Abstract: A multi-nozzle device includes a nozzle body having a chamber into which fluid enters, a reference nozzle and a specific nozzle. The reference nozzle and the specific nozzle are each provided in the nozzle body. The inflow ends of the nozzles are communicated to the chamber. The outflow ends of the nozzles protrude from an end surface of the nozzle body. A length of the specific nozzle and a length of the reference nozzle differ from each other depending on the target discharge amount of the reference nozzle and the target discharge amount of the specific nozzle. An inner diameter of the specific nozzle and an inner diameters and of the reference nozzles and may be different from each other.

Abstract: A thermal management system includes refrigeration cycle equipment and a heating medium circuit. The heating medium circuit includes a high-temperature-side circuit connecting with the heating medium channel of the high-temperature-side water-refrigerant heat exchange portion, a low-temperature-side circuit connecting with a heating medium channel of a low-temperature-side water-refrigerant heat exchange portion, and a heat transfer portion connecting the high-temperature-side circuit and the low-temperature-side circuit. The low-temperature-side circuit includes a first heat exchange portion, a second heat exchange portion, a heating medium bypass channel, and a low-temperature-side circuit switching portion.

Abstract: Provided is an n-channel BiMOS semiconductor device having a trench gate structure, the n-channel BiMOS semiconductor device including: an n+ drain layer; a parallel pn layer including n? drift and p pillar layers joined alternately; a composite layer including a p base layer and an n+ source layer, the n+ drain layer, the parallel pn layer, and the composite layer being provided in order; a high-resistance layer provided between a portion of the p base layer above the p pillar layer and the n+ source layer; and a high-resistance layer provided between the p pillar layer and the p base layer, the p pillar layer having an impurity concentration lower than that of the n? drift layer.

Abstract: Provided is a heat exchanger, including a plurality of heat exchange members arranged in a first direction so as to be spaced apart from each other. Each of the plurality of heat exchange members includes: a heat transfer pipe extending in a second direction intersecting with the first direction; and a heat transfer plate provided to the heat transfer pipe along the second direction. The heat transfer plate includes extending portions extending away from the heat transfer pipe in a third direction intersecting with each of the first direction and the second direction. The heat transfer plate is formed separately from the heat transfer pipe.

Abstract: An objective of the present invention is to provide methods for facilitating antigen-binding molecule-mediated antigen uptake into cells, methods for facilitating the reduction of antigen concentration in plasma, methods for increasing the number of antigens to which a single antigen-binding molecule can bind, methods for improving pharmacokinetics of antigen-binding molecules, antigen-binding molecules improved for facilitated antigen uptake into cells, antigen-binding molecules capable of facilitating the reduction of antigen concentration in plasma, antigen-binding molecules capable of repeatedly binding to antigens, antigen-binding molecules with improved pharmacokinetics, pharmaceutical compositions comprising such an antigen-binding molecule, and methods for producing those described above.

Abstract: In a heat exchanger, each of a plurality of heat exchange members includes: a flat pipe; and a heat transfer plate integrated with the flat pipe along a longitudinal direction of the flat pipe. A width direction of each of the flat pipes intersects with a direction in which the plurality of heat exchange members are arranged side by side. Each of the heat transfer plates includes an extending portion extending outward in the width direction of each of the flat pipes from at least one of one end of a corresponding one of the flat pipes in the width direction and another end of the corresponding one of the flat pipes in the width direction. Each of the flat pipes has one or more flat pipe bent portions, each forming a groove extending along the longitudinal direction of the flat pipes.

Abstract: The present invention provides pharmaceutical compositions comprising second-generation molecules that are superior than TOCILIZUMAB, by altering the amino acid sequences of the variable and constant regions of TOCILIZUMAB, which is a humanized anti-IL-6 receptor IgG1 antibody, to enhance the antigen-neutralizing ability and increase the pharmacokinetics, so that the therapeutic effect is exerted with a less frequency of administration, and the immunogenicity, safety and physicochemical properties (stability and homogeneity) are improved. The present invention also provides methods for producing these pharmaceutical compositions. The present inventors have successfully generated second-generation molecules that are superior to TOCILIZUMAB by appropriately combining amino acid sequence alterations in the CDR domains, variable regions, and constant regions.

Abstract: A discharge container includes: a double-walled container body including an inner layer body and an outer layer body; a discharge cap having a discharge outlet, the discharge cap being attached to a mouth of the double-walled container body; and a check valve structure. The check valve structure has a tubular partition wall defining a flow path of the content and a valve body which is provided on the partition wall with a hinge portion and has a single swing structure, and space inside the partition wall rather on the discharge outlet side than on the valve body side serves as a liquid reservoir space where part of remaining content is stored after the discharge of the content.

Abstract: A discharge container includes: a double-walled container body including an inner layer body and an outer layer body; a discharge cap having a discharge outlet, the discharge cap being attached to a mouth of the double-walled container body; and a check valve structure. The check valve structure has a tubular partition wall defining a flow path of the content and a valve body which is provided on the partition wall with a hinge portion and has a single swing structure, and space inside the partition wall rather on the discharge outlet side than on the valve body side serves as a liquid reservoir space where part of remaining content is stored after the discharge of the content.

Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.

Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: A composite layer composed of an Ni layer 72 and a Pd layer 73 is formed on a solder pad 77U, and a solder 76? on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by means of thermal stress.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.