Patents by Inventor Shintaro Iida

Shintaro Iida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200399778
    Abstract: An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.
    Type: Application
    Filed: November 20, 2018
    Publication date: December 24, 2020
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Publication number: 20200347185
    Abstract: A resin for forming an insulating film includes at least one of a modified polyamide-imide having a terminal OH group or a terminal SH group and a modified polyimide having a terminal OH group or a terminal SH group. A varnish includes the resin for forming an insulating film and a solvent. An electrodeposition dispersion includes the resin for forming an insulating film, a polar solvent, water, a poor solvent, and a base. A method for producing an insulated conductor includes: a step of applying the varnish or electrodepositing the electrodeposition dispersion to a surface of a conductor to form a coating layer or an electrodeposition layer on the surface of the conductor; and a step of heating the coating layer or the electrodeposition layer to produce an insulating film and bake the insulating film on the conductor.
    Type: Application
    Filed: November 20, 2018
    Publication date: November 5, 2020
    Inventors: Koji Hirano, Shintaro Iida, Hideaki Sakurai
  • Patent number: 10800942
    Abstract: A water-based electrodeposition dispersion for forming an insulating film contains polymer particles, an organic solvent, a basic compound, and water, the polymer particles are made of polyamide-imide, and the basic compound is a nitrogen-containing compound in which the HSP distance from water is 35 or greater.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: October 13, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Jyunko Isomura, Shintaro Iida, Hideaki Sakurai
  • Patent number: 10781320
    Abstract: A water-dispersed electrodeposition solution (11) for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water. The polymer particles are made of: any one of; or both of polyamide-imide and polyester-imide, main chains thereof being free of an anionic group, a number-based median diameter D50 of the polymer particles is 0.05 ?m to 0.5 ?m, and polymer particles having a particle size within ?30% to +30% of the number-based median diameter D50 are 50% or more of all of the polymer particles on a number basis.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: September 22, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Publication number: 20200251255
    Abstract: An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a fluorine-containing resin composition layer including a cured product of a thermosetting resin and a fluororesin and a fluorine concentration gradient layer which is disposed between the conductor and the fluorine-containing resin composition layer, includes a cured product of a thermosetting resin and a fluororesin, and is provided with a concentration gradient in which a fluorine atom content decreases from the fluorine-containing resin composition layer side toward the conductor.
    Type: Application
    Filed: November 20, 2018
    Publication date: August 6, 2020
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Publication number: 20200035407
    Abstract: There is provided an insulated electric wire formed by covering a rectangular conductor wire having a rectangular cross-sectional shape with an insulating film. The insulating film is formed of an inner layer covering a surface of the rectangular conductor wire, and an outer layer covering a surface of the inner layer. A thickness (t1) of a section of the inner layer, which covers one short side of two facing short sides of the same length of a rectangular cross section of the rectangular conductor wire, is greater than a thickness (t2) (including that t2=0) of a section of the inner layer which covers the other short side. An elastic modulus and/or a yield stress of the inner layer are less than an elastic modulus and/or a yield stress of the outer layer.
    Type: Application
    Filed: February 21, 2018
    Publication date: January 30, 2020
    Inventors: Makoto Urushihara, Yasuhiko Kudo, Shintaro Iida, Hideaki Sakurai
  • Patent number: 10546670
    Abstract: This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: January 28, 2020
    Assignee: Mitsubishi Materials Corporation
    Inventors: Reiko Izumi, Shintaro Iida, Hideaki Sakurai, Takeshi Ikeda, Ken Hayashii
  • Publication number: 20190323140
    Abstract: An electrodeposition dispersion of the present invention is formed of a dispersion medium and a solid content. The solid content includes polyimide-based resin particles and fluorine resin particles. Also, a content ratio of the fluorine resin particles in the solid content is 20 to 70% by mass. In addition, a median diameter of the polyimide-based resin particles is 50 to 400 nm.
    Type: Application
    Filed: February 13, 2018
    Publication date: October 24, 2019
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Patent number: 10395798
    Abstract: The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 ?m from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: August 27, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Reiko Izumi, Hideaki Sakurai, Ken Hayashii, Keiko Ashida
  • Publication number: 20190032238
    Abstract: Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100° C. and D(S-P) represented by a formula (1) satisfying a relationship of D(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 10×104 to 30×104 or a number-average molecular weight of the polyamide-imide is 2×104 to 5×104.
    Type: Application
    Filed: February 14, 2017
    Publication date: January 31, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koji HIRANO, Shintaro IIDA, Jyunko HIRATA, Hideaki SAKURAI
  • Publication number: 20180366241
    Abstract: The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 ?m from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.
    Type: Application
    Filed: December 16, 2015
    Publication date: December 20, 2018
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro IIDA, Reiko IZUMI, Hideaki SAKURAI, Ken HAYASHII, Keiko ASHIDA
  • Publication number: 20180362802
    Abstract: A water-based electrodeposition dispersion for forming an insulating film contains polymer particles, an organic solvent, a basic compound, and water, the polymer particles are made of polyamide-imide, and the basic compound is a nitrogen-containing compound in which the HSP distance from water is 35 or greater.
    Type: Application
    Filed: September 27, 2016
    Publication date: December 20, 2018
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Jyunko ISOMURA, Shintaro IIDA, Hideaki SAKURAI
  • Publication number: 20180127600
    Abstract: A water-dispersed electrodeposition solution (11) for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water. The polymer particles are made of: any one of; or both of polyamide-imide and polyester-imide, main chains thereof being free of an anionic group, a number-based median diameter D50 of the polymer particles is 0.05 ?m to 0.5 ?m, and polymer particles having a particle size within ?30% to +30% of the number-based median diameter D50 are 50% or more of all of the polymer particles on a number basis.
    Type: Application
    Filed: May 17, 2016
    Publication date: May 10, 2018
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro IIDA, Hideaki SAKURAI
  • Publication number: 20180012684
    Abstract: A method for producing an insulated electric wire of the present invention is a method for forming an insulating coating film on a surface of an electric wire by performing baking treatment after forming an insulating layer on the surface of the electric wire by an electrodeposition method using an insulating electrodeposition coating material containing a polymer. Pretreatment of evaporating a solvent in the insulating layer is performed before the baking treatment, and the pretreatment is performed by a near infrared ray heating furnace. In addition, a temperature of the pretreatment is lower than a temperature of the baking treatment.
    Type: Application
    Filed: February 5, 2016
    Publication date: January 11, 2018
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro IIDA, Hideaki SAKURAI
  • Publication number: 20170278595
    Abstract: This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.
    Type: Application
    Filed: September 28, 2015
    Publication date: September 28, 2017
    Applicants: Mitsubishi Materials Corporation, Mitsubishi Cable Industries, Ltd.
    Inventors: Reiko IZUMI, Shintaro IIDA, Hideaki SAKURAI, Takeshi IKEDA, Ken HAYASHII
  • Publication number: 20170267874
    Abstract: A method for producing an electrodeposition coated article, in which an insulating film is formed by forming an insulating layer on a surface of an article to be coated according to an electrodeposition method by using an electrodeposition coating material, and then by performing a baking treatment, the electrodeposition coating material contains a solvent containing polyamide imide and an organic solvent added to the electrodeposition coating material, a boiling point of the organic solvent is higher than 100° C., and a Hansen solubility parameter is similar to the polyamide imide and has high compatibility.
    Type: Application
    Filed: July 30, 2015
    Publication date: September 21, 2017
    Inventors: Shintaro Iida, Hideaki Sakurai, Hiroyuki Kamibayashi, Toyokazu Nagato
  • Patent number: 9040312
    Abstract: It is possible to produce a ferroelectric thin film controlled to have the preferential crystal orientation in the (100) plane with a simple process without providing a seed layer or a buffer layer. A ferroelectric thin film is produced on a lower electrode by irradiating a surface of the lower electrode of a substrate having the lower electrode where the crystal plane is oriented in a (111) axis direction, with an atmospheric pressure plasma, coating a composition for forming a ferroelectric thin film on the lower electrode, and heating and crystallizing the coated composition.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: May 26, 2015
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Patent number: 9017770
    Abstract: A method of manufacturing a ferroelectric thin film on a lower electrode by electrostatically spraying a ferroelectric thin film-forming electrostatic spray solution so as to coat the electrostatic spray solution on the lower electrode and form a coated film, drying, calcining, and then firing the coated film so as to crystallize the coated film. In this method, the electrostatic spray solution is a mixed solution in which a ferroelectric thin film-forming sol-gel solution and powder having the same composition as the solid content of the sol-gel solution and having a particle diameter that can be ejected from the spout are uniformly mixed, and, when the metallic compound-converted mass of a metallic compound dissolved in the sol-gel solution is represented by A and the mass of the powder is represented by B, a ratio of B with respect to (A+B) is in a range of 5% to 40%.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: April 28, 2015
    Assignee: Mitsubishi Materials Corporation
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Publication number: 20150064359
    Abstract: A method of manufacturing a ferroelectric thin film on a lower electrode by electrostatically spraying a ferroelectric thin film-forming electrostatic spray solution so as to coat the electrostatic spray solution on the lower electrode and form a coated film, drying, calcining, and then firing the coated film so as to crystallize the coated film. In this method, the electrostatic spray solution is a mixed solution in which a ferroelectric thin film-forming sol-gel solution and powder having the same composition as the solid content of the sol-gel solution and having a particle diameter that can be ejected from the spout are uniformly mixed, and, when the metallic compound-converted mass of a metallic compound dissolved in the sol-gel solution is represented by A and the mass of the powder is represented by B, a ratio of B with respect to (A+B) is in a range of 5% to 40%.
    Type: Application
    Filed: November 10, 2014
    Publication date: March 5, 2015
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Publication number: 20140141531
    Abstract: It is possible to produce a ferroelectric thin film controlled to have the preferential crystal orientation in the (100) plane with a simple process without providing a seed layer or a buffer layer. A ferroelectric thin film is produced on a lower electrode by irradiating a surface of the lower electrode of a substrate having the lower electrode where the crystal plane is oriented in a (111) axis direction, with an atmospheric pressure plasma, coating a composition for forming a ferroelectric thin film on the lower electrode, and heating and crystallizing the coated composition.
    Type: Application
    Filed: October 23, 2013
    Publication date: May 22, 2014
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai