Abstract: A vehicle thermal management system mounted in a vehicle includes a vehicle driving battery, a liquid heat transfer medium, a heat receiver, and a radiator. The heat receiver causes the heat transfer medium to receive heat through heat exchange with the battery. The radiator causes the heat transfer medium to release the heat through heat exchange with an air outside of the vehicle. The heat transfer medium includes a liquid base material including water and an orthosilicic acid ester compatible with the liquid base material and does not include an ionic rust inhibitor. The orthosilicic acid ester is present, as a concentration of silicon, relative to a total mass of the heat transfer medium within a range between 2000 mass ppm, non-inclusive, and 10000 mass ppm, inclusive.

Abstract: A separator for electricity storage devices, which comprises a porous layer that contains a polyolefin resin and an ionic compound, and which is configured such that: the content of the ionic compound in the porous layer is from 5% by mass to 99% by mass (inclusive); and the degree of whiteness of this separator is more than 98.0.

Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).

Abstract: The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS/micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g/eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g/eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.

Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

Abstract: The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS/micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g/eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g/eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.

Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.

Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.

Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.

Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.

Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).

Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.

Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.

Abstract: An optical amplification device which includes first and second optical amplifiers, and a controller. The first optical amplifier receives a light and amplifies the received light. The second optical amplifier receives the light amplified by the first optical amplifier, and amplifies the received light. When a level of the light received by the first optical amplifier changes by ?, the controller controls a level of the light received by the second optical amplifier to change by approximately ??. In various embodiments, the controller causes the sum of the gains of the first and second optical amplifiers to be constant. In other embodiments, the optical amplification device includes first and second optical amplifier and a gain adjustor. The gain adjustor detects a deviation in gain of the first optical amplifier from a target gain, and adjusts the gain of the second optical amplifier to compensate for the detected deviation.

Abstract: The present invention has an object to provide an optical amplifier capable of realizing a good response characteristic in a wide frequency band, even when a population inversion state is formed by a pumping light supplied to an optical amplification medium and an ASE light generated in the optical amplification medium. To this end, in the optical amplifier according to the present invention, a delayed phase matching fiber in which a first fiber whose response speed is relatively low is arranged on the input side and a second fiber whose response speed is relatively high is arranged on the output side, is used as the optical amplification medium doped with a rare-earth element.

Abstract: An optical amplification device which includes first and second optical amplifiers, and a controller. The first optical amplifier receives a light and amplifies the received light. The second optical amplifier receives the light amplified by the first optical amplifier, and amplifies the received light. When a level of the light received by the first optical amplifier changes by ?, the controller controls a level of the light received by the second optical amplifier to change by approximately ??. In various embodiments, the controller causes the sum of the gains of the first and second optical amplifiers to be constant. In other embodiments, the optical amplification device includes first and second optical amplifier and a gain adjustor. The gain adjustor detects a deviation in gain of the first optical amplifier from a target gain, and adjusts the gain of the second optical amplifier to compensate for the detected deviation.

Abstract: An optical amplification device which includes first and second optical amplifiers, and a controller. The first optical amplifier receives a light and amplifies the received light. The second optical amplifier receives the light amplified by the first optical amplifier, and amplifies the received light. When a level of the light received by the first optical amplifier changes by ?, the controller controls a level of the light received by the second optical amplifier to change by approximately ??. In various embodiments, the controller causes the sum of the gains of the first and second optical amplifiers to be constant. In other embodiments, the optical amplification device includes first and second optical amplifier and a gain adjustor. The gain adjustor detects a deviation in gain of the first optical amplifier from a target gain, and adjusts the gain of the second optical amplifier to compensate for the detected deviation.