Patents by Inventor Shinya Esaki

Shinya Esaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit device installed structure and installation method
    Publication number: 20040089859
    Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.
    Type: Application
    Filed: March 17, 2003
    Publication date: May 13, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Yasufumi Shirakawa, Masaki Taniguchi, Hideo Fukuda, Yuzo Shimizu, Shinya Esaki
  • Integrated circuit device packaging structure and packaging method
    Publication number: 20030197258
    Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
    Type: Application
    Filed: April 18, 2003
    Publication date: October 23, 2003
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Yasufumi Shirakawa, Masaki Taniguchi, Hideo Fukuda, Yuzo Shimizu, Shinya Esaki