Patents by Inventor Shintaro Matsuda
Shintaro Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220013958Abstract: A connector includes a housing, a holder, and a short-circuiting terminal. The holder is non-movable to a formal locking position when terminals, which are short-circuiting targets, are not inserted into a terminal receiving chamber. The holder is movable to the formal locking position when the terminals, which are short-circuiting targets, are inserted into a sufficient insertion position of the terminal receiving chamber. A contact member of the short-circuiting terminal is in contact with the terminals, which are short-circuiting targets, and the terminals, which are short-circuiting targets, are short-circuited when the terminals, which are short-circuiting terminals, are inserted into the sufficient insertion position and the holder is moved to the formal locking position.Type: ApplicationFiled: September 24, 2021Publication date: January 13, 2022Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Tomoyuki Miyakawa, Kozo Oishi
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Patent number: 11189978Abstract: A connector includes: a housing; and a short-circuit terminal. A deformable portion is configured to deform in a direction of moving away from the terminal during housing of the terminal and to deform in a direction of moving closer to the terminal when the housing of the terminal is finished. The short-circuit terminal has, as different portions, a contact point portion to contact with the two or more terminals and a push target portion to contact with the deformable portion. The short-circuit terminal is configured to reduce its pressure of contact toward the terminal at the contact point portion, during the housing of the terminal, due to a movement of the push target portion along with the deformable portion.Type: GrantFiled: May 20, 2020Date of Patent: November 30, 2021Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.Inventors: Tomoyuki Miyakawa, Kozo Oishi, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
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Publication number: 20200373718Abstract: A connector includes: a housing; and a short-circuit terminal. A deformable portion is configured to deform in a direction of moving away from the terminal during housing of the terminal and to deform in a direction of moving closer to the terminal when the housing of the terminal is finished. The short-circuit terminal has, as different portions, a contact point portion to contact with the two or more terminals and a push target portion to contact with the deformable portion. The short-circuit terminal is configured to reduce its pressure of contact toward the terminal at the contact point portion, during the housing of the terminal, due to a movement of the push target portion along with the deformable portion.Type: ApplicationFiled: May 20, 2020Publication date: November 26, 2020Inventors: Tomoyuki Miyakawa, Kozo Oishi, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
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Publication number: 20200373711Abstract: A connector includes: a housing; and a detector detecting whether a terminal is received at a regular position. The locking portion has an abutment part to lock the terminal, and an interference part interfering with the detector to prevent the detector from being assembled to the housing. The abutment part is displaced to lock the terminal at the regular position when the terminal is at the regular position, and to leave the terminal when the terminal is not at the regular position. The interference part moves along with the abutment part to a position not to interfere with the detector when the terminal is at the regular position, and to be displaced to a position to interfere with the detector when terminal is not at the regular position.Type: ApplicationFiled: May 22, 2020Publication date: November 26, 2020Inventors: Tomoyuki Miyakawa, Kozo Oishi, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
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Patent number: 10784619Abstract: One of a pair of connectors of a spring type connector includes an inner housing, an outer housing, a gap defined between the inner housing and the outer housing, retaining mechanisms, and a spring. The retaining mechanism includes a pair of abutting members provided on the inner housing and the outer housing, and a cushioning member provided between the pair of the abutting members.Type: GrantFiled: November 30, 2017Date of Patent: September 22, 2020Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Kozo Oishi, Tomoyuki Miyakawa
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Patent number: 10559924Abstract: The connector includes an inner housing, an outer housing, a locking mechanism for locking, a spring member that pushes back the inner housing during half fitting, and a pushback regulating position that regulates a pushback position. The pushback regulating portion includes a claw portion, a stepped portion against which the claw portion abuts, and a sliding load portion that makes a sliding friction force between the inner housing and the outer housing at a predetermined timing before abutting to be larger than the sliding friction force before the predetermined timing.Type: GrantFiled: May 2, 2019Date of Patent: February 11, 2020Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Kozo Oishi, Tomoyuki Miyakawa
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Publication number: 20190363486Abstract: One of a pair of connectors (1) of a spring type connector includes an inner housing (3), an outer housing (5), a gap defined between the inner housing and the outer housing, retaining mechanisms (3d, 5c), and a spring (12). The retaining mechanism includes a pair of abutting members (3d, 5c) provided on the inner housing and the outer housing, and a cushioning member (6b) provided between the pair of the abutting members.Type: ApplicationFiled: November 30, 2017Publication date: November 28, 2019Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Kozo Oishi, Tomoyuki Miyakawa
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Patent number: 10476203Abstract: A connector includes: a first connector which includes a tubular outer housing and an inner housing in which a plurality of first terminals are provided; a second connector which includes a bottomed tubular counterpart housing in which a plurality of second terminals are provided; and an elastic member which is provided in the outer housing and urges the inner housing toward a front side of the first connector in a fitting direction. The inner housing is moved by the elastic member to the front side in the fitting direction at the time of fitting.Type: GrantFiled: December 13, 2018Date of Patent: November 12, 2019Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.Inventors: Kozo Oishi, Tomoyuki Miyakawa, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
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Publication number: 20190260163Abstract: The connector includes an inner housing, an outer housing, a locking mechanism for locking, a spring member that pushes back the inner housing during half fitting, and a pushback regulating position that regulates a pushback position. The pushback regulating portion includes a claw portion, a stepped portion against which the claw portion abuts, and a sliding load portion that makes a sliding friction force between the inner housing and the outer housing at a predetermined timing before abutting to be larger than the sliding friction force before the predetermined timing.Type: ApplicationFiled: May 2, 2019Publication date: August 22, 2019Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Kozo Oishi, Tomoyuki Miyakawa
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Patent number: 10290971Abstract: One of a pair of first terminals includes a spring member of which one end is supported by the first housing. A contact portion that contacts one of a pair of second terminals is formed on a free end of the spring member. A lock arm abuts against the spring member to displace the contact portion, and brings the contact portion into contact with one of the second terminals at the time of locking. The other of the first terminals has a contact portion that contacts the other of the second terminals when the connectors are fitted, and is disposed apart from one of the first terminals.Type: GrantFiled: December 5, 2018Date of Patent: May 14, 2019Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.Inventors: Kozo Oishi, Tomoyuki Miyakawa, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
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Publication number: 20190123481Abstract: A connector includes: a first connector which includes a tubular outer housing and an inner housing in which a plurality of first terminals are provided; a second connector which includes a bottomed tubular counterpart housing in which a plurality of second terminals are provided; and an elastic member which is provided in the outer housing and urges the inner housing toward a front side of the first connector in a fitting direction. The inner housing is moved by the elastic member to the front side in the fitting direction at the time of fitting.Type: ApplicationFiled: December 13, 2018Publication date: April 25, 2019Inventors: Kozo Oishi, Tomoyuki Miyakawa, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
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Publication number: 20190109413Abstract: One of a pair of first terminals includes a spring member of which one end is supported by the first housing. A contact portion that contacts one of a pair of second terminals is formed on a free end of the spring member. A lock arm abuts against the spring member to displace the contact portion, and brings the contact portion into contact with one of the second terminals at the time of locking. The other of the first terminals has a contact portion that contacts the other of the second terminals when the connectors are fitted, and is disposed apart from one of the first terminals.Type: ApplicationFiled: December 5, 2018Publication date: April 11, 2019Inventors: Kozo Oishi, Tomoyuki Miyakawa, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
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Patent number: 9837466Abstract: To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case and a method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case; the shipping case has the following structure: the shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer, the lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.Type: GrantFiled: March 23, 2016Date of Patent: December 5, 2017Assignee: Renesas Electronics CorporationInventor: Shintaro Matsuda
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Publication number: 20160204010Abstract: To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case. A method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case. The shipping case has the following structure. The shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer. The lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.Type: ApplicationFiled: March 23, 2016Publication date: July 14, 2016Inventor: Shintaro MATSUDA
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Patent number: 9324763Abstract: To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case. A method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case. The shipping case has the following structure. The shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer. The lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.Type: GrantFiled: July 16, 2015Date of Patent: April 26, 2016Assignee: Renesas Electronics CorporationInventor: Shintaro Matsuda
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Publication number: 20160035787Abstract: To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case. A method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case. The shipping case has the following structure. The shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer. The lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.Type: ApplicationFiled: July 16, 2015Publication date: February 4, 2016Inventor: Shintaro Matsuda
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Patent number: 6748704Abstract: A factory layout includes a plurality of substantially triangle units provided in radial directions. The triangle units are combined so as to form a polygonal shape including a triangle shape as a whole. The empty regions with an air-conditioning facility are provided at a part of the central portion of the polygonal shape.Type: GrantFiled: February 16, 2001Date of Patent: June 15, 2004Assignee: Renesas Technology Corp.Inventors: Koji Eguchi, Shintaro Matsuda, Satoru Souda, Akiko Sakai
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Publication number: 20020046518Abstract: A factory layout includes a plurality of substantially triangle units provided in radial directions. The triangle units are combined so as to form a polygonal shape including a triangle shape as a whole. The empty regions with an air-conditioning facility are provided at a part of the central portion of the polygonal shape.Type: ApplicationFiled: February 16, 2001Publication date: April 25, 2002Applicant: Mitsubishi Denki Kabushiki KaishaInventors: Koji Eguchi, Shintaro Matsuda, Satoru Souda, Akiko Sakai
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Patent number: 5204540Abstract: A resin sealed semiconductor device for use in testing is disclosed, in which a first MOS field effect transistor is formed in a region within 100 .mu.m from an outer perimeter of a main surface of a silicon substrate, and a second MOS field effect transistor is formed in a region 100 .mu.m or more distant from an outer perimeter of the main surface, and the first and second MOS field effect transistors are encapsulated with resin. Dimensions and materials of the first MOS field effect transistor and the second MOS field effect transistor are identical. By comparing the electric characteristics of the first MOS field effect transistor and the electric characteristics of the second MOS field effect transistor, the effect produced on the MOS field effect transistors by the mechanical stresses due to the resin seal applied from a side direction of silicon substrate can be evaluated.Type: GrantFiled: March 21, 1991Date of Patent: April 20, 1993Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yuichi Nakashima, Shintaro Matsuda