Patents by Inventor Shintarou Hayashi

Shintarou Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8716736
    Abstract: The surface light emitting device includes an organic EL element, a protection substrate, a protection part, and a light extraction structure part. The element has a first face and a second face opposite to the first face, and emits light from the first face. The substrate has transparency for light emitted from the element, and is placed facing the first face, and has a primary surface facing the first face of the element. The protection part is placed facing the second face of the element, and constitutes a housing in combination with the substrate and accommodates the element so as to protect the element from water. The structure part is interposed between the first face of the element and the substrate, and suppresses reflection of light emitted from the element on at least one of the first face of the element and the primary surface of the substrate.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: May 6, 2014
    Assignee: Panasonic Corporation
    Inventors: Kazuyuki Yamae, Hitoshi Kimura, Nobuhiro Ide, Hiroya Tsuji, Shintarou Hayashi
  • Patent number: 8419201
    Abstract: A light emitting module includes an organic EL light emitting element and a support body supporting the organic EL light emitting element. The support body is attached to the organic EL light emitting element at the side of the non-light emitting surface of the light emitting module to cover one surface of the organic EL light emitting element. The organic EL light emitting element includes power feeding electrodes. The support body includes openings formed in a corresponding relationship with the power feeding electrodes. The power feeding electrodes exposed on the non-light emitting side of the support body through the openings. The support body includes power feeding terminals. The power feeding terminals partially exposed on the non-light emitting side of the support body. The power feeding terminals electrically connected to the power feeding electrodes by electric connection members extending via the non-light emitting side and the openings of the support body.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: April 16, 2013
    Assignee: Panasonic Corporation
    Inventors: Osamu Tanahashi, Satoshi Fukano, Shintarou Hayashi, Shinichi Anami, Shigetsugu Sumiyama, Motohiro Saimi, Hideharu Kawachi
  • Publication number: 20120292652
    Abstract: The surface light emitting device includes an organic EL element, a protection substrate, a protection part, and a light extraction structure part. The element has a first face and a second face opposite to the first face, and emits light from the first face. The substrate has transparency for light emitted from the element, and is placed facing the first face, and has a primary surface facing the first face of the element. The protection part is placed facing the second face of the element, and constitutes a housing in combination with the substrate and accommodates the element so as to protect the element from water. The structure part is interposed between the first face of the element and the substrate, and suppresses reflection of light emitted from the element on at least one of the first face of the element and the primary surface of the substrate.
    Type: Application
    Filed: January 19, 2011
    Publication date: November 22, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Kazuyuki Yamae, Hitoshi Kimura, Nobuhiro Ide, Hiroya Tsuji, Shintarou Hayashi
  • Publication number: 20120133042
    Abstract: A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.
    Type: Application
    Filed: May 21, 2009
    Publication date: May 31, 2012
    Applicant: Panasonic Electric Works Co., Ltd.
    Inventors: Shintarou Hayashi, Mitsuhiko Ueda, Yoshiharu Sanagawa, Takamasa Sakai
  • Publication number: 20110095701
    Abstract: A light emitting module includes an organic EL light emitting element and a support body supporting the organic EL light emitting element. The support body is attached to the organic EL light emitting element at the side of the non-light emitting surface of the light emitting module to cover one surface of the organic EL light emitting element. The organic EL light emitting element includes power feeding electrodes. The support body includes openings formed in a corresponding relationship with the power feeding electrodes. The power feeding electrodes exposed on the non-light emitting side of the support body through the openings. The support body includes power feeding terminals. The power feeding terminals partially exposed on the non-light emitting side of the support body. The power feeding terminals electrically connected to the power feeding electrodes by electric connection members extending via the non-light emitting side and the openings of the support body.
    Type: Application
    Filed: October 27, 2010
    Publication date: April 28, 2011
    Applicant: Panasonic Electric Works Co., Ltd.
    Inventors: Osamu TANAHASHI, Satoshi Fukano, Shintarou Hayashi, Shinichi Anami, Shigetsugu Sumiyama, Motohiro Saimi, Hideharu Kawachi