Abstract: A power supply device according to the present invention detects a value of an input voltage (power supply voltage) by an input side voltage detection circuit, and decreases a comparative voltage (error voltage) that is compared with an on timer signal (timer signal) for determining an on time of a switching element based on the value of the input voltage. The power supply device employs an on-time control and at the same time reduces the total harmonic distortion.

Abstract: An area characteristic display device includes an inputter which receives input of information that enables identification of state and position of equipment installed outdoors, and a display controller which displays, based on the information that enables identification of the state and position that has been input to the inputter, and data on area characteristics, a distribution of the state together with the data on area characteristics, on a display with being superimposed on a map.

Abstract: In an LED control device, a first integration circuit changes a first reference signal to be different from a second reference signal in one cycle of a first light controlling signal, and a first control unit controls a first switching element by means of a first control signal Gate1 at a first operational frequency for turning on and off a first switching element, the first operational frequency being different from a second operational frequency for turning on and off a second switching element, in one cycle of a first light controlling signal.

Abstract: In an LED control device, a first integration circuit changes a first reference signal to be different from a second reference signal in one cycle of a first light controlling signal, and a first control unit controls a first switching element by means of a first control signal Gate1 at a first operational frequency for turning on and off a first switching element, the first operational frequency being different from a second operational frequency for turning on and off a second switching element, in one cycle of a first light controlling signal.

Abstract: An electronic device includes a resin layer, a conductive layer buried in the resin layer, an electronic part buried in the resin layer, and a wiring layer arranged on the resin layer, the wiring layer including wiring and an opening, the wiring being connected electrically to the conductive layer and the electronic part, the opening communicating with the conductive layer.

Abstract: An inductor apparatus includes: a substrate including an electrical insulation property and a non-magnetic material; and a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate, each of the plurality of inductors including: an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.

Abstract: An inductor apparatus includes: a substrate including an electrical insulation property and a non-magnetic material; and a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate, each of the plurality of inductors including: an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.

Abstract: An area characteristic display device includes an inputter which receives input of information that enables identification of state and position of equipment installed outdoors, and a display controller which displays, based on the information that enables identification of the state and position that has been input to the inputter, and data on area characteristics, a distribution of the state together with the data on area characteristics, on a display with being superimposed on a map.

Abstract: A high frequency module includes: a semiconductor chip provided over a first surface side of a resin layer; a first waveguide provided over the first surface side of the resin layer and sealed together with the semiconductor chip by a resin; a wire provided over a second surface side of the resin layer and electrically coupled to the semiconductor chip and extending to a position of the first waveguide; a second waveguide bonded to the first waveguide; and a metal plate provided over the first surface side of the resin layer at a position opposite to the first waveguide and electrically coupled to the wire, wherein a part of the wire extending to the position of the first waveguide serves as an antenna coupler.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: An electronic device includes a resin layer, a conductive layer buried in the resin layer, an electronic part buried in the resin layer, and a wiring layer arranged on the resin layer, the wiring layer including wiring and an opening, the wiring being connected electrically to the conductive layer and the electronic part, the opening communicating with the conductive layer.

Abstract: A high frequency module includes: a semiconductor chip provided over a first surface side of a resin layer; a first waveguide provided over the first surface side of the resin layer and sealed together with the semiconductor chip by a resin; a wire provided over a second surface side of the resin layer and electrically coupled to the semiconductor chip and extending to a position of the first waveguide; a second waveguide bonded to the first waveguide; and a metal plate provided over the first surface side of the resin layer at a position opposite to the first waveguide and electrically coupled to the wire, wherein a part of the wire extending to the position of the first waveguide serves as an antenna coupler.

Abstract: An inductor apparatus includes: a substrate including an electrical insulation property and a non-magnetic material; and a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate, each of the plurality of inductors including: an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.

Abstract: A steering wheel of a vehicle includes a steering wheel main body. The steering wheel main body includes a rim part, a boss part, a core metal, and a resin layer. The core metal includes a ring part and an offset part such that a distance from a center of the boss part to the offset part is smaller than a distance from the center of the boss part to the ring part. The resin layer includes a ring part resin layer covering the ring part, and an offset part resin layer covering the offset part. A thickness of the offset part resin layer at an outer side of a radial direction with respect to the offset part is thicker than a thickness of the ring part resin layer at the outer side of the radial direction with respect to the ring part. The resin layer is a complete circle.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: A steering wheel of a vehicle includes a steering wheel main body. The steering wheel main body includes a rim part, a boss part, a core metal, and a resin layer. The core metal includes a ring part and an offset part such that a distance from a center of the boss part to the offset part is smaller than a distance from the center of the boss part to the ring part. The resin layer includes a ring part resin layer covering the ring part, and an offset part resin layer covering the offset part. A thickness of the offset part resin layer at an outer side of a radial direction with respect to the offset part is thicker than a thickness of the ring part resin layer at the outer side of the radial direction with respect to the ring part. The resin layer is a complete circle.

Abstract: A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.

Abstract: A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

Abstract: A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.