Patents by Inventor Shintaro Matsuda

Shintaro Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220013958
    Abstract: A connector includes a housing, a holder, and a short-circuiting terminal. The holder is non-movable to a formal locking position when terminals, which are short-circuiting targets, are not inserted into a terminal receiving chamber. The holder is movable to the formal locking position when the terminals, which are short-circuiting targets, are inserted into a sufficient insertion position of the terminal receiving chamber. A contact member of the short-circuiting terminal is in contact with the terminals, which are short-circuiting targets, and the terminals, which are short-circuiting targets, are short-circuited when the terminals, which are short-circuiting terminals, are inserted into the sufficient insertion position and the holder is moved to the formal locking position.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Tomoyuki Miyakawa, Kozo Oishi
  • Patent number: 11189978
    Abstract: A connector includes: a housing; and a short-circuit terminal. A deformable portion is configured to deform in a direction of moving away from the terminal during housing of the terminal and to deform in a direction of moving closer to the terminal when the housing of the terminal is finished. The short-circuit terminal has, as different portions, a contact point portion to contact with the two or more terminals and a push target portion to contact with the deformable portion. The short-circuit terminal is configured to reduce its pressure of contact toward the terminal at the contact point portion, during the housing of the terminal, due to a movement of the push target portion along with the deformable portion.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: November 30, 2021
    Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.
    Inventors: Tomoyuki Miyakawa, Kozo Oishi, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
  • Publication number: 20200373718
    Abstract: A connector includes: a housing; and a short-circuit terminal. A deformable portion is configured to deform in a direction of moving away from the terminal during housing of the terminal and to deform in a direction of moving closer to the terminal when the housing of the terminal is finished. The short-circuit terminal has, as different portions, a contact point portion to contact with the two or more terminals and a push target portion to contact with the deformable portion. The short-circuit terminal is configured to reduce its pressure of contact toward the terminal at the contact point portion, during the housing of the terminal, due to a movement of the push target portion along with the deformable portion.
    Type: Application
    Filed: May 20, 2020
    Publication date: November 26, 2020
    Inventors: Tomoyuki Miyakawa, Kozo Oishi, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
  • Publication number: 20200373711
    Abstract: A connector includes: a housing; and a detector detecting whether a terminal is received at a regular position. The locking portion has an abutment part to lock the terminal, and an interference part interfering with the detector to prevent the detector from being assembled to the housing. The abutment part is displaced to lock the terminal at the regular position when the terminal is at the regular position, and to leave the terminal when the terminal is not at the regular position. The interference part moves along with the abutment part to a position not to interfere with the detector when the terminal is at the regular position, and to be displaced to a position to interfere with the detector when terminal is not at the regular position.
    Type: Application
    Filed: May 22, 2020
    Publication date: November 26, 2020
    Inventors: Tomoyuki Miyakawa, Kozo Oishi, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
  • Patent number: 10784619
    Abstract: One of a pair of connectors of a spring type connector includes an inner housing, an outer housing, a gap defined between the inner housing and the outer housing, retaining mechanisms, and a spring. The retaining mechanism includes a pair of abutting members provided on the inner housing and the outer housing, and a cushioning member provided between the pair of the abutting members.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 22, 2020
    Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.
    Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Kozo Oishi, Tomoyuki Miyakawa
  • Patent number: 10559924
    Abstract: The connector includes an inner housing, an outer housing, a locking mechanism for locking, a spring member that pushes back the inner housing during half fitting, and a pushback regulating position that regulates a pushback position. The pushback regulating portion includes a claw portion, a stepped portion against which the claw portion abuts, and a sliding load portion that makes a sliding friction force between the inner housing and the outer housing at a predetermined timing before abutting to be larger than the sliding friction force before the predetermined timing.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: February 11, 2020
    Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.
    Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Kozo Oishi, Tomoyuki Miyakawa
  • Publication number: 20190363486
    Abstract: One of a pair of connectors (1) of a spring type connector includes an inner housing (3), an outer housing (5), a gap defined between the inner housing and the outer housing, retaining mechanisms (3d, 5c), and a spring (12). The retaining mechanism includes a pair of abutting members (3d, 5c) provided on the inner housing and the outer housing, and a cushioning member (6b) provided between the pair of the abutting members.
    Type: Application
    Filed: November 30, 2017
    Publication date: November 28, 2019
    Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Kozo Oishi, Tomoyuki Miyakawa
  • Patent number: 10476203
    Abstract: A connector includes: a first connector which includes a tubular outer housing and an inner housing in which a plurality of first terminals are provided; a second connector which includes a bottomed tubular counterpart housing in which a plurality of second terminals are provided; and an elastic member which is provided in the outer housing and urges the inner housing toward a front side of the first connector in a fitting direction. The inner housing is moved by the elastic member to the front side in the fitting direction at the time of fitting.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: November 12, 2019
    Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.
    Inventors: Kozo Oishi, Tomoyuki Miyakawa, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
  • Publication number: 20190260163
    Abstract: The connector includes an inner housing, an outer housing, a locking mechanism for locking, a spring member that pushes back the inner housing during half fitting, and a pushback regulating position that regulates a pushback position. The pushback regulating portion includes a claw portion, a stepped portion against which the claw portion abuts, and a sliding load portion that makes a sliding friction force between the inner housing and the outer housing at a predetermined timing before abutting to be larger than the sliding friction force before the predetermined timing.
    Type: Application
    Filed: May 2, 2019
    Publication date: August 22, 2019
    Inventors: Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda, Kozo Oishi, Tomoyuki Miyakawa
  • Patent number: 10290971
    Abstract: One of a pair of first terminals includes a spring member of which one end is supported by the first housing. A contact portion that contacts one of a pair of second terminals is formed on a free end of the spring member. A lock arm abuts against the spring member to displace the contact portion, and brings the contact portion into contact with one of the second terminals at the time of locking. The other of the first terminals has a contact portion that contacts the other of the second terminals when the connectors are fitted, and is disposed apart from one of the first terminals.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: May 14, 2019
    Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.
    Inventors: Kozo Oishi, Tomoyuki Miyakawa, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
  • Publication number: 20190123481
    Abstract: A connector includes: a first connector which includes a tubular outer housing and an inner housing in which a plurality of first terminals are provided; a second connector which includes a bottomed tubular counterpart housing in which a plurality of second terminals are provided; and an elastic member which is provided in the outer housing and urges the inner housing toward a front side of the first connector in a fitting direction. The inner housing is moved by the elastic member to the front side in the fitting direction at the time of fitting.
    Type: Application
    Filed: December 13, 2018
    Publication date: April 25, 2019
    Inventors: Kozo Oishi, Tomoyuki Miyakawa, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
  • Publication number: 20190109413
    Abstract: One of a pair of first terminals includes a spring member of which one end is supported by the first housing. A contact portion that contacts one of a pair of second terminals is formed on a free end of the spring member. A lock arm abuts against the spring member to displace the contact portion, and brings the contact portion into contact with one of the second terminals at the time of locking. The other of the first terminals has a contact portion that contacts the other of the second terminals when the connectors are fitted, and is disposed apart from one of the first terminals.
    Type: Application
    Filed: December 5, 2018
    Publication date: April 11, 2019
    Inventors: Kozo Oishi, Tomoyuki Miyakawa, Kazuyuki Ochiai, Daisuke Fujihira, Shintaro Matsuda
  • Patent number: 9837466
    Abstract: To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case and a method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case; the shipping case has the following structure: the shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer, the lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: December 5, 2017
    Assignee: Renesas Electronics Corporation
    Inventor: Shintaro Matsuda
  • Publication number: 20160204010
    Abstract: To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case. A method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case. The shipping case has the following structure. The shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer. The lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.
    Type: Application
    Filed: March 23, 2016
    Publication date: July 14, 2016
    Inventor: Shintaro MATSUDA
  • Patent number: 9324763
    Abstract: To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case. A method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case. The shipping case has the following structure. The shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer. The lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 26, 2016
    Assignee: Renesas Electronics Corporation
    Inventor: Shintaro Matsuda
  • Publication number: 20160035787
    Abstract: To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case. A method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case. The shipping case has the following structure. The shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer. The lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.
    Type: Application
    Filed: July 16, 2015
    Publication date: February 4, 2016
    Inventor: Shintaro Matsuda
  • Patent number: 6748704
    Abstract: A factory layout includes a plurality of substantially triangle units provided in radial directions. The triangle units are combined so as to form a polygonal shape including a triangle shape as a whole. The empty regions with an air-conditioning facility are provided at a part of the central portion of the polygonal shape.
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: June 15, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Koji Eguchi, Shintaro Matsuda, Satoru Souda, Akiko Sakai
  • Publication number: 20020046518
    Abstract: A factory layout includes a plurality of substantially triangle units provided in radial directions. The triangle units are combined so as to form a polygonal shape including a triangle shape as a whole. The empty regions with an air-conditioning facility are provided at a part of the central portion of the polygonal shape.
    Type: Application
    Filed: February 16, 2001
    Publication date: April 25, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Koji Eguchi, Shintaro Matsuda, Satoru Souda, Akiko Sakai
  • Patent number: 5204540
    Abstract: A resin sealed semiconductor device for use in testing is disclosed, in which a first MOS field effect transistor is formed in a region within 100 .mu.m from an outer perimeter of a main surface of a silicon substrate, and a second MOS field effect transistor is formed in a region 100 .mu.m or more distant from an outer perimeter of the main surface, and the first and second MOS field effect transistors are encapsulated with resin. Dimensions and materials of the first MOS field effect transistor and the second MOS field effect transistor are identical. By comparing the electric characteristics of the first MOS field effect transistor and the electric characteristics of the second MOS field effect transistor, the effect produced on the MOS field effect transistors by the mechanical stresses due to the resin seal applied from a side direction of silicon substrate can be evaluated.
    Type: Grant
    Filed: March 21, 1991
    Date of Patent: April 20, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yuichi Nakashima, Shintaro Matsuda