Patents by Inventor Shinya Akamatsu

Shinya Akamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11195076
    Abstract: The present invention improves the communication characteristics of an inlay using an auxiliary antenna, while protecting the inlay from physical and mechanical external forces, shocks or the like, without being subjected to the constraints of a dipole antenna. To that end, the present invention has a configuration, including: an inlay having an IC chip and only a loop circuit antenna, on which the IC chip is mounted, and not including another antenna; a casing for accommodating the inlay therein; and a planar top cover covering one surface side of the casing. The top cover is formed of a prescribed metallic material and includes a cutout opening at least on one side. The inlay is disposed in the casing so as to be positioned inside the cutout. The top cover functions as an antenna of the inlay by being electrically connected to the inlay.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: December 7, 2021
    Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventor: Shinya Akamatsu
  • Publication number: 20210019587
    Abstract: The present invention improves the communication characteristics of an inlay using an auxiliary antenna, while protecting the inlay from physical and mechanical external forces, shocks or the like, without being subjected to the constraints of a dipole antenna. To that end, the present invention has a configuration, including: an inlay having an IC chip and only a loop circuit antenna, on which the IC chip is mounted, and not including another antenna; a casing for accommodating the inlay therein; and a planar top cover covering one surface side of the casing. The top cover is formed of a prescribed metallic material and includes a cutout opening at least on one side. The inlay is disposed in the casing so as to be positioned inside the cutout. The top cover functions as an antenna of the inlay by being electrically connected to the inlay.
    Type: Application
    Filed: August 10, 2018
    Publication date: January 21, 2021
    Inventor: Shinya AKAMATSU
  • Patent number: 10248904
    Abstract: An RF tag that includes an inlay (made of an IC chip and an antenna); an auxiliary antenna laminated on the inlay in an insulated state; and a housing that houses the inlay having the auxiliary antenna laminated thereon. Furthermore, the antenna of the inlay forms a loop circuit adjacent to the IC chip, and the auxiliary antenna overlaps part of the loop circuit and is arranged along a longitudinal direction of the inlay such that at least a part of the antenna of the inlay is exposed.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: April 2, 2019
    Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Shinya Akamatsu, Hironaga Shimizu
  • Patent number: 10163052
    Abstract: An RF tag that includes an inlay (made of an IC chip and an antenna) and a housing that houses the inlay therein. Furthermore, the housing comprises a top cover that covers at least an upper surface side of the inlay, the top cover is made of a predetermined metal material, the top cover includes a cutaway that opens in the upper surface side of the inlay, and the top cover is electrically connected to the inlay to function as an auxiliary antenna of the inlay.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: December 25, 2018
    Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Shinya Akamatsu, Hironaga Shimizu
  • Publication number: 20180060718
    Abstract: An RF tag that includes an inlay (made of an IC chip and an antenna) and a housing that houses the inlay therein. Furthermore, the housing comprises a top cover that covers at least an upper surface side of the inlay, the top cover is made of a predetermined metal material, the top cover includes a cutaway that opens in the upper surface side of the inlay, and the top cover is electrically connected to the inlay to function as an auxiliary antenna of the inlay.
    Type: Application
    Filed: October 19, 2017
    Publication date: March 1, 2018
    Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Shinya Akamatsu, Hironaga Shimizu
  • Publication number: 20180039878
    Abstract: An RF tag that includes an inlay (made of an IC chip and an antenna); an auxiliary antenna laminated on the inlay in an insulated state; and a housing that houses the inlay having the auxiliary antenna laminated thereon. Furthermore, the antenna of the inlay forms a loop circuit adjacent to the IC chip, and the auxiliary antenna overlaps part of the loop circuit and is arranged along a longitudinal direction of the inlay such that at least a part of the antenna of the inlay is exposed.
    Type: Application
    Filed: October 19, 2017
    Publication date: February 8, 2018
    Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Shinya Akamatsu, Hironaga Shimizu
  • Patent number: 9663260
    Abstract: A rotor rotates, thereby sequentially making pockets reach a drug discharging outlet, so that tablets held therein are sequentially discharged through the drug discharging outlet. When each pocket reaches the drug discharging outlet, an upper opening of the pocket is closed by a separating member, which prevents new tablets from dropping in the pocket. An apex of a block with a protrusion has a height that is able to contact a lower face of a main body of the separating member. The apex strokes the lower face of the main body of the separating member upon rotation of the rotor. Only branches with which the apex of the block with a protrusion is brought into contact bend and deform upwardly. The deformed branches are successively replaced, so as to proceed as waves running. The tablets are pushed by the waves so as to proceed forward in the rotational direction.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: May 30, 2017
    Assignee: YUYAMA MFG. CO., LTD.
    Inventors: Yasuyuki Morita, Shinya Akamatsu
  • Patent number: 9547817
    Abstract: An RF tag includes an inlay comprising an IC chip and an antenna, a planar auxiliary antenna laminated on the inlay in an insulating state to the inlay, and a substrate on which the inlay and the auxiliary antenna are laminated. The auxiliary antenna is formed into a rectangular planar shape including long sides each having a length of substantially ¼ of a wavelength of a radio wave frequency of the inlay, and has a cutout part which divides one of the long sides into two parts each having a length of substantially ? of the wavelength of the radio wave frequency of the inlay. The cutout part is formed into a concave shape which is opened in an edge portion of the one of the long sides and has a predetermined width and depth to allow the IC chip of the inlay to be disposed therein.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: January 17, 2017
    Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Shinya Akamatsu, Hironaga Shimizu, Takayuki Kikuchi
  • Patent number: 9477923
    Abstract: An RF tag has an inlay with an IC chip and an antenna, a planar auxiliary antenna laminated on the inlay in an insulating state, a dielectric constant regulation plate which becomes a base on which the inlay including the auxiliary antenna laminated thereon is mounted, and functions as a dielectric constant regulation layer for the mounted inlay, and a case which receives the dielectric constant regulation plate in a state where the inlay including the auxiliary antenna laminated thereon is mounted. The dielectric constant regulation plate is formed into a shape which allows the dielectric constant regulation plate to be attachably/detachably and non-movably engaged in the case and which allows the dielectric constant regulation plate to have a predetermined dielectric constant which regulates communication characteristics of the inlay including the auxiliary antenna laminated thereon.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: October 25, 2016
    Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Hironaga Shimizu, Shinya Akamatsu, Takayuki Kikuchi
  • Publication number: 20150217929
    Abstract: A rotor rotates, thereby sequentially making pockets reach a drug discharging outlet, so that tablets held therein are sequentially discharged through the drug discharging outlet. When each pocket reaches the drug discharging outlet, an upper opening of the pocket is closed by a separating member, which prevents new tablets from dropping in the pocket. An apex of a block with a protrusion has a height that is able to contact a lower face of a main body of the separating member. The apex strokes the lower face of the main body of the separating member upon rotation of the rotor. Only branches with which the apex of the block with a protrusion is brought into contact bend and deform upwardly. The deformed branches are successively replaced, so as to proceed as waves running. The tablets are pushed by the waves so as to proceed forward in the rotational direction.
    Type: Application
    Filed: January 31, 2014
    Publication date: August 6, 2015
    Applicant: YUYAMA MFG CO., LTD.
    Inventors: Yasuyuki MORITA, Shinya AKAMATSU
  • Publication number: 20150108222
    Abstract: An RF tag has an inlay with an IC chip and an antenna, a planar auxiliary antenna laminated on the inlay in an insulating state, a dielectric constant regulation plate which becomes a base on which the inlay including the auxiliary antenna laminated thereon is mounted, and functions as a dielectric constant regulation layer for the mounted inlay, and a case which receives the dielectric constant regulation plate in a state where the inlay including the auxiliary antenna laminated thereon is mounted. The dielectric constant regulation plate is formed into a shape which allows the dielectric constant regulation plate to be attachably/detachably and non-movably engaged in the case and which allows the dielectric constant regulation plate to have a predetermined dielectric constant which regulates communication characteristics of the inlay including the auxiliary antenna laminated thereon.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Inventors: Hironaga Shimizu, Shinya Akamatsu, Takayuki Kikuchi
  • Publication number: 20150108221
    Abstract: An RF tag includes an inlay comprising an IC chip and an antenna, a planar auxiliary antenna laminated on the inlay in an insulating state to the inlay, and a substrate on which the inlay and the auxiliary antenna are laminated. The auxiliary antenna is formed into a rectangular planar shape including long sides each having a length of substantially ¼ of a wavelength of a radio wave frequency of the inlay, and has a cutout part which divides one of the long sides into two parts each having a length of substantially ? of the wavelength of the radio wave frequency of the inlay. The cutout part is formed into a concave shape which is opened in an edge portion of the one of the long sides and has a predetermined width and depth to allow the IC chip of the inlay to be disposed therein.
    Type: Application
    Filed: December 22, 2014
    Publication date: April 23, 2015
    Inventors: Shinya Akamatsu, Hironaga Shimizu, Takayuki Kikuchi
  • Publication number: 20140054175
    Abstract: An acidic aqueous composition for semiglossy tin electroplating has a water-soluble tin (II)-containing substance and a surfactant. The surfactant includes a surfactant (A) comprising N,N?,N?-polyoxyethylene-N-alkyl-1,3-diaminopropane. The surfactant (A) the number of carbon atoms of the alkyl group that bonds to N ranges from 14 to 18. The weight-average molecular weight of the surfactant (A) ranges from 300 to 1500.
    Type: Application
    Filed: February 28, 2013
    Publication date: February 27, 2014
    Applicant: YUKEN INDUSTRY CO., LTD.
    Inventors: Yoshinori Kusunoki, Shinya Akamatsu
  • Patent number: 7374426
    Abstract: A card-edge board connector is provided which does not require a relay board, does not make connection of the card-edge board fixed at a certain position or does not cause a difference in propagation time of a signal even if connecting terminals of the card-edge board are disposed in two rows. The card-edge board connector includes a first connector on which a card-edge board is mounted, a second connector on which a board is mounted, a hinge for holding the first and the second connectors capable of rotational movement, and a flexible connecting board connected to between the first and the second connectors, for electrically connecting the card-edge board and the board to each other.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: May 20, 2008
    Assignee: NEC Corporation
    Inventor: Shinya Akamatsu
  • Publication number: 20060211275
    Abstract: A card-edge board connector is provided which does not require a relay board, does not make connection of the card-edge board fixed at a certain position or does not cause a difference in propagation time of a signal even if connecting terminals of the card-edge board are disposed in two rows. The card-edge board connector includes a first connector on which a card-edge board is mounted, a second connector on which a board is mounted, a hinge for holding the first and the second connectors capable of rotational movement, and a flexible connecting board connected to between the first and the second connectors, for electrically connecting the card-edge board and the board to each other.
    Type: Application
    Filed: March 3, 2006
    Publication date: September 21, 2006
    Applicant: NEC CORPORATION
    Inventor: Shinya Akamatsu
  • Patent number: 7080987
    Abstract: An apparatus for making an electrical connection with an electrical unit which has an edge portion and terminals disposed along the edge portion. The apparatus includes a supporting member and a connector supported by the supporting member. The connector has a body elongated in a longitudinal direction and second terminals disposed along the longitudinal direction. The connector slidably guides the edge portion of the electrical unit along the longitudinal direction to a first fully inserted position such that each one of the terminals of the connector faces respective one of the terminals of the electrical unit.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: July 25, 2006
    Assignee: NEC Corporation
    Inventors: Shinya Akamatsu, Masahiro Yamada
  • Publication number: 20040192077
    Abstract: An apparatus is adapted to make an electrical connection with an electrical unit which has an edge portion and terminals disposed along the edge portion. The apparatus includes a supporting member and a connector supported by the supporting member. The connector has a body elongated in a longitudinal direction and second terminals disposed along the longitudinal direction. The connector is adapted to slidably guide the edge portion of the electrical unit along the longitudinal direction to a first fully inserted position such that each one of the terminals of the connector faces respective one of the terminals of the electrical unit.
    Type: Application
    Filed: February 25, 2004
    Publication date: September 30, 2004
    Applicant: NEC CORPORATION
    Inventors: Shinya Akamatsu, Masahiro Yamada
  • Patent number: 5420753
    Abstract: In a structure for cooling an integrated circuit (IC), a hollow cylindrical member is mounted on a cold plate and receives a heat conductor therein. The heat conductor is a cylindrical member which is closed by a flat plate at one end thereof. Silicone gel fills a gap between the hollow cylindrical member and the heat conductor and allows the heat conductor to move due to the elasticity thereof. When the cold plate is fixed in place on the IC which is mounted on a printed circuit board, the heat conductor moves in matching relation to the height and inclination of the IC. As a result, the heat conductor and IC are brought into close contact with each other. A compound intervenes between the heat conductor and the IC to enhance the close contact of the heat conductor and IC.
    Type: Grant
    Filed: November 9, 1993
    Date of Patent: May 30, 1995
    Assignee: NEC Corporation
    Inventors: Shinya Akamatsu, Shinji Mine, Hideki Seguchi
  • Patent number: D469087
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: January 21, 2003
    Assignee: NEC Corporation
    Inventors: Hideo Sue, Shinya Akamatsu, Shinji Mine, Tadao Hosaka, Tetsuya Nagata
  • Patent number: D469430
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: January 28, 2003
    Assignee: NEC Corporation
    Inventors: Hideo Sue, Shinya Akamatsu, Shinji Mine, Tadao Hosaka, Tetsuya Nagata