Patents by Inventor Shinya Kawai

Shinya Kawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958092
    Abstract: There is provided a production method for a hat-shaped steel sheet pile including performing rough rolling, intermediate rolling, and finish rolling on a material to be rolled through hot rolling, and then performing bending forming, in which the material to be rolled is composed of a web corresponding part, flange corresponding parts, arm corresponding parts, and joint corresponding parts, corner parts as worked parts are formed at connection places between the web corresponding part and the flange corresponding parts and connection places between the flange corresponding parts and the arm corresponding parts, the intermediate rolling is carried out by performing rolling in a plurality of passes on the material to be rolled in a hot state by using a caliber provided to upper and lower caliber rolls in one or a plurality of intermediate rolling mills in which one stand is configured by one caliber, at a height lower than a predetermined target product height, the bending forming is performed in a hot state an
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: April 16, 2024
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Hiroshi Yamashita, Shinya Hayashi, Masanori Kawai
  • Publication number: 20150366077
    Abstract: A method for producing a mounted structure according to an embodiment of the present invention includes a step of forming a circuit substrate, which includes an insulation layer and a conductive layer, on a support member by alternately stacking the insulation layer and the conductive layer on the support member; a step of forming a mounted structure, which includes the circuit substrate and an electronic component, on the support member by mounting the electronic component on the circuit substrate; and a step of removing the support member from the mounted structure. As a result, the efficiency in producing the mounted structure can be increased.
    Type: Application
    Filed: December 21, 2013
    Publication date: December 17, 2015
    Applicant: KYOCERA CORPORATION
    Inventors: Shinya KAWAI, Katsura HAYASHI
  • Patent number: 8281452
    Abstract: A wiper device includes first and second pivot shafts, first and second pivot holders, a hollow frame, a drive source, and a link rod. The first and second pivot holders are fixed to a vehicle body, pivotally support the first and second pivot shafts, and include first and second attachment shafts, respectively. The hollow frame couples the pivot holders to each other. The link rod transmits drive force of the drive source to the first and second pivot shafts. The hollow frame includes first and second coupling-fixing portions and a drive source fixing portion. The first and second attachment shafts are respectively crimped and fixed to the coupling-fixing portions. Axes of the first and second coupling-fixing portions lie along a straight line. The hollow frame is bent so as to arrange the drive source fixing portion spaced apart from the first and second pivot holders in a direction extending from the distal ends towards basal ends of the pivot shafts.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: October 9, 2012
    Assignee: Asmo Co., Ltd.
    Inventors: Shinya Kawai, Takatsugu Takai
  • Publication number: 20100146726
    Abstract: A wiper device includes first and second pivot shafts, first and second pivot holders, a hollow frame, a drive source, and a link rod. The first and second pivot holders are fixed to a vehicle body, pivotally support the first and second pivot shafts, and include first and second attachment shafts, respectively. The hollow frame couples the pivot holders to each other. The link rod transmits drive force of the drive source to the first and second pivot shafts. The hollow frame includes first and second coupling-fixing portions and a drive source fixing portion. The first and second attachment shafts are respectively crimped and fixed to the coupling-fixing portions. Axes of the first and second coupling-fixing portions lie along a straight line. The hollow frame is bent so as to arrange the drive source fixing portion spaced apart from the first and second pivot holders in a direction extending from the distal ends towards basal ends of the pivot shafts.
    Type: Application
    Filed: December 9, 2009
    Publication date: June 17, 2010
    Applicant: ASMO CO., LTD.
    Inventors: Shinya Kawai, Takatsugu Takai
  • Patent number: 7605101
    Abstract: A laminate includes a first green sheet and a second green sheet. The first green sheet includes a first glass including Al and M which is at least one of Sr and Ba. A relationship between Al content and M content is so defined that a position represented by percent by mass of Al in terms of Al2O3 and percent by mass of M in terms of MO on a coordinate system are on or in a range defined by straight lines connecting point A (1, 21), point B (1, 35), point C (9, 45), point D (20, 45), point E (20, 35), and point F (9, 21) on the coordinate system. The second green sheet includes a second glass including Si and B. The first green sheet is integrally laminated with the second green sheet.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: October 20, 2009
    Assignee: KYOCERA Corporation
    Inventors: Shinya Kawai, Tatsuji Furuse, Mieko Yashima, Kouji Yamamoto
  • Publication number: 20070287012
    Abstract: A laminate includes a first green sheet and a second green sheet. The first green sheet includes a first glass including Al and M which is at least one of Sr and Ba. A relationship between Al content and M content is so defined that a position represented by percent by mass of Al in terms of Al2O3 and percent by mass of M in terms of MO on a coordinate system are on or in a range defined by straight lines connecting point A (1, 21), point B (1, 35), point C (9, 45), point D (20, 45), point E (20, 35), and point F (9, 21) on the coordinate system. The second green sheet includes a second glass including Si and B. The first green sheet is integrally laminated with the second green sheet.
    Type: Application
    Filed: March 27, 2007
    Publication date: December 13, 2007
    Applicant: KYOCERA Corporation
    Inventors: Shinya Kawai, Tatsuji Furuse, Mieko Yashima, Kouji Yamamoto
  • Patent number: 7226654
    Abstract: A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate; the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes; wherein a coefficient ?1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient ?2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions: ?1<?2 ?2??1?9×10?6/° C.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: June 5, 2007
    Assignee: Kyocera Corporation
    Inventors: Shinya Kawai, Masanari Kokubu, Youji Furukubo
  • Publication number: 20060156436
    Abstract: A process for producing a transgenic plant which accumulates a fructooligosaccharide, comprising the step of transforming a plant with a gene construct comprising a gene encoding ?-fructofuranosidase capable of converting sucrose into a fructooligosaccharide, and a transgenic plant produced by the process, are disclosed.
    Type: Application
    Filed: March 2, 2004
    Publication date: July 13, 2006
    Applicant: MEIJI SEIKA KAISHA, LTD.
    Inventors: Hirofumi Nakamura, Hidetoshi Kubota, Shinya Kawai, Takashi Mitsunari, Daisuke Fukutomi
  • Patent number: 6953756
    Abstract: A glass ceramic sintered body containing gahnite and cordierite as crystal phases, having a thermal expansion coefficient at 40 to 400° C. of not larger than 5×10?6/° C., a dielectric constant of not larger than 7 and a Young's modulus of not larger than 150 GPa. A wiring board having an insulating substrate made of the glass ceramic sintered body features very high reliability in the primary mounting and in the secondary mounting.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: October 11, 2005
    Assignee: Kyocera Corporation
    Inventors: Shinya Kawai, Toshifumi Higashi
  • Publication number: 20050023032
    Abstract: A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate; the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes; wherein a coefficient ?1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient ?2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions: ?1<?2 ?2??1?9×10?6/° C.
    Type: Application
    Filed: July 28, 2004
    Publication date: February 3, 2005
    Inventors: Shinya Kawai, Masanari Kokubu, Youji Furukubo
  • Publication number: 20040087427
    Abstract: A glass ceramic sintered body containing gahnite and cordierite as crystal phases, having a thermal expansion coefficient at 40 to 400° C. of not larger than 5×10−6/° C., a dielectric constant of not larger than 7 and a Young's modulus of not larger than 150 GPa. A wiring board having an insulating substrate made of the glass ceramic sintered body features very high reliability in the primary mounting and in the secondary mounting.
    Type: Application
    Filed: October 22, 2003
    Publication date: May 6, 2004
    Applicant: KYOCERA CORPORATION
    Inventors: Shinya Kawai, Toshifumi Higashi
  • Patent number: 6664567
    Abstract: A photoelectric conversion device is provided, which comprises: a substrate serving as an electrode; numerous crystalline semiconductor particles containing a first conductivity-type impurity deposited on the substrate to join thereto; an insulator provided among the crystalline semiconductor particles; and a semiconductor layer containing an impurity of the opposite conductivity-type to which another electrode is connected, which semiconductor layer being provided over the crystalline semiconductor particles, wherein the crystalline semiconductor particles comprise silicon, and the insulator comprises a glass material which contains at least 1 wt % and at most 20 wt % tin oxide. By this arrangement, it is possible to form a good insulator capable of filling spaces among the crystalline semiconductor particles and preventing defects such as cracking, bubbling and abnormal deposition from occurring, and consequently to provide a photoelectric conversion device with high reliability at low cost.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: December 16, 2003
    Assignee: Kyocera Corporation
    Inventors: Takeshi Kyoda, Jun Fukuda, Shinya Kawai, Hisao Arimune
  • Patent number: 6630417
    Abstract: The porcelain of the present invention comprises 5 to 70% by weight of a non-oxide ceramic filler and 30 to 95% by weight of a borosilicate glass having a glass transition temperature of 800° C. or lower, wherein a weight loss per unit surface area of said non-oxide ceramics is not more than 0.15 g/cm2 after dipping said non-oxide ceramic having purity of not less than 96% by weight for five minutes in a glass melt obtained by melting said borosilicate glass with heating at 1200° C. Since the porcelain composition can be fired at a low temperature together with a low-resistance metal, the resulting porcelain has a high thermal conductivity, a low dielectric constant, a high heat dissipation property and a reduced apparent signal delay in a high frequency signal and is suited for use as an insulating board in a wiring board.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: October 7, 2003
    Assignee: Kyocera Corporation
    Inventors: Shinya Kawai, Hiromi Iwachi, Yoshitake Terashi
  • Patent number: 6579818
    Abstract: Disclosed is a glass ceramic sintered product which contains as crystal phases: (i) a gahnite crystal phase; (ii) a celsian crystal phase containing needle-like crystals having an aspect ratio of not smaller than 3; and (iii) at least one kind of crystal phase selected from the group consisting of AlN, Si3N4, SiC, Al2O3, ZrO2, 3Al2O3.2SiO2 and Mg2SiO4; and has an open porosity of not larger than 0.3%. The glass ceramic sintered product is highly strong, has a high heat conductivity, a high Young's modulus, is dense, and can be produced through the firing at a low temperature of not higher than 1000° C., and is very useful as an insulating substrate that has wiring layers of a low-resistance conductor such as Cu, Ag or Au on the surface thereof or in the inside thereof.
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: June 17, 2003
    Assignee: Kyocera Corporation
    Inventors: Shinya Kawai, Masanari Kokubu, Yoshitake Terashi
  • Publication number: 20030047735
    Abstract: A photoelectric conversion device is provided, which comprises: a substrate serving as an electrode; numerous crystalline semiconductor particles containing a first conductivity-type impurity deposited on the substrate to join thereto; an insulator provided among the crystalline semiconductor particles; and a semiconductor layer containing an impurity of the opposite conductivity-type to which another electrode is connected, which semiconductor layer being provided over the crystalline semiconductor particles, wherein the crystalline semiconductor particles comprise silicon, and the insulator comprises a glass material which contains at least 1 wt % and at most 20 wt % tin oxide. By this arrangement, it is possible to form a good insulator capable of filling spaces among the crystalline semiconductor particles and preventing defects such as cracking, bubbling and abnormal deposition from occurring, and consequently to provide a photoelectric conversion device with high reliability at low cost.
    Type: Application
    Filed: June 26, 2002
    Publication date: March 13, 2003
    Inventors: Takeshi Kyoda, Jun Fukuda, Shinya Kawai, Hisao Arimune
  • Publication number: 20020094929
    Abstract: Disclosed is a glass ceramic sintered product which contains as crystal phases:
    Type: Application
    Filed: August 28, 2001
    Publication date: July 18, 2002
    Inventors: Shinya Kawai, Masanari Kokubu, Yoshitake Terashi
  • Patent number: 6413620
    Abstract: Wiring substrate including an insulating substrate made of glass ceramics and having Young's modulus of 120 GPa or less, and a wiring circuit layer made of a high-purity metal conductor in concentration of 99% by weight or more formed on the surface of the insulating substrate and/or inside thereof. This wiring substrate may be a multi-layer wiring substrate that has a plurality of wiring circuit layers. The wiring circuit layer is preferably made of a metal foil.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: July 2, 2002
    Assignee: Kyocera Corporation
    Inventors: Tetsuya Kimura, Katsuhiko Onitsuka, Katsura Hayashi, Shinya Kawai, Akihiko Nishimoto
  • Patent number: 6391083
    Abstract: A mixture for a powder metallurgy product, including iron powder, graphite powder and copper (Cu) of about 3.0 to about 5.0 weight percent. Iron powder includes iron grains which contain MnS therein. The mixture contains the MnS of about 0.65 to about 1.40 weight percent. The graphite powder is contained in the mixture such that an amount of carbon (C) in the powder metallurgy product is about 0.3 to about 0.7 weight percent. An amount (wt % C) of the carbon and an amount (wt % Cu) of the copper is determined to obtain a target fatigue strength FS (MPa) and a target hardness HR (HRB) based on a relation FS=66.63×(wt % C)+22.61×(wt % Cu)+280.84 HR=22.96×(wt % C)+2.99×(wt % Cu)+78.91.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: May 21, 2002
    Assignees: Kobeico Metal Powder of America, Inc., Kobe Steel, Ltd., Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Nobuaki Akagi, Shinya Kawai, Masaaki Satoh, Yoshikazu Seki, Masaki Amano, Hideaki Ushio, Russell T. Scott
  • Publication number: 20020039645
    Abstract: The porcelain of the present invention comprises 5 to 70% by weight of a non-oxide ceramic filler and 30 to 95% by weight of a borosilicate glass having a glass transition temperature of 800° C. or lower, wherein a weight loss per unit surface area of said non-oxide ceramics is not more than 0.15 g/cm2 after dipping said non-oxide ceramic having purity of not less than 96% by weight for five minutes in a glass melt obtained by melting said borosilicate glass with heating at 1200° C. Since the porcelain composition can be fired at a low temperature together with a low-resistance metal, the resulting porcelain has a high thermal conductivity, a low dielectric constant, a high heat dissipation property and a reduced apparent signal delay in a high frequency signal and is suited for use as an insulating board in a wiring board.
    Type: Application
    Filed: May 30, 2001
    Publication date: April 4, 2002
    Inventors: Shinya Kawai, Hiromi Iwachi, Yoshitake Terashi
  • Patent number: 6264718
    Abstract: A powder metallurgy product which is made from constituent including iron powder. The iron powder includes iron grains which contain machinability improving element in the iron grains. The machinability improving element is configured to improve machinability of the powder metallurgy product and has a pinning effect. An amount (Q) of the machinability improving element is adjusted such that an absolute value of a differential coefficient (dS/dQ) is at least a predetermined value, where (S) is a grain size of iron in the powder metallurgy product.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: July 24, 2001
    Assignees: Kobelco Metal Powder of America, Inc., Kobe Steel, Ltd.
    Inventors: Nobuaki Akagi, Shinya Kawai, Michael E. Lutheran, Masaaki Satoh, Hironori Suzuki