Patents by Inventor Shintarou Fujitomi

Shintarou Fujitomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200344870
    Abstract: To provide a circuit board that has excellent smoothness and capable of reducing a transmission loss of a high-frequency electrical signal. The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHz having a relative permittivity of from 2 to 3 at 23° C., and the circuit board satisfying a relationship: (A?B)/B?0.1 wherein A is the maximum value of the thickness in the wiring portion (?m) and B is the minimum value of the thickness in the non-wiring portion (?m).
    Type: Application
    Filed: September 10, 2018
    Publication date: October 29, 2020
    Applicant: JSR CORPORATION
    Inventors: Isao NISHIMURA, Nobuyuki MIYAKI, Toshiaki KADOTA, Shintarou FUJITOMI, Tomotaka SHINODA
  • Publication number: 20200281076
    Abstract: Provided is a high-frequency circuit laminate that can reduce the transmission loss of electrical signals in high-frequency circuits and produce circuit boards with excellent smoothness. The high-frequency circuit laminate according to the present invention includes a metal layer and a resin layer which are laminated in contact with each other, the resin layer having an elastic modulus from 0.1 to 3 GPa, and the resin layer having an dielectric loss tangent from 0.001 to 0.01 and a relative permittivity from 2 to 3 at a frequency of 10 GHz at 23° C.
    Type: Application
    Filed: September 10, 2018
    Publication date: September 3, 2020
    Applicant: JSR CORPORATION
    Inventors: Isao NISHIMURA, Nobuyuki MIYAKI, Toshiaki KADOTA, Shintarou FUJITOMI, Tomotaka SHINODA
  • Publication number: 20190055357
    Abstract: A novel polymer having high glass transition temperature and an excellent balance between heat resistance, high refractive index and mechanical properties, and a composition and molded article containing the polymer are provided. The polymer according to the invention has a first structural unit represented by at least one of formulae (1-1), (1-2) and (1-3) below and a second structural unit having either a secondary amino structure or a tertiary amino structure at two or more terminals.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 21, 2019
    Applicant: JSR Corporation
    Inventors: Ryouyuu HIFUMI, Toshiaki Kadota, Nobuyuki Miyaki, Shintarou Fujitomi, Yasutaka Yoshida, Ryouji Tatara