Abstract: A copper particulate dispersion containing copper particulates coated with water-soluble polymers and hydroxycarboxylic acid; hydroxycarboxylic acid; and polyhydric alcohol and/or a polar solvent. The copper particulate dispersion is produced by adding hydroxycarboxylic acid such as malic acid, citric acid, and the like or a solution thereof into a dispersion containing a polar solvent and copper particulates coated with water-soluble polymers, and stirring the obtained dispersion so that part of water-soluble polymers are substituted by hydroxycarboxylic acid; discharging released water-soluble polymers from the dispersion by ultrafiltration; and subsequently adding hydroxycarboxylic acid, polyhydric alcohol and/or a polar solvent, into the dispersion.

Abstract: [Object] It is aimed at providing a copper particulate dispersion containing therein copper particulates having diameters of 100 nm or less, suitable as a wiring material, which dispersion possesses not only an excellent dispersibility and oxidation resistance of copper particulates but also an excellent film-forming ability, and which dispersion is also capable of achieving a satisfactory electroconductive property of an electroconductive film obtained by low-temperature sintering. [Solving Means] The present invention provides a copper particulate dispersion comprising: copper particulates coated with water-soluble polymers and hydroxycarboxylic acid; hydroxycarboxylic acid; and polyhydric alcohol and/or a polar solvent.