Patents by Inventor Shintaro Komitsu
Shintaro Komitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8415444Abstract: The present invention has its object to provide a curable composition not containing any organotin type curing catalyst of concern because of the toxic feature thereof, or any volatile compound, excellent in curability and storage stability and, further, capable of providing cured products excellent in strength and elongation. The above object can be achieved by a curable composition which includes: an organic polymer (A) containing a hydrolyzable silyl group in a molecule; an amidine compound (B); a plasticizer (C); and an amino group-containing silane coupling agent (D), wherein the amidine compound (B) is preliminarily mixed and dissolved and/or dispersed in the plasticizer (C) and the amino group-containing silane coupling agent (D), and the resultant mixture is added to the reactive silyl group-containing polymer (A).Type: GrantFiled: December 21, 2007Date of Patent: April 9, 2013Assignee: Kaneka CorporationInventors: Ayako Yano, Noriko Matsushita, Takeshi Sonoda, Shintaro Komitsu
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Patent number: 8022149Abstract: The present invention provides a solution to a problem that a composition including a reactive silicon group-containing polyether undergoes red coloration. More specifically, in a reactive silicon group-containing organic polymer which contains Co, the problem concerned is solved by limiting the Co content to 0.5 ppm or less. As the reactive silicon group-containing organic polymer, for example, a reactive silicon group-containing polyether (A) or a mixture of the reactive silicon group-containing polyether (A) and a vinyl polymer (B) may be cited. The reactive silicon group-containing polyether (A) is obtained, for example, by reacting a polyether or a derivative thereof which contains Co in a content of 0.5 ppm or less with a silane compound which has a group capable of reacting with the polyether or the derivative thereof and has a hydrolyzable group.Type: GrantFiled: April 23, 2004Date of Patent: September 20, 2011Assignee: Kaneka CorporationInventors: Kazuhiko Ueda, Jun Hattori, Shintaro Komitsu
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Patent number: 8008386Abstract: The present invention has its object to provide a curable composition not containing any organotin type curing catalyst currently of concern because of the toxic feature thereof, or any volatile compound, excellent in curability and storage stability and, further, capable of providing cured products excellent in strength and elongation; the above object can be achieved by a curable composition which includes: an organic polymer (A) containing a hydrolyzable silyl group in a molecule; an amidine compound (B); and a compound (C) containing a sulfonyl group in a molecule.Type: GrantFiled: December 20, 2007Date of Patent: August 30, 2011Assignee: Kaneka CorporationInventors: Ayako Yano, Noriko Matsushita, Shintaro Komitsu
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Patent number: 7919182Abstract: The problem of the present invention is to provide a pressure-sensitive adhesive sheet for skin adhesion, having an adhesive layer, which can be formed without using an organic solvent, shows superior adhesion performance to the skin, and shows extremely mild irritation to the skin and stratum corneum damage. To solve the problem, the present invention provides a pressure-sensitive adhesive sheet for skin adhesion, which has a substrate and an adhesive layer laminated on the substrate, wherein the adhesive layer is obtained by curing an adhesive composition containing polyether polymer (A) having at least one alkenyl group on the terminal, compound (B) having 1-10 hydrosilyl groups in a molecule and hydrosilylation catalyst (C).Type: GrantFiled: September 29, 2004Date of Patent: April 5, 2011Assignees: Nitto Denko Corporation, Kaneka CorporationInventors: Atsushi Hamada, Takashi Kinoshita, Kenji Furumori, Kazuhiko Ueda, Shintaro Komitsu
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Patent number: 7838586Abstract: By further incorporating a reductant into a composition including an oxyalkylene polymer prepared by polymerization in the presence of a cobalt-containing double metal cyanide complex catalyst; and an acrylic polymer prepared by radical polymerization in the presence of a mercapto group-containing compound, a resin composition in which excessive coloration is prevented and that is suitably used for an adhesive or the like is prepared.Type: GrantFiled: April 21, 2004Date of Patent: November 23, 2010Assignee: Kaneka CorporationInventors: Jun Hattori, Kazuhiko Ueda, Shintaro Komitsu
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Patent number: 7718749Abstract: The invention aims to improve surface tackiness of a curable composition comprising a reactive silicon group-containing polyoxypropylene polymer without decreasing coating workability, strength, adhesion and appearance. As one embodiment of a means for resolution, a curable composition comprising (A) 100 parts by weight of a reactive silicon group-containing polyoxypropylene polymer, (B) from 0.1 to 20 parts by weight of a silane coupling agent, (C) from 0.1 to 80 parts by weight of an epoxy group-containing compound, (D) from 0.1 to 60 parts by weight of a tertiary amine, and (E) from 0.1 to 30 parts by weight of a primary or secondary amine having a melting point of 20° C. or more is mentioned.Type: GrantFiled: December 9, 2004Date of Patent: May 18, 2010Assignee: Kaneka CorporationInventors: Katsuhiro Ando, Shintaro Komitsu
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Publication number: 20100063215Abstract: The present invention has its object to provide a curable composition not containing any organotin type curing catalyst currently of concern because of the toxic feature thereof, or any volatile compound, excellent in curability and storage stability and, further, capable of providing cured products excellent in strength and elongation; the above object can be achieved by a curable composition which includes: an organic polymer (A) containing a hydrolyzable silyl group in a molecule; an amidine compound (B); and a compound (C) containing a sulfonyl group in a molecule.Type: ApplicationFiled: December 20, 2007Publication date: March 11, 2010Applicant: KANEKA CORPORATIONInventors: Ayako Yano, Noriko Matsushita, Shintaro Komitsu
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Publication number: 20100004367Abstract: The present invention has its object to provide a curable composition not containing any organotin type curing catalyst of concern because of the toxic feature thereof, or any volatile compound, excellent in curability and storage stability and, further, capable of providing cured products excellent in strength and elongation. The above object can be achieved by a curable composition which includes: an organic polymer (A) containing a hydrolyzable silyl group in a molecule; an amidine compound (B); a plasticizer (C); and an amino group-containing silane coupling agent (D), wherein the amidine compound (B) is preliminarily mixed and dissolved and/or dispersed in the plasticizer (C) and the amino group-containing silane coupling agent (D), and the resultant mixture is added to the reactive silyl group-containing polymer (A).Type: ApplicationFiled: December 21, 2007Publication date: January 7, 2010Applicant: KANEKA CORPORATIONInventors: Ayako Yano, Noriko Matsushita, Takeshi Sonoda, Shintaro Komitsu
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Patent number: 7473441Abstract: Provided is a curable composition comprising a reactive silicon group-containing polyoxyalkylene polymer (A), such as a reactive silicon group-containing polyoxypropylene; a reactive silicon group-containing vinyl polymer (B), such as a reactive silicon group-containing (meth)acrylate polymer; and a polyoxyalkylene plasticizer (C) having a low molecular weight, such as polyoxypropylene, the curable composition providing a rubber-like cured object by crosslinking reaction in the presence of moisture. Also provided is a method for sealing ceramic siding boards comprising applying the curable composition as a sealant and curing the curable composition.Type: GrantFiled: July 9, 2003Date of Patent: January 6, 2009Assignee: Kaneka CorporationInventors: Hiroshi Iwakirii, Shintaro Komitsu
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Publication number: 20080311396Abstract: The problem of the present invention is to provide a pressure-sensitive adhesive sheet for skin adhesion, having an adhesive layer, which can be formed without using an organic solvent, shows superior adhesion performance to the skin, and shows extremely mild irritation to the skin and stratum corneum damage. To solve the problem, the present invention provides a pressure-sensitive adhesive sheet for skin adhesion, which has a substrate and an adhesive layer laminated on the substrate, wherein the adhesive layer is obtained by curing an adhesive composition containing polyether polymer (A) having at least one alkenyl group on the terminal, compound (B) having 1-10 hydrosilyl groups in a molecule and hydrosilylation catalyst (C).Type: ApplicationFiled: September 29, 2004Publication date: December 18, 2008Applicant: Nitto Denko CorporationInventors: Atsushi Hamada, Takashi Kinoshita, Kenji Furumori, Kazuhiko Ueda, Shintaro Komitsu
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Publication number: 20080176007Abstract: The present invention aims at provision of a pressure-sensitive adhesive composition that affords a cured product having good adhesive property. Reduction of the amount of tackifier resin to be used, which is attributable to the good adhesive property, is a secondary object of the present invention. The above-mentioned problem can be solved by a pressure-sensitive adhesive composition containing (A) a polyoxyalkylene polymer having at least one alkenyl group in one molecule, (B) a compound having 1 to 3 hydrosilyl groups on average in one molecule, and (C) a hydrosilylation catalyst as essential components.Type: ApplicationFiled: March 18, 2008Publication date: July 24, 2008Inventors: Kazuhiko Ueda, Shintaro Komitsu
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Patent number: 7385006Abstract: The present invention is a reactive modifier which is an acrylic polymer having a number average molecular weight of 5000 or more, obtained by copolymerizing (A) a hydrolyzable silyl group-containing monomer, (B) methyl methacrylate, (C) butyl acrylate and (D) an alkyl (meth)acrylate in which the alkyl chain has 7 to 9 carbon atoms, wherein the content of the component A is 0.01 to 10 parts by weight, the content of the component B is 5 to 95 parts by weight, the content of the component C is 5 to 95 parts by weight, the content of the component D is 5 to 95 parts by weight, the total content of the components A to D is 50 to 100 parts by weight and the weight ratio of the component C to the component D is 0.5 to 2.0. The present invention provides a reactive modifier which is inexpensive in the raw materials thereof, easy to handle and excellent in the storage stability as observed at the time of mixing with a polymer.Type: GrantFiled: April 16, 2004Date of Patent: June 10, 2008Assignee: Kaneka CorporationInventors: Kazuhiko Ueda, Shintaro Komitsu
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Patent number: 7368518Abstract: The present invention aims at provision of a pressure-sensitive adhesive composition that affords a cured product having good adhesive property. Reduction of the amount of tackifier resin to be used, which is attributable to the good adhesive property, is a secondary object of the present invention. The above-mentioned problem can be solved by a pressure-sensitive adhesive composition containing (A) a polyoxyalkylene polymer having at least one alkenyl group in one molecule, (B) a compound having 1 to 3 hydrosilyl groups on average in one molecule, and (C) a hydrosilylation catalyst as essential components.Type: GrantFiled: September 21, 2004Date of Patent: May 6, 2008Assignee: Kaneka CorporationInventors: Kazuhiko Ueda, Shintaro Komitsu
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Publication number: 20070167583Abstract: Desirable properties required of curable compositions include: to have satisfactory storage stability; to give a cured product having a mat surface with almost no residual tack; to give a rubbery cured product having a low modulus and high elongation; and to give a cured product the surface of which is less apt to crack or discolor even in outdoor use. The present invention provides a curable composition which comprises: a vinyl polymer the main chain of which is a product of living radical polymerization and which contains at least one crosslinkable silyl group, and a primary and/or secondary amine having a melting point of not lower than 20° C. The curable composition of the present invention gives a cured product satisfying those properties.Type: ApplicationFiled: August 23, 2004Publication date: July 19, 2007Inventors: Ayako Yano, Shintaro Komitsu
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Publication number: 20070112145Abstract: The invention aims to improve surface tackiness of a curable composition comprising a reactive silicon group-containing polyoxypropylene polymer without decreasing coating workability, strength, adhesion and appearance. As one embodiment of a means for resolution, a curable composition comprising (A) 100 parts by weight of a reactive silicon group-containing polyoxypropylene polymer, (B) from 0.1 to 20 parts by weight of a silane coupling agent, (C) from 0.1 to 80 parts by weight of an epoxy group-containing compound, (D) from 0.1 to 60 parts by weight of a tertiary amine, and (E) from 0.1 to 30 parts by weight of a primary or secondary amine having a melting point of 20° C or more is mentioned.Type: ApplicationFiled: December 9, 2004Publication date: May 17, 2007Applicant: KANEKA CORPORATIONInventors: Katsuhiro Ando, Shintaro Komitsu
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Patent number: 7144953Abstract: The present invention provides a composition, which is easy to produce because of high ease of handling the starting materials. The composition exhibits excellent transparency, and a product prepared using the composition exhibits excellent mechanical properties and adhesive properties. The curable resin composition contains (A) an oxyalkylene polymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds; (B) a copolymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds, the molecular chain of the copolymer consisting substantially of (b-1) an alkyl (meth)acrylate monomeric unit having C1–C2 alkyl and (b-2) an alkyl (meth)acrylate monomeric unit having C7–C9 alkyl; and (C) a curing agent.Type: GrantFiled: October 23, 2002Date of Patent: December 5, 2006Assignee: Kaneka CorporationInventors: Kazuhiko Ueda, Jun Kotani, Shintaro Komitsu, Hiroshi Iwakiri
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Publication number: 20060241249Abstract: The present invention provides a curable resin composition excellent in weather resistance and transparency, satisfactory in handling workability, low in modulus and excellent in elongation properties, a process for production of the curable resin composition, and a resin composition to be used in the process for production of the curable resin composition. In the process for production of the curable resin composition comprising an oxyalkylene polymer (A) having one or more reactive silicon groups and a polymer (B) having one or more reactive silicon groups and having a molecular chain substantially composed of alkyl(meth)acrylate monomer units each containing an alkyl group having 1 to 24 carbon atoms, the curable resin composition is obtained by mixing a reaction mixture, obtained through the polymerization of the polymer (B) in an organic polymer plasticizer (C), with the oxyalkylene polymer (A).Type: ApplicationFiled: February 20, 2004Publication date: October 26, 2006Inventors: Mitsuhiro Kasai, Hitoshi Tamai, Shintaro Komitsu
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Publication number: 20060211821Abstract: The present invention provides a solution to a problem that a composition including a reactive silicon group-containing polyether undergoes red coloration. More specifically, in a reactive silicon group-containing organic polymer which contains Co, the problem concerned is solved by limiting the Co content to 0.5 ppm or less. As the reactive silicon group-containing organic polymer, for example, a reactive silicon group-containing polyether (A) or a mixture of the reactive silicon group-containing polyether (A) and a vinyl polymer (B) may be cited. The reactive silicon group-containing polyether (A) is obtained, for example, by reacting a polyether or a derivative thereof which contains Co in a content of 0.5 ppm or less with a silane compound which has a group capable of reacting with the polyether or the derivative thereof and has a hydrolyzable group.Type: ApplicationFiled: April 23, 2004Publication date: September 21, 2006Inventors: Kazuhiko Ueda, Jun Hattori, Shintaro Komitsu
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Publication number: 20060211799Abstract: By further incorporating a reductant into a composition including an oxyalkylene polymer prepared by polymerization in the presence of a cobalt-containing double metal cyanide complex catalyst; and an acrylic polymer prepared by radical polymerization in the presence of a mercapto group-containing compound, a resin composition in which excessive coloration is prevented and that is suitably used for an adhesive or the like is prepared.Type: ApplicationFiled: April 21, 2004Publication date: September 21, 2006Inventors: Jun Hattori, Kazuhiko Ueda, Shintaro Komitsu
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Publication number: 20060199918Abstract: The present invention is a reactive modifier which is an acrylic polymer having a number average molecular weight of 5000 or more, obtained by copolymerizing (A) a hydrolyzable silyl group-containing monomer, (B) methyl methacrylate, (C) butyl acrylate and (D) an alkyl (meth)acrylate in which the alkyl chain has 7 to 9 carbon atoms, wherein the content of the component A is 0.01 to 10 parts by weight, the content of the component B is 5 to 95 parts by weight, the content of the component C is 5 to 95 parts by weight, the content of the component D is 5 to 95 parts by weight, the total content of the components A to D is 50 to 100 parts by weight and the weight ratio of the component C to the component D is 0.5 to 2.0. The present invention provides a reactive modifier which is inexpensive in the raw materials thereof, easy to handle and excellent in the storage stability as observed at the time of mixing with a polymer.Type: ApplicationFiled: April 16, 2004Publication date: September 7, 2006Inventors: Kazuhiko Ueda, Shintaro Komitsu