Abstract: A power control apparatus includes a busbar unit which supports a plurality of busbars connected to a plurality of semiconductor modules. The busbar includes a first plate shaped portion and a second plate shaped portion. The first plate shaped portion is adjacent to a cooling device in a posture facing an internal passage of the cooling device in the plate thickness direction. The second plate shaped portion is placed in a posture in which a plate thickness direction thereof intersects with a plate thickness direction of the first plate shaped portion. The second plate shaped portion has outer surfaces including a side surface having a narrower width corresponding to a plate thickness. The second plate shaped portion is placed in a posture in which the side surface faces the semiconductor module.

Abstract: A sealing structure includes: a case that stores an in-vehicle electronic component and has an opening; and a first cover member that covers the opening of the case. The case includes: an protrusion member that has a sealing surface protruded to surround the opening; and a rib that is protruded on an opposite side of the opening with the protrusion member interposed therebetween. The rib has a discharge surface that is connected to the sealing surface of the protrusion member. The first cover member has an extension member that extends along the rib. The discharge surface of the rib is located to be lower than the sealing surface of the protrusion member while the case is arranged with the opening facing upward, and the extension member of the first cover member extends to be lower than the discharge surface of the rib.

Abstract: A reactor cooling device includes a housing, a reactor arranged in the housing, and a rotating body which is rotationally located below the reactor in the housing. The rotating body and the reactor are located so as to at least partially overlap with each other in a previously selected one of turning radius directions of the rotating body. A part of the rotating body is immersed in the coolant stored in the housing. The reactor cooling device is configured to cause a part of the coolant splashed by the rotation of the rotating body to be in contact with the reactor to thereby cool the reactor.

Abstract: In a power converter, busbars are connected to respective power terminals. The power terminals include at least one narrow power terminal. The at least one narrow power terminal includes a first portion having a first thermal resistance and a first rigidity, and a second portion having a second thermal resistance and a second rigidity, the second thermal resistance being higher than the first thermal resistance, the second rigidity being smaller than the first rigidity.

Abstract: In a power converter, an insulation member is interposed between a first overlap portion of the near DC busbar and a second overlap portion of the far DC busbar in a protrusion direction. The first overlap portion is located closer to the converter component in the protrusion direction than the second overlap portion is. A near DC terminal is arranged to be closer to the first and second overlap portions than a far DC terminal is in an arrangement direction perpendicular to both the stack and protrusion directions. The near and far DC busbars are joined to the respective near and far DC terminals. The far DC busbar is joined to the far DC terminals of the respective semiconductor modules while bypassing the near DC terminals of the respective semiconductor modules.

Abstract: A sealing structure includes: a case that stores an in-vehicle electronic component and has an opening; and a first cover member that covers the opening of the case. The case includes: an protrusion member that has a sealing surface protruded to surround the opening; and a rib that is protruded on an opposite side of the opening with the protrusion member interposed therebetween. The rib has a discharge surface that is connected to the sealing surface of the protrusion member. The first cover member has an extension member that extends along the rib. The discharge surface of the rib is located to be lower than the sealing surface of the protrusion member while the case is arranged with the opening facing upward, and the extension member of the first cover member extends to be lower than the discharge surface of the rib.

Abstract: A reactor cooling device includes a housing, a reactor arranged in the housing, and a rotating body which is rotationally located below the reactor in the housing. The rotating body and the reactor are located so as to at least partially overlap with each other in a previously selected one of turning radius directions of the rotating body. A part of the rotating body is immersed in the coolant stored in the housing. The reactor cooling device is configured to cause a part of the coolant splashed by the rotation of the rotating body to be in contact with the reactor to thereby cool the reactor.

Abstract: In a power converter, busbars are connected to respective power terminals. The power terminals include at least one narrow power terminal. The at least one narrow power terminal includes a first portion having a first thermal resistance and a first rigidity, and a second portion having a second thermal resistance and a second rigidity, the second thermal resistance being higher than the first thermal resistance, the second rigidity being smaller than the first rigidity.

Abstract: In a power converter, an insulation member is interposed between a first overlap portion of the near DC busbar and a second overlap portion of the far DC busbar in a protrusion direction. The first overlap portion is located closer to the converter component in the protrusion direction than the second overlap portion is. A near DC terminal is arranged to be closer to the first and second overlap portions than a far DC terminal is in an arrangement direction perpendicular to both the stack and protrusion directions. The near and far DC busbars are joined to the respective near and far DC terminals. The far DC busbar is joined to the far DC terminals of the respective semiconductor modules while bypassing the near DC terminals of the respective semiconductor modules.

Abstract: An electric power converter includes a semiconductor module, a first electronic circuit board, a second electronic circuit board, and a container that contains the first electronic circuit board and the second electronic circuit board. The container has a first fixing portion to which the first electronic circuit board is fixed and a second fixing portion to which the second electronic circuit board is fixed. The electric power converter is configured such that the second electronic circuit board does not intervene between the first fixing portion of the container and the first electronic circuit board in the board thickness direction and the first electronic circuit board does not intervene between the second fixing portion of the container and the second electronic circuit board in the board thickness direction.

Abstract: An electric power converter includes a semiconductor module, a first electronic circuit board, a second electronic circuit board, and a container that contains the first electronic circuit board and the second electronic circuit board. The container has a first fixing portion to which the first electronic circuit board is fixed and a second fixing portion to which the second electronic circuit board is fixed. The electric power converter is configured such that the second electronic circuit board does not intervene between the first fixing portion of the container and the first electronic circuit board in the board thickness direction and the first electronic circuit board does not intervene between the second fixing portion of the container and the second electronic circuit board in the board thickness direction.