the ultraviolet light emitting element. The fluorocarbon compound is not in contact with the adhesive layer.

Abstract: Four LED chips are mounted on a sub-mount substrate so as to be parallel thereto. A wire 9a is installed to extend between a pad electrode 7a of two pad electrodes 7a, 7b provided in two diagonal corners of an upper surface of the LED chip 1 which pad electrode 7a is disposed on a first edge 1a side of the LED chip 1 and a bonding area of a conductive pattern 13 so as to be inclined at 15 to 40 degrees towards an orientation which moves away from a first edge 1a with respect to an orthogonal moving-away direction D relative to the first edge 1a. A wire 9b is installed to extend between the pad electrode 7b which is disposed on a second edge 1b side of the LED chip 1 and a bonding area of the conductive pattern 1 so as to be inclined 15 to 40 degrees towards an orientation which approaches a second edge 1b of the LED chip 1 with respect to an orthogonal moving-away direction D relative to the second edge 1b.

Abstract: Four LED chips are mounted on a sub-mount substrate so as to be parallel thereto. A wire 9a is installed to extend between a pad electrode 7a of two pad electrodes 7a, 7b provided in two diagonal corners of an upper surface of the LED chip 1 which pad electrode 7a is disposed on a first edge 1a side of the LED chip 1 and a bonding area of a conductive pattern 13 so as to be inclined at 15 to 40 degrees towards an orientation which moves away from a first edge 1a with respect to an orthogonal moving-away direction D relative to the first edge 1a. A wire 9b is installed to extend between the pad electrode 7b which is disposed on a second edge 1b side of the LED chip 1 and a bonding area of the conductive pattern 1 so as to be inclined 15 to 40 degrees towards an orientation which approaches a second edge 1b of the LED chip 1 with respect to an orthogonal moving-away direction D relative to the second edge 1b.