Abstract: A resin composition for sealing an electronic control device, which contains (A) at least one type of thermosetting resin selected from among an unsaturated polyester resin and a vinyl ester resin, (B) a polymerizable unsaturated compound, (C) an inorganic filler, (D) glass fibers, (E) an internal mold release agent, (F) a coupling agent, and (G) a curing agent, and in which, relative to a total of 100 parts by mass of the thermosetting resin (A) and the polymerizable unsaturated compound (B), the content of the inorganic filler (C) is 150 to 700 parts by mass, the content of the glass fibers (D) is 0.1 to 60 parts by mass, and the content of the coupling agent (F) is 1.4 to 20 parts by mass.

Abstract: The problem to be solved by the present invention is to provide an anticorrosive coating composition which has more alcohol resistance than conventional vinyl ester resins including glass flakes, and is economically effective. In order to solve the above problem, an anticorrosive coating composition including (A) an unsaturated polyester resin composition including (i) an unsaturated polyester obtained from a dibasic acid component and a polyalcohol component and (ii) a polymerizable unsaturated monomer; and (B) a scale-like glass, wherein the dibasic acid includes 70 to 100 mol % of an unsaturated dibasic acid and 0 to 30 mol % of a saturated dibasic acid, and the polyalcohol component includes 50 to 100 mol % of a glycol having a carbon atom number of 1 to 3 in the main chain and a side chain number of 0 or 1, is provided.

Abstract: By heating, allowing to stand at normal temperature, or irradiating in the presence of a photo-polymerization initiator, a curable resin composition which contains (A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator, (D) an amine compound and/or a mercaptan compound containing one or more of active hydrogen in one molecule, and (E) a compound, which is an adduct in which the (D) amine compound and/or a mercaptan compound, is reacted with the radical polymerizable unsaturated group of the (A) resin material, thereby a cured product can be obtained.

Abstract: By heating, allowing to stand at normal temperature, or irradiating in the presence of a photo-polymerization initiator, a curable resin composition which contains (A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator, (D) an amine compound and/or a mercaptan compound containing one or more of active hydrogen in one molecule, and (E) a compound, which is an adduct in which the (D) amine compound and/or a mercaptan compound, is reacted with the radical polymerizable unsaturated group of the (A) resin material, thereby a cured product can be obtained.