Patents by Inventor Shinya Maeda

Shinya Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11059636
    Abstract: A discharge container includes: a double-walled container body including an inner layer body and an outer layer body; a discharge cap having a discharge outlet, the discharge cap being attached to a mouth of the double-walled container body; and a check valve structure. The check valve structure has a tubular partition wall defining a flow path of the content and a valve body which is provided on the partition wall with a hinge portion and has a single swing structure, and space inside the partition wall rather on the discharge outlet side than on the valve body side serves as a liquid reservoir space where part of remaining content is stored after the discharge of the content.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: July 13, 2021
    Assignee: YOSHINO KOGYOSHO CO., LTD.
    Inventor: Shinya Maeda
  • Publication number: 20190270554
    Abstract: A discharge container includes: a double-walled container body including an inner layer body and an outer layer body; a discharge cap having a discharge outlet, the discharge cap being attached to a mouth of the double-walled container body; and a check valve structure. The check valve structure has a tubular partition wall defining a flow path of the content and a valve body which is provided on the partition wall with a hinge portion and has a single swing structure, and space inside the partition wall rather on the discharge outlet side than on the valve body side serves as a liquid reservoir space where part of remaining content is stored after the discharge of the content.
    Type: Application
    Filed: May 23, 2017
    Publication date: September 5, 2019
    Applicant: YOSHINO KOGYOSHO CO., LTD.
    Inventor: Shinya MAEDA
  • Patent number: 9488899
    Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: November 8, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuhiko Ooyama, Yutaro Matsui, Shinya Maeda, Takashi Umehara, Toshiaki Takenaka
  • Publication number: 20150185589
    Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.
    Type: Application
    Filed: August 19, 2013
    Publication date: July 2, 2015
    Applicant: Panasonic Intellectual Property Management Co., Lt
    Inventors: Kazuhiko Ooyama, Yutaro Matsui, Shinya Maeda, Takashi Umehara, Toshiaki Takenaka
  • Patent number: 8156646
    Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: April 17, 2012
    Assignee: IBIDEN Co., Ltd.
    Inventors: Tsutomu Iwai, Yoshihiro Kodera, Shinya Maeda, Hiroyuki Watanabe, Kazunari Suzuki, Kiyotaka Tsukada
  • Patent number: 7943861
    Abstract: A composite layer composed of an Ni layer 72 and a Pd layer 73 is formed on a solder pad 77U, and a solder 76? on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by means of thermal stress.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: May 17, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Tsutomu Iwai, Yoshihiro Kodera, Shinya Maeda, Hiroyuki Watanabe, Kazunari Suzuki, Kiyotaka Tsukada
  • Publication number: 20090285980
    Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.
    Type: Application
    Filed: June 30, 2009
    Publication date: November 19, 2009
    Applicant: IBIDEN CO., LTD.
    Inventors: Tsutomu IWAI, Yoshihiro Kodera, Shinya Maeda, Hiroyuki Watanabe, Kazunari Suzuki, Kiyotaka Tsukada
  • Publication number: 20080264681
    Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.
    Type: Application
    Filed: March 15, 2005
    Publication date: October 30, 2008
    Applicant: IBIDEN CO., LTD.
    Inventors: Tsutomu Iwai, Yoshihiro Kodera, Shinya Maeda, Hiroyuki Watanabe, Kazunari Suzuki, Kiyotaka Tsukada