Abstract: According to one embodiment, an anomaly sign detection system comprising one or more computers configured to: calculate a correction value for correcting at least one actual process value from the at least one actual process value and at least one reference process value; determine whether each of plurality of actual process values is correlated with the at least one reference process value or not, based on correction-necessity coefficient of determination; use the correction value for correcting at least one actual process value determined to be correlated with the at least one reference process value among the plurality of actual process values; generate learning input data including at least one corrected process value as the at least one actual process value corrected by the correction value; and perform machine learning by inputting the learning input data to anomaly sign detection model.

Abstract: A hydrogen production system according to an embodiment includes an evaporator that evaporates seawater to generate water vapor, an electrolytic device that electrolyzes the water vapor supplied from the evaporator to produce hydrogen, and a removal mechanism that is provided between the evaporator and the electrolytic device and removes a seawater component from the water vapor.

Abstract: A microcomputer calculates the concentration of ammonia contained in exhaust gas. The microcomputer repeatedly obtains from a first ammonia detection section a first ammonia electromotive force EMF1 whose value changes with both the concentrations of ammonia and a flammable gas contained in the exhaust gas. The microcomputer outputs, as ammonia concentration information at the present point in time, ammonia concentration information representing the ammonia concentration at the point 0.5 sec prior to the present point in time. The microcomputer sets a rich spike flag Fs when a first ammonia electromotive force change amount ?EMF1 is smaller than a value obtained by multiplying a start determination value by ?1. When the rich spike flag Fs is set, the microcomputer sets the ammonia concentration information at the present point in time to the value of the ammonia concentration information at the point immediately before the rich spike flag Fs is set.

Abstract: A gas sensor is provided with a metal shell protecting member formed of a material superior in heat resistance to a metal shell, whereby a high-temperature measurement target (exhaust gas) is prevented from being in direct contact with a region, of a protector internal region of the metal shell, on the front side relative to a protector opposing surface. That is, in the gas sensor, it is possible to suppress corrosion, due to high temperature, of a region, of the protector internal region of the metal shell, on the front side relative to the protector opposing surface (an inner surface and a front end surface of a protector fixing portion), while the metal shell is formed of a material (SUS430) that can be subjected to working (crimping or the like) accompanied with deformation. Therefore, heat resistance of the entire sensor can be improved.

Abstract: A microcomputer calculates the concentration of ammonia contained in exhaust gas. The microcomputer repeatedly obtains from a first ammonia detection section a first ammonia electromotive force EMF1 whose value changes with both the concentrations of ammonia and a flammable gas contained in the exhaust gas. The microcomputer outputs, as ammonia concentration information at the present point in time, ammonia concentration information representing the ammonia concentration at the point 0.5 sec prior to the present point in time. The microcomputer sets a rich spike flag Fs when a first ammonia electromotive force change amount ?EMF1 is smaller than a value obtained by multiplying a start determination value by ?1. When the rich spike flag Fs is set, the microcomputer sets the ammonia concentration information at the present point in time to the value of the ammonia concentration information at the point immediately before the rich spike flag Fs is set.

Abstract: A treatment method for a used ion exchange resin, includes: bringing a used ion exchange resin into contact with a reaction solution, the used ion exchange resin having an ion exchange group with at least a radionuclide or a heavy metal element adsorbed thereon, and the reaction solution containing an iron compound, hydrogen peroxide, and ozone; separating at least a part of the reaction solution in contact with the used ion exchange resin from the used ion exchange resin; and decomposing an organic component contained in the reaction solution separated from the used ion exchange resin.

Abstract: A gas sensor is provided with a metal shell protecting member formed of a material superior in heat resistance to a metal shell, whereby a high-temperature measurement target (exhaust gas) is prevented from being in direct contact with a region, of a protector internal region of the metal shell, on the front side relative to a protector opposing surface. That is, in the gas sensor, it is possible to suppress corrosion, due to high temperature, of a region, of the protector internal region of the metal shell, on the front side relative to the protector opposing surface (an inner surface and a front end surface of a protector fixing portion), while the metal shell is formed of a material (SUS430) that can be subjected to working (crimping or the like) accompanied with deformation. Therefore, heat resistance of the entire sensor can be improved.

Abstract: A treatment method for a used ion exchange resin, includes: bringing a used ion exchange resin into contact with a reaction solution, the used ion exchange resin having an ion exchange group with at least a radionuclide or a heavy metal element adsorbed thereon, and the reaction solution containing an iron compound, hydrogen peroxide, and ozone; separating at least a part of the reaction solution in contact with the used ion exchange resin from the used ion exchange resin; and decomposing an organic component contained in the reaction solution separated from the used ion exchange resin.

Abstract: Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

Abstract: A protection circuit comprises first and second input terminals to which a power source voltage for a protected load circuit can be applied. A first transistor connected between the input terminals. The first transistor has a gate/base electrode connected to a current path electrode through a resistor. A low-pass filter is connected in parallel with the first transistor between the input terminals. A second transistor connected in parallel with the resistor, and having a control electrode connected to an output terminal of the low-pass filter. Zener diodes may be optionally included to provide overvoltage protection. In some embodiments, the low-pass filter may comprise a series-connected resistor and capacitor.

Abstract: Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

Abstract: A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surface (12) side, the projected area of the mounting area (32) is larger than the projected area of the plate-shaped component (101) and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (23), and wherein a value of the coefficient of thermal expansion (CTE ?2) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.

Abstract: In a display device, method or program, a list is scrolled. In response to a selection of a list item included in the list, a prior scroll direction that is the direction in which the list is scrolled immediately before the selection of the list item is acquired. Based on the prior scroll direction, a display mode of a list item frame that displays list item information related to the selected list item is set. The list item frame in displayed in the set display mode.

Abstract: Navigation apparatuses, methods, and programs set a reference point at an intersection and set a region extending ahead of the vehicle in a direction in which the vehicle enters the intersection, the region including the reference point. Then, the apparatuses, methods, and programs obtain 3D map data of the region, generate a 3D movie which has a predetermined viewpoint on the basis of the obtained 3D map data, and display the generated 3D movie.

Abstract: Navigation apparatuses, methods, and programs set a first reference point on a driving route, set a second reference point on the driving route, the second reference point being prior to the first reference point along the driving route, and set a third reference point on the driving route, the third reference point being after the first reference point along the driving route. The apparatuses, methods, and programs set a triangular area having vertices corresponding to the first reference point, the second reference point, and the third reference point and obtain three-dimensional map data around the triangular area. The apparatuses, methods, and programs set a predetermined translucent ratio for a structure included in the triangular area. The apparatuses, methods, and programs generate a moving three-dimensional image which displays the driving route overlapped with the structure set with the predetermined translucent ratio and display the generated three-dimensional motion-image.

Abstract: Navigation apparatuses, methods, and programs set a reference point on a route, set at least one point on the route on the basis of the reference point, and set a region along the route, the region being set on the basis of the set at least one point and the region including the at least one point. The navigation apparatuses, methods, and programs obtain 3D map data corresponding to the region, generate a 3D movie which has a predetermined viewpoint on the basis of the obtained 3D map data, and display the generated 3D movie.

Abstract: A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface activation step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface activation step, a surface of the resin layer is activated by means of plasma treatment, after the fixing step but before the insulation layer formation step.

Abstract: A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface modification step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface modification step, a surface of the resin layer is modified, after the fixing step but before the insulation layer formation step.

Abstract: A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surface (12) side, the projected area of the mounting area (32) is larger than the projected area of the plate-shaped component (101) and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (23), and wherein a value of the coefficient of thermal expansion (CTE ?2) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.

Abstract: A three-dimensional map display navigation device includes a map database having a road database that stores road data and a stereograph database that stores stereographic data of a solid body; a route information storage portion for storing route information pertaining to a guidance route set based on the road data; a stereographic data reading unit for accessing the map database, computing a discrete distance between the guidance route and the solid body, and selectively transferring stereographic data pertaining to the solid body that has been simplified depending on the discrete distance to a buffer portion; and a map image generating unit for generating a three-dimensional map image for route guidance based on the stereographic data loaded from the buffer portion.