Abstract: A drive system (1) drives a multi-phase AC motor (2) having a plurality of windings. The drive system (1) includes a first power converter (3U), a second power converter (3V), a first conversion controller (20U), and a second conversion controller (20V). The first power converter (3U) causes a current to flow through a winding of a first phase of the multi-phase AC motor (2). The second power converter (3V) causes a current to flow through a winding of a second phase of the multi-phase AC motor (2). The first conversion controller (20U) decides on either a three-level phase voltage waveform or a five-level phase voltage waveform on the basis of setting information for designating a type of phase voltage waveform and controls the first power converter (3U) so that the decided phase voltage waveform is output from the first power converter (3U).

Abstract: A method for producing a mounted structure according to an embodiment of the present invention includes a step of forming a circuit substrate, which includes an insulation layer and a conductive layer, on a support member by alternately stacking the insulation layer and the conductive layer on the support member; a step of forming a mounted structure, which includes the circuit substrate and an electronic component, on the support member by mounting the electronic component on the circuit substrate; and a step of removing the support member from the mounted structure. As a result, the efficiency in producing the mounted structure can be increased.

Abstract: A wiper device includes first and second pivot shafts, first and second pivot holders, a hollow frame, a drive source, and a link rod. The first and second pivot holders are fixed to a vehicle body, pivotally support the first and second pivot shafts, and include first and second attachment shafts, respectively. The hollow frame couples the pivot holders to each other. The link rod transmits drive force of the drive source to the first and second pivot shafts. The hollow frame includes first and second coupling-fixing portions and a drive source fixing portion. The first and second attachment shafts are respectively crimped and fixed to the coupling-fixing portions. Axes of the first and second coupling-fixing portions lie along a straight line. The hollow frame is bent so as to arrange the drive source fixing portion spaced apart from the first and second pivot holders in a direction extending from the distal ends towards basal ends of the pivot shafts.

Abstract: A wiper device includes first and second pivot shafts, first and second pivot holders, a hollow frame, a drive source, and a link rod. The first and second pivot holders are fixed to a vehicle body, pivotally support the first and second pivot shafts, and include first and second attachment shafts, respectively. The hollow frame couples the pivot holders to each other. The link rod transmits drive force of the drive source to the first and second pivot shafts. The hollow frame includes first and second coupling-fixing portions and a drive source fixing portion. The first and second attachment shafts are respectively crimped and fixed to the coupling-fixing portions. Axes of the first and second coupling-fixing portions lie along a straight line. The hollow frame is bent so as to arrange the drive source fixing portion spaced apart from the first and second pivot holders in a direction extending from the distal ends towards basal ends of the pivot shafts.

Abstract: A laminate includes a first green sheet and a second green sheet. The first green sheet includes a first glass including Al and M which is at least one of Sr and Ba. A relationship between Al content and M content is so defined that a position represented by percent by mass of Al in terms of Al2O3 and percent by mass of M in terms of MO on a coordinate system are on or in a range defined by straight lines connecting point A (1, 21), point B (1, 35), point C (9, 45), point D (20, 45), point E (20, 35), and point F (9, 21) on the coordinate system. The second green sheet includes a second glass including Si and B. The first green sheet is integrally laminated with the second green sheet.

Abstract: A laminate includes a first green sheet and a second green sheet. The first green sheet includes a first glass including Al and M which is at least one of Sr and Ba. A relationship between Al content and M content is so defined that a position represented by percent by mass of Al in terms of Al2O3 and percent by mass of M in terms of MO on a coordinate system are on or in a range defined by straight lines connecting point A (1, 21), point B (1, 35), point C (9, 45), point D (20, 45), point E (20, 35), and point F (9, 21) on the coordinate system. The second green sheet includes a second glass including Si and B. The first green sheet is integrally laminated with the second green sheet.

Abstract: A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate; the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes; wherein a coefficient ?1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient ?2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions: ?1<?2 ?2??1?9×10?6/° C.

Abstract: A process for producing a transgenic plant which accumulates a fructooligosaccharide, comprising the step of transforming a plant with a gene construct comprising a gene encoding ?-fructofuranosidase capable of converting sucrose into a fructooligosaccharide, and a transgenic plant produced by the process, are disclosed.

Abstract: A glass ceramic sintered body containing gahnite and cordierite as crystal phases, having a thermal expansion coefficient at 40 to 400° C. of not larger than 5×10?6/° C., a dielectric constant of not larger than 7 and a Young's modulus of not larger than 150 GPa. A wiring board having an insulating substrate made of the glass ceramic sintered body features very high reliability in the primary mounting and in the secondary mounting.

Abstract: A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate; the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes; wherein a coefficient ?1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient ?2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions: ?1<?2 ?2??1?9×10?6/° C.

Abstract: A glass ceramic sintered body containing gahnite and cordierite as crystal phases, having a thermal expansion coefficient at 40 to 400° C. of not larger than 5×10−6/° C., a dielectric constant of not larger than 7 and a Young's modulus of not larger than 150 GPa. A wiring board having an insulating substrate made of the glass ceramic sintered body features very high reliability in the primary mounting and in the secondary mounting.

Abstract: A photoelectric conversion device is provided, which comprises: a substrate serving as an electrode; numerous crystalline semiconductor particles containing a first conductivity-type impurity deposited on the substrate to join thereto; an insulator provided among the crystalline semiconductor particles; and a semiconductor layer containing an impurity of the opposite conductivity-type to which another electrode is connected, which semiconductor layer being provided over the crystalline semiconductor particles, wherein the crystalline semiconductor particles comprise silicon, and the insulator comprises a glass material which contains at least 1 wt % and at most 20 wt % tin oxide. By this arrangement, it is possible to form a good insulator capable of filling spaces among the crystalline semiconductor particles and preventing defects such as cracking, bubbling and abnormal deposition from occurring, and consequently to provide a photoelectric conversion device with high reliability at low cost.

Abstract: The porcelain of the present invention comprises 5 to 70% by weight of a non-oxide ceramic filler and 30 to 95% by weight of a borosilicate glass having a glass transition temperature of 800° C. or lower, wherein a weight loss per unit surface area of said non-oxide ceramics is not more than 0.15 g/cm2 after dipping said non-oxide ceramic having purity of not less than 96% by weight for five minutes in a glass melt obtained by melting said borosilicate glass with heating at 1200° C. Since the porcelain composition can be fired at a low temperature together with a low-resistance metal, the resulting porcelain has a high thermal conductivity, a low dielectric constant, a high heat dissipation property and a reduced apparent signal delay in a high frequency signal and is suited for use as an insulating board in a wiring board.

Abstract: Disclosed is a glass ceramic sintered product which contains as crystal phases: (i) a gahnite crystal phase; (ii) a celsian crystal phase containing needle-like crystals having an aspect ratio of not smaller than 3; and (iii) at least one kind of crystal phase selected from the group consisting of AlN, Si3N4, SiC, Al2O3, ZrO2, 3Al2O3.2SiO2 and Mg2SiO4; and has an open porosity of not larger than 0.3%. The glass ceramic sintered product is highly strong, has a high heat conductivity, a high Young's modulus, is dense, and can be produced through the firing at a low temperature of not higher than 1000° C., and is very useful as an insulating substrate that has wiring layers of a low-resistance conductor such as Cu, Ag or Au on the surface thereof or in the inside thereof.

Abstract: A photoelectric conversion device is provided, which comprises: a substrate serving as an electrode; numerous crystalline semiconductor particles containing a first conductivity-type impurity deposited on the substrate to join thereto; an insulator provided among the crystalline semiconductor particles; and a semiconductor layer containing an impurity of the opposite conductivity-type to which another electrode is connected, which semiconductor layer being provided over the crystalline semiconductor particles, wherein the crystalline semiconductor particles comprise silicon, and the insulator comprises a glass material which contains at least 1 wt % and at most 20 wt % tin oxide. By this arrangement, it is possible to form a good insulator capable of filling spaces among the crystalline semiconductor particles and preventing defects such as cracking, bubbling and abnormal deposition from occurring, and consequently to provide a photoelectric conversion device with high reliability at low cost.

Abstract: Disclosed is a glass ceramic sintered product which contains as crystal phases:

Abstract: Wiring substrate including an insulating substrate made of glass ceramics and having Young's modulus of 120 GPa or less, and a wiring circuit layer made of a high-purity metal conductor in concentration of 99% by weight or more formed on the surface of the insulating substrate and/or inside thereof. This wiring substrate may be a multi-layer wiring substrate that has a plurality of wiring circuit layers. The wiring circuit layer is preferably made of a metal foil.

Abstract: A mixture for a powder metallurgy product, including iron powder, graphite powder and copper (Cu) of about 3.0 to about 5.0 weight percent. Iron powder includes iron grains which contain MnS therein. The mixture contains the MnS of about 0.65 to about 1.40 weight percent. The graphite powder is contained in the mixture such that an amount of carbon (C) in the powder metallurgy product is about 0.3 to about 0.7 weight percent. An amount (wt % C) of the carbon and an amount (wt % Cu) of the copper is determined to obtain a target fatigue strength FS (MPa) and a target hardness HR (HRB) based on a relation FS=66.63×(wt % C)+22.61×(wt % Cu)+280.84 HR=22.96×(wt % C)+2.99×(wt % Cu)+78.91.

Abstract: The porcelain of the present invention comprises 5 to 70% by weight of a non-oxide ceramic filler and 30 to 95% by weight of a borosilicate glass having a glass transition temperature of 800° C. or lower, wherein a weight loss per unit surface area of said non-oxide ceramics is not more than 0.15 g/cm2 after dipping said non-oxide ceramic having purity of not less than 96% by weight for five minutes in a glass melt obtained by melting said borosilicate glass with heating at 1200° C. Since the porcelain composition can be fired at a low temperature together with a low-resistance metal, the resulting porcelain has a high thermal conductivity, a low dielectric constant, a high heat dissipation property and a reduced apparent signal delay in a high frequency signal and is suited for use as an insulating board in a wiring board.

Abstract: A powder metallurgy product which is made from constituent including iron powder. The iron powder includes iron grains which contain machinability improving element in the iron grains. The machinability improving element is configured to improve machinability of the powder metallurgy product and has a pinning effect. An amount (Q) of the machinability improving element is adjusted such that an absolute value of a differential coefficient (dS/dQ) is at least a predetermined value, where (S) is a grain size of iron in the powder metallurgy product.