Patents by Inventor Shintaro Komatsu

Shintaro Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110245413
    Abstract: A liquid-crystalline polymer composition containing a liquid-crystalline polymer and a magnetic filler formed by heat-treating a composite material of a ceramic powder and a soft magnetic metal powder in an inert gas atmosphere.
    Type: Application
    Filed: March 25, 2011
    Publication date: October 6, 2011
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Shintaro KOMATSU, Hiroshi HARADA
  • Publication number: 20090253847
    Abstract: The present invention provides a resin composition comprising (A) a thermoplastic resin, (B) alumina fine particles and (C) a plate-like filler, wherein the component (B) is contained in the larger amount than the amount of the component (C) in the composition, and the resin composition has a specific volume resistance of 1×1010 ?m or more.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 8, 2009
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Shintaro KOMATSU, Mitsuo MAEDA, Hiroshi HARADA
  • Publication number: 20090069483
    Abstract: The present invention provides a resin composition comprising: (A) a thermoplastic resin, (B) a granular material which has a number average particle diameter of 0.5 to 5 mm and is obtainable by granulating a fiber mainly having alumina with a number average fiber diameter of 1 to 50 ?m, and (C) a filler composed of a material of which electric resistivity at 300 K is 102 ?m or less. The resin composition can be molded into a molded article with electric insulation. The electric resistivity of the molded article has sufficient electric insulation in applications such as in electric and electronic parts.
    Type: Application
    Filed: August 28, 2008
    Publication date: March 12, 2009
    Inventors: Shintaro Komatsu, Mitsuo Maeda, Hiroshi Harada
  • Publication number: 20080021146
    Abstract: A thermal-conductive resin composition which can provide an molded article excellent in thermal conductivity and/or mechanical strength is provided. The resin composition comprising a resin selected from a thermosetting resin and a thermoplastic resin; a granule having a number average particle diameter of 0.5 to 5 mm and comprising alumina fibers with a number average fiber diameter of 1 to 50 ?m; and an alumina fine particle.
    Type: Application
    Filed: July 23, 2007
    Publication date: January 24, 2008
    Applicant: Sumitomo Chemical Company, Limited
    Inventors: Shintaro Komatsu, Mitsuo Maeda, Hiroshi Harada
  • Publication number: 20070225420
    Abstract: Granules useful for highly thermal-conductive resin composition are provided. The Granules have a number average particle diameter of 0.5 to 5 mm, obtained by granulating fibers mainly containing fibers selected from alumina fibers and carbon fibers, wherein the fibers to be granulated have a number average fiber diameter of 1 to 50 ?m.
    Type: Application
    Filed: March 20, 2007
    Publication date: September 27, 2007
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Shintaro Komatsu, Mitsuo Maeda