Patents by Inventor Shinya Kanno

Shinya Kanno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9490180
    Abstract: The invention provides a method for processing a wafer by inserting the wafer into a holding hole of a carrier to hold the wafer, and interposing the carrier holding the wafer between an upper turn table and a lower turn table to process both surfaces of the wafer simultaneously, including: before processing the wafer, detecting a height position of the upper turn table by a laser displacement sensor while interposing the carrier holding the wafer between the upper turn table and the lower turn table; and determining that the wafer is not normally held to redo the holding of the wafer if a difference between the detected height position and a reference position exceeds a threshold. The method can automatically detect accurately a failure in holding the wafer before processing to prevent the wafer from breaking and eliminate the necessity of operator's inspection using touch to improve operation efficiency.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: November 8, 2016
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventor: Shinya Kanno
  • Publication number: 20140320867
    Abstract: The invention provides a method for processing a wafer by inserting the wafer into a holding hole of a carrier to hold the wafer, and interposing the carrier holding the wafer between an upper turn table and a lower turn table to process both surfaces of the wafer simultaneously, including: before processing the wafer, detecting a height position of the upper turn table by a laser displacement sensor while interposing the carrier holding the wafer between the upper turn table and the lower turn table; and determining that the wafer is not normally held to redo the holding of the wafer if a difference between the detected height position and a reference position exceeds a threshold. The method can automatically detect accurately a failure in holding the wafer before processing to prevent the wafer from breaking and eliminate the necessity of operator's inspection using touch to improve operation efficiency.
    Type: Application
    Filed: August 30, 2012
    Publication date: October 30, 2014
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventor: Shinya Kanno
  • Patent number: 8120731
    Abstract: An article having a color pattern formed therein comprises a substrate, banks on the substrate, and a colored layer provided between the banks. The colored layer has a thickness of 80-120% of an average thickness thereof. In addition, the banks have an ink repelling agent or the upper apex portion of the banks has ink repelling ability.
    Type: Grant
    Filed: September 11, 2007
    Date of Patent: February 21, 2012
    Assignee: Toppan Printing Co., Ltd.
    Inventors: Kazushige Kitazawa, Shigeru Hirayama, Teruhiko Kai, Shinya Kanno
  • Publication number: 20090068396
    Abstract: An article having a color pattern formed therein comprises a substrate, banks on the substrate, and a colored layer provided between the banks. The colored layer has a thickness of 80-120% of an average thickness thereof. In addition, the banks have an ink repelling agent or the upper apex portion of the banks has ink repelling ability.
    Type: Application
    Filed: September 11, 2007
    Publication date: March 12, 2009
    Applicant: Toppan Printing Co., Ltd.
    Inventors: Kazushige Kitazawa, Shigeru Hirayama, Teruhiko Kai, Shinya Kanno