Abstract: A discharge container includes: a double-walled container body including an inner layer body and an outer layer body; a discharge cap having a discharge outlet, the discharge cap being attached to a mouth of the double-walled container body; and a check valve structure. The check valve structure has a tubular partition wall defining a flow path of the content and a valve body which is provided on the partition wall with a hinge portion and has a single swing structure, and space inside the partition wall rather on the discharge outlet side than on the valve body side serves as a liquid reservoir space where part of remaining content is stored after the discharge of the content.

Abstract: A discharge container includes: a double-walled container body including an inner layer body and an outer layer body; a discharge cap having a discharge outlet, the discharge cap being attached to a mouth of the double-walled container body; and a check valve structure. The check valve structure has a tubular partition wall defining a flow path of the content and a valve body which is provided on the partition wall with a hinge portion and has a single swing structure, and space inside the partition wall rather on the discharge outlet side than on the valve body side serves as a liquid reservoir space where part of remaining content is stored after the discharge of the content.

Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.

Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: A composite layer composed of an Ni layer 72 and a Pd layer 73 is formed on a solder pad 77U, and a solder 76? on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by means of thermal stress.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.