Patents by Inventor Shinya MORIMINE

Shinya MORIMINE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11740035
    Abstract: A cooling device has a heat receiving unit that has a space therein, liquid phase piping that supplies liquid phase refrigerant to the heat receiving unit, gas phase piping that discharges gas phase refrigerant from the heat receiving unit, and spacers that are disposed inside the heat receiving unit. The spacers have a higher specific gravity than the liquid phase refrigerant. The spacers have a shape allowing movement along the bottom face of the heat receiving unit. When the heat receiving unit tilts, the spacers move to the low side of the heat receiving unit. The spacers gather on the bottom face of the heat receiving unit on the low side. The liquid phase refrigerant spreads to the high side of the heat receiving unit by an amount equivalent to the volume removed due to the spacers, and uniform cooling can be performed.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: August 29, 2023
    Assignee: NEC Platforms, Ltd.
    Inventor: Shinya Morimine
  • Publication number: 20220057149
    Abstract: A cooling device has a heat receiving unit that has a space therein, liquid phase piping that supplies liquid phase refrigerant to the heat receiving unit, gas phase piping that discharges gas phase refrigerant from the heat receiving unit, and spacers that are disposed inside the heat receiving unit. The spacers have a higher specific gravity than the liquid phase refrigerant. The spacers have a shape allowing movement along the bottom face of the heat receiving unit. When the heat receiving unit tilts, the spacers move to the low side of the heat receiving unit. The spacers gather on the bottom face of the heat receiving unit on the low side. The liquid phase refrigerant spreads to the high side of the heat receiving unit by an amount equivalent to the volume removed due to the spacers, and uniform cooling can be performed.
    Type: Application
    Filed: December 19, 2019
    Publication date: February 24, 2022
    Applicant: NEC Platforms, Ltd.
    Inventor: Shinya MORIMINE