Abstract: A temperature measurement member measures a temperature of an inspection object or a temperature of a mounting table on which the inspection object is placed inside an inspection apparatus that inspects the inspection object. The temperature measurement member is attached to an attachment position of a probe card used for electrical characteristic inspection in the inspection apparatus, and includes a main body having substantially a same shape as the probe card; a probe formed to extend from the main body toward the mounting table in a state in which the temperature measurement member is attached to the attachment position; and a temperature sensor configured to measure the temperature of the inspection object or the mounting table. The sensor transmits/receives a temperature measurement-related electrical signal to/from an inspection part via the probe card in the electrical characteristic inspection, and transmits a temperature measurement result to the inspection part.

Abstract: A temperature measurement member measures a temperature of an inspection object or a temperature of a mounting table on which the inspection object is placed inside an inspection apparatus that inspects the inspection object. The temperature measurement member is attached to an attachment position of a probe card used for electrical characteristic inspection in the inspection apparatus, and includes a main body having substantially a same shape as the probe card; a probe formed to extend from the main body toward the mounting table in a state in which the temperature measurement member is attached to the attachment position; and a temperature sensor configured to measure the temperature of the inspection object or the mounting table. The sensor transmits/receives a temperature measurement-related electrical signal to/from an inspection part via the probe card in the electrical characteristic inspection, and transmits a temperature measurement result to the inspection part.

Abstract: A wafer testing apparatus according to an embodiment includes a tester configured to apply electrical signals to a semiconductor device fabricated on a wafer, a prober configured to cause the semiconductor device to be electrically coupled to the tester, a tester controller configured to control an operation of the tester, and a prober controller configured to control an operation of the prober, wherein the tester controller and the prober controller communicate with each other when diagnosing a state of the tester.