Abstract: An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.

Abstract: A resin for forming an insulating film includes at least one of a modified polyamide-imide having a terminal OH group or a terminal SH group and a modified polyimide having a terminal OH group or a terminal SH group. A varnish includes the resin for forming an insulating film and a solvent. An electrodeposition dispersion includes the resin for forming an insulating film, a polar solvent, water, a poor solvent, and a base. A method for producing an insulated conductor includes: a step of applying the varnish or electrodepositing the electrodeposition dispersion to a surface of a conductor to form a coating layer or an electrodeposition layer on the surface of the conductor; and a step of heating the coating layer or the electrodeposition layer to produce an insulating film and bake the insulating film on the conductor.

Abstract: A water-based electrodeposition dispersion for forming an insulating film contains polymer particles, an organic solvent, a basic compound, and water, the polymer particles are made of polyamide-imide, and the basic compound is a nitrogen-containing compound in which the HSP distance from water is 35 or greater.

Abstract: A water-dispersed electrodeposition solution (11) for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water. The polymer particles are made of: any one of; or both of polyamide-imide and polyester-imide, main chains thereof being free of an anionic group, a number-based median diameter D50 of the polymer particles is 0.05 ?m to 0.5 ?m, and polymer particles having a particle size within ?30% to +30% of the number-based median diameter D50 are 50% or more of all of the polymer particles on a number basis.

Abstract: An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a fluorine-containing resin composition layer including a cured product of a thermosetting resin and a fluororesin and a fluorine concentration gradient layer which is disposed between the conductor and the fluorine-containing resin composition layer, includes a cured product of a thermosetting resin and a fluororesin, and is provided with a concentration gradient in which a fluorine atom content decreases from the fluorine-containing resin composition layer side toward the conductor.

Abstract: There is provided an insulated electric wire formed by covering a rectangular conductor wire having a rectangular cross-sectional shape with an insulating film. The insulating film is formed of an inner layer covering a surface of the rectangular conductor wire, and an outer layer covering a surface of the inner layer. A thickness (t1) of a section of the inner layer, which covers one short side of two facing short sides of the same length of a rectangular cross section of the rectangular conductor wire, is greater than a thickness (t2) (including that t2=0) of a section of the inner layer which covers the other short side. An elastic modulus and/or a yield stress of the inner layer are less than an elastic modulus and/or a yield stress of the outer layer.

Abstract: This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.

Abstract: An electrodeposition dispersion of the present invention is formed of a dispersion medium and a solid content. The solid content includes polyimide-based resin particles and fluorine resin particles. Also, a content ratio of the fluorine resin particles in the solid content is 20 to 70% by mass. In addition, a median diameter of the polyimide-based resin particles is 50 to 400 nm.

Abstract: The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 ?m from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.

Abstract: Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100° C. and D(S-P) represented by a formula (1) satisfying a relationship of D(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 10×104 to 30×104 or a number-average molecular weight of the polyamide-imide is 2×104 to 5×104.

Abstract: The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 ?m from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.

Abstract: A water-based electrodeposition dispersion for forming an insulating film contains polymer particles, an organic solvent, a basic compound, and water, the polymer particles are made of polyamide-imide, and the basic compound is a nitrogen-containing compound in which the HSP distance from water is 35 or greater.

Abstract: A water-dispersed electrodeposition solution (11) for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water. The polymer particles are made of: any one of; or both of polyamide-imide and polyester-imide, main chains thereof being free of an anionic group, a number-based median diameter D50 of the polymer particles is 0.05 ?m to 0.5 ?m, and polymer particles having a particle size within ?30% to +30% of the number-based median diameter D50 are 50% or more of all of the polymer particles on a number basis.

Abstract: A method for producing an insulated electric wire of the present invention is a method for forming an insulating coating film on a surface of an electric wire by performing baking treatment after forming an insulating layer on the surface of the electric wire by an electrodeposition method using an insulating electrodeposition coating material containing a polymer. Pretreatment of evaporating a solvent in the insulating layer is performed before the baking treatment, and the pretreatment is performed by a near infrared ray heating furnace. In addition, a temperature of the pretreatment is lower than a temperature of the baking treatment.

Abstract: This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.

Abstract: A method for producing an electrodeposition coated article, in which an insulating film is formed by forming an insulating layer on a surface of an article to be coated according to an electrodeposition method by using an electrodeposition coating material, and then by performing a baking treatment, the electrodeposition coating material contains a solvent containing polyamide imide and an organic solvent added to the electrodeposition coating material, a boiling point of the organic solvent is higher than 100° C., and a Hansen solubility parameter is similar to the polyamide imide and has high compatibility.

Abstract: It is possible to produce a ferroelectric thin film controlled to have the preferential crystal orientation in the (100) plane with a simple process without providing a seed layer or a buffer layer. A ferroelectric thin film is produced on a lower electrode by irradiating a surface of the lower electrode of a substrate having the lower electrode where the crystal plane is oriented in a (111) axis direction, with an atmospheric pressure plasma, coating a composition for forming a ferroelectric thin film on the lower electrode, and heating and crystallizing the coated composition.

Abstract: A method of manufacturing a ferroelectric thin film on a lower electrode by electrostatically spraying a ferroelectric thin film-forming electrostatic spray solution so as to coat the electrostatic spray solution on the lower electrode and form a coated film, drying, calcining, and then firing the coated film so as to crystallize the coated film. In this method, the electrostatic spray solution is a mixed solution in which a ferroelectric thin film-forming sol-gel solution and powder having the same composition as the solid content of the sol-gel solution and having a particle diameter that can be ejected from the spout are uniformly mixed, and, when the metallic compound-converted mass of a metallic compound dissolved in the sol-gel solution is represented by A and the mass of the powder is represented by B, a ratio of B with respect to (A+B) is in a range of 5% to 40%.

Abstract: A method of manufacturing a ferroelectric thin film on a lower electrode by electrostatically spraying a ferroelectric thin film-forming electrostatic spray solution so as to coat the electrostatic spray solution on the lower electrode and form a coated film, drying, calcining, and then firing the coated film so as to crystallize the coated film. In this method, the electrostatic spray solution is a mixed solution in which a ferroelectric thin film-forming sol-gel solution and powder having the same composition as the solid content of the sol-gel solution and having a particle diameter that can be ejected from the spout are uniformly mixed, and, when the metallic compound-converted mass of a metallic compound dissolved in the sol-gel solution is represented by A and the mass of the powder is represented by B, a ratio of B with respect to (A+B) is in a range of 5% to 40%.

Abstract: It is possible to produce a ferroelectric thin film controlled to have the preferential crystal orientation in the (100) plane with a simple process without providing a seed layer or a buffer layer. A ferroelectric thin film is produced on a lower electrode by irradiating a surface of the lower electrode of a substrate having the lower electrode where the crystal plane is oriented in a (111) axis direction, with an atmospheric pressure plasma, coating a composition for forming a ferroelectric thin film on the lower electrode, and heating and crystallizing the coated composition.