Abstract: With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region.

Abstract: With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region. This allows for easier formation of the circuit pattern.

Abstract: Disclosed is a laminated microcapsule sheet which is produced using a lamination apparatus B and a water repellency imparting apparatus A, wherein the lamination apparatus B is used for laminating multiple types of materials at multiple parts on an edible film to form a laminated microcapsule sheet and the water repellency imparting apparatus A is used for imparting water repellency to the surface of the edible sheet. The sheet is improved in the disadvantages attributable to the water soluble property of an edible film.

Abstract: In order to heighten the density of microcapsules and facilitate handling by the unit composed of microcapsules in a given amount smaller than in the whole sheet, a microcapsule sheet which comprises a substrate constituted of an edible film and microcapsules each obtained by surrounding a core layer with a first shell film and a second shell film, the microcapsules being arranged according to a given pattern so as to be arranged only in those regions of the substrate which are separated from each other.

Abstract: An apparatus capable of producing a laminated microcapsule sheet through transferring with high productivity of a drug solution of high viscosity accurately as much as a given weight while avoiding run-off from an enteric layer. There is provided an apparatus comprising edible film holding means (1) for holding an edible film (4); solution transfer printing means (2) equipped with multiple needles (22) for transfer printing of a solution containing any of materials; and a pallet (3) for applying of the solution containing any of materials to the solution transfer printing means (2).

Abstract: Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

Abstract: Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.