Patents by Inventor Shinya Kusazaki

Shinya Kusazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component mounting substrate and manufacturing method thereof
    Patent number: 11516923
    Abstract: An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: November 29, 2022
    Assignee: KOITO MANUFACTURING CO., LTD.
    Inventors: Shinya Kusazaki, Hiroki Ishibashi
  • ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200367365
    Abstract: An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.
    Type: Application
    Filed: May 6, 2020
    Publication date: November 19, 2020
    Inventors: Shinya Kusazaki, Hiroki Ishibashi