Abstract: Provided is a substrate for a liquid ejection head including: a heating element that generates an energy for ejecting a liquid; an electrode pad portion that has a wiring layer at a lower layer thereof, is electrically connected to the heating element through the wiring layer, and is electrically connected to an external component through a bonding material; and an insulating protection layer. The electrode pad portion further has a lower electrode layer and an upper electrode layer, the insulating protection layer disposed at a first region overlapping the wiring layer in a film thickness direction has a first opening through which the lower and upper electrode layers are connected, and the insulating protection layer disposed at a position including at least a second region overlapping the bonding material in the film thickness direction has a second opening through which the lower and upper electrode layers are connected.

Abstract: A liquid ejection device has an element substrate having an ejection port; and a voltage application unit applying a voltage to the element substrate, wherein the element substrate has a first layer having the ejection port and a first channel communicating with the ejection port and a second layer fixed to a back face of the first layer and having a second channel communicating with the first channel, a heat element for ejecting the liquid, a first electrode covering a surface of the heat element on a side of the first layer and exposed to the first channel, and a second electrode exposed to the first channel at a position different from the first electrode and not overlapping the heat element on a plan view, and the voltage application unit is configured to apply the voltage so that the first electrode is at a negative potential.

Abstract: A liquid discharge apparatus includes a liquid chamber, a liquid discharge unit including a heat-generating resistor, a first electrode that is provided in the liquid chamber, and a second electrode that is provided at a different position from the first electrode in the liquid chamber, a first voltage application unit, a second voltage application unit capable of applying voltage, and a control portion that controls the first voltage application unit and the second voltage application unit. The control portion performs a first operation which is voltage application between the first electrode and the second electrode by the second voltage application unit, and in which first voltage application where the first electrode is an anode and second voltage application where the first electrode is a cathode are alternatingly repeated, and a second operation in which the first voltage application unit applies voltage to the heat-generating resistor.

Abstract: A substrate includes a layer including a base material and an intermediate layer including a wiring layer, an element formed on a side of the intermediate layer, and configured to generate energy for discharging a liquid, an insulating layer covering the element and the layer against a liquid chamber, and a conductive layer formed on the insulating layer so as to cover the element against the liquid chamber. The substrate further includes an electric connecting portion configured to electrically connect the wiring layer and the element, a non-insulated portion formed on a side of the intermediate layer and configured to be covered by the insulating layer against the liquid chamber, and an opening portion formed in the insulating layer at a position. The non-insulated portion is connected to the conductive layer via the opening portion.

Abstract: A substrate includes a layer including a base material and an intermediate layer including a wiring layer, an element formed on a side of the intermediate layer, and configured to generate energy for discharging a liquid, an insulating layer covering the element and the layer against a liquid chamber, and a conductive layer formed on the insulating layer so as to cover the element against the liquid chamber. The substrate further includes an electric connecting portion configured to electrically connect the wiring layer and the element, a non-insulated portion formed on a side of the intermediate layer and configured to be covered by the insulating layer against the liquid chamber, and an opening portion formed in the insulating layer at a position. The non-insulated portion is connected to the conductive layer via the opening portion.

Abstract: A liquid ejection head and its manufacturing method are capable of reducing the thickness of a protective layer as compared to the traditional technique so as to efficiently transfer the heat energy generated by a heating resistance element to a droplet of liquid such as ink. To achieve this, power supply wirings are provided in the same layer below the heating resistance element.

Abstract: Provided is an element substrate with suppressed variations in resistance though having a high resistance. In an element substrate equipped with a heat generating resistor that generates thermal energy for ejecting a liquid, the heat generating resistor is a stacked structure having stacked a plurality of resistor layers including a first resistor layer and a second resistor layer containing a metal silicon nitride and the first resistor layer and the second resistor layer are different from each other in at least one of a silicon content in the metal silicon oxide and a metal element contained in the metal silicon nitride.

Abstract: A liquid ejection head capable of reducing the thickness of the protective layer as compared to the traditional technique and efficiently transferring the heat energy generated by the heating resistance element to a droplet such as ink and a method of manufacturing the liquid ejection head provide. To achieve this, a power supply wiring are provided in the same layer below the heating resistance element.

Abstract: Provided is an element substrate with suppressed variations in resistance though having a high resistance. In an element substrate equipped with a heat generating resistor that generates thermal energy for ejecting a liquid, the heat generating resistor is a stacked structure having stacked a plurality of resistor layers including a first resistor layer and a second resistor layer containing a metal silicon nitride and the first resistor layer and the second resistor layer are different from each other in at least one of a silicon content in the metal silicon oxide and a metal element contained in the metal silicon nitride.

Abstract: A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.

Abstract: Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.

Abstract: An element substrate including a base having a heat-generating resistor element which generates thermal energy used for discharging a liquid; an electrically conductive protective layer covering the heat-generating resistor element; an insulating layer provided between the heat-generating resistor element and the protective layer; and a potential applying unit for applying a potential to the protective layer such that a potential of the protective layer is lower than a potential at one end of the heat-generating resistor element and higher than a potential at the other end of the heat-generating resistor element with a voltage being applied between the one end and the other end of the heat-generating resistor element.

Abstract: A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.

Abstract: Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.

Abstract: An element substrate including a base having a heat-generating resistor element which generates thermal energy used for discharging a liquid; an electrically conductive protective layer covering the heat-generating resistor element; an insulating layer provided between the heat-generating resistor element and the protective layer; and a potential applying unit for applying a potential to the protective layer such that a potential of the protective layer is lower than a potential at one end of the heat-generating resistor element and higher than a potential at the other end of the heat-generating resistor element with a voltage being applied between the one end and the other end of the heat-generating resistor element.