Abstract: This layered film includes a base layer and a sealant layer that becomes one outermost surface of the layered film. The base layer contains 77 to 99 parts by mass of a high-density polyethylene having a density of 0.942 to 0.970 g/cm3 and a melt mass-flow rate of 0.1 to 3.0 g/10 min under conditions of a temperature of 190° C. and a load of 2.16 kg and 1 to 23 parts by mass of an ultra-high-molecular-weight polyethylene having a density of 0.930 to 0.960 g/cm3 in a total of 100 parts by mass.

Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, and a plurality of filled vias. The first insulating layer has a first surface and a second surface positioned on a side opposite to the first surface. The first conductor layer is formed on the first surface of the first insulating layer. The plurality of filled vias are formed inside the first insulating layer. The plurality of filled vias each have a structure in which a via hole penetrating the first insulating layer is filled with a metal. The first conductor layer includes a pad. The pad overlaps the plurality of filled vias in a plan view from a thickness direction of the first insulating layer and is connected to the plurality of filled vias.

Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, and a plurality of filled vias. The first insulating layer has a first surface and a second surface positioned on a side opposite to the first surface. The first conductor layer is formed on the first surface of the first insulating layer. The plurality of filled vias are formed inside the first insulating layer. The plurality of filled vias each have a structure in which a via hole penetrating the first insulating layer is filled with a metal. The first conductor layer includes a pad. The pad overlaps the plurality of filled vias in a plan view from a thickness direction of the first insulating layer and is connected to the plurality of filled vias.